Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
141 words
A semiconductor device comprising an n-channel and a p-channel field effect transistor on a substrate, wherein the n-channel field effect transistor includes: a first silicon layer formed on a substrate; a first SiGeC layer in which an n-channel is formed, and which is formed on the first silicon layer, contains carbon and germanium and has received a tensile strain from the first silicon layer; and a gate electrode formed over the first SiGeC layer, the p-channel field effect transistor including: a second silicon layer formed on a substrate; a second SiGeC layer in which a p-channel is formed, and which is formed on the second silicon layer, contains carbon and germanium and has received a tensile strain from the second silicon layer; and a gate electrode formed over the second SiGeC layer, wherein the semiconductor device functions as a complementary device.
Claim 2
Dependent Claim
141 words
A semiconductor device comprising an n-channel and a p-channel field effect transistor on a substrate, wherein the n-channel field effect transistor includes: a first silicon layer formed on a substrate; a first SiGeC layer in which an n-channel is formed, and which is formed on the first silicon layer, contains carbon and germanium and has received a tensile strain from the first silicon layer; and a gate electrode formed over the first SiGeC layer, the p-channel field effect transistor including: a second silicon layer formed on a substrate; a second SiGeC layer in which a p-channel is formed, and which is formed on the second silicon layer, contains carbon and germanium and has received a tensile strain from the second silicon layer; and a gate electrode formed over the second SiGeC layer, wherein the semiconductor device functions as a complementary device.
Claim 3
Dependent Claim
46 words
The semiconductor device of claim 1 , wherein electrons are confined by a heterobarrier formed between the first silicon layer and the first SiGeC layer of the n-channel field effect transistor; and holes are confined in the second SiGeC layer of the p-channel field effect transistor.
Claim 4
Dependent Claim
62 words
The semiconductor device of claim 1 , further comprising a heavily doped layer which is formed in the first silicon layer in the vicinity of the first SiGeC layer and contains a high-concentration n-type dopant; and a heavily doped layer which is formed in the second silicon layer in the vicinity of the second SiGeC layer and contains a high-concentration p-type dopant.
Claim 5
Dependent Claim
16 words
The semiconductor device of claim 2 , wherein the first SiGeC layer is a quantum well.
Claim 6
Dependent Claim
117 words
The semiconductor device of claim 1 , further comprising a third silicon layer which is formed on the first SiGeC layer and under the gate electrode and applies a tensile strain to the first SiGeC layer; and a fourth silicon layer which is formed on the second SiGeC layer and under the gate electrode and applies a tensile strain to the second SiGeC layer, wherein electrons are confined in the first SiGeC layer by a heterobarrier formed in a boundary between the first SiGeC layer and the third silicon layer, and wherein holes are confined in the second SiGeC layer by a heterobarrier formed in a boundary between the second SiGeC layer and the fourth silicon layer.
Claim 7
Dependent Claim
62 words
The semiconductor device of claim 1 , further comprising a heavily doped layer which is formed in the third silicon layer in the vicinity of the first SiGeC layer and contains a high-concentration n-type dopant; and a heavily doped layer which is formed in the fourth silicon layer in the vicinity of the second SiGeC layer and contains a high-concentration p-type dopant.
Claim 8
Dependent Claim
29 words
The semiconductor device of claim 1 , further comprising a gate insulating film formed under an n-gate electrode and a second gate insulating film formed under a p-gate electrode.
Claim 9
Dependent Claim
35 words
The semiconductor device of claim 1 , wherein the thickness of the first SiGeC layer is smaller than a critical thickness which is determined by the composition of carbon and above which dislocations are generated.