US6469370B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and method of production of the semiconductor device
Assignee: Fujitsu Ltd
•
Filing: 2000-02-01
•
Granted: 2002-10-22
•
Expires: 2020-02-01
Abstract
Abstract In a semiconductor device of the present invention and a production method thereof, an electronic circuit is provided in a semiconductor substrate, the electronic circuit having terminals. An internal wiring pattern is provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals. A protective layer is provided on the substrate, the protective layer covering the substrate. Vias are provided on the substrate so as to project from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate. An external wiring pattern is provided on the protective layer, the external wiring pattern being connected to the vias. Projection electrodes are connected to the external wiring pattern, the projection electrodes having a predetermined height above the external wiring pattern. An enclosure layer of a resin material is provided on the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Inventors
- 👤 Toshimi Kawahara
- 👤 Hirohisa Matsuki
- 👤 Yasuhiro Shinma
- 👤 Yoshiyuki Yoneda
- 👤 Norio Fukasawa
- 👤 Yuzo Hamanaka
- 👤 Kenichi Nagashige
- 👤 Takashi Hozumi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:15
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W90/00; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/075; H10W72/20; H10W72/241; H10W72/244; H10W72/251; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/59; H10W72/851; H10W72/853; H10W72/859; H10W72/874; H10W72/884; H10W72/921; H10W72/922; H10W72/941; H10W72/942; H10W72/951; H10W90/20; H10W90/22; H10W90/701; H10W90/721; H10W90/722; H10W90/724; H10W90/751; H10W90/752; H10W90/754
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
192 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 2
Dependent Claim
192 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 3
Dependent Claim
28 words
The semiconductor device of claim 1 , further comprising bumps provided on the projection electrodes, the bumps being connected to the external wiring pattern through the projection electrodes.
Claim 4
Dependent Claim
44 words
The semiconductor device of claim 1 , wherein the enclosure layer includes a first side surface and the substrate includes a second side surface, the first side surface and the second side surface being formed as a common plane produced by a dicing saw.
Claim 5
Dependent Claim
57 words
The semiconductor device of claim 1 , wherein the electronic circuit, provided in the substrate, includes as input transistor and an output transistor, the input transistor having an input terminal, the output transistor having an output terminal, and said vias being connected through the internal wiring pattern to one of the input terminal and the output terminal.
Claim 6
Dependent Claim
18 words
The semiconductor device of claim 1 , wherein the enclosure layer is made of a compression molded resin.
Claim 7
Dependent Claim
24 words
The semiconductor device of claim 1 , wherein the external wiring pattern is configured with straight-line connections between the vias and the projection electrodes.
Claim 8
Dependent Claim
56 words
The semiconductor device of claim 1 , wherein each of the vias has a connecting portion at which the via is connected to one of the projection electrodes through the external wiring pattern, the vias having a diameter at the connecting portion that is equal to or smaller than a width of the external wiring pattern.
Claim 9
Dependent Claim
138 words
A semiconductor device comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; lead wires connected to the external wiring pattern, the lead wires being supported by a tape; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering portions of the lead wires and external surfaces of the external wiring pattern.
Claim 10
Dependent Claim
138 words
A semiconductor device comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; lead wires connected to the external wiring pattern, the lead wires being supported by a tape; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering portions of the lead wires and external surfaces of the external wiring pattern.
Claim 11
Dependent Claim
231 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and bonded onto the first semiconductor device by an adhesive agent, the first semiconductor device comprising: a first substrate having a first surface and peripheral portions on the first surface; a first electronic circuit provided in the first substrate, the first electronic circuit having terminals; and pads provided at the peripheral portions of the first substrate, the pads being connected to the first electronic circuit terminals, and the second semiconductor device comprising: a second substrate; a second electronic circuit provided in the second substrate, the second electronic circuit having terminals; an internal wiring pattern provided in the second substrate, the internal wiring pattern being connected to the second electronic circuit terminals; a protective layer contacting the second substrate, the protective layer covering the second substrate; vias provided on the second substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the second substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the second electronic circuit terminals, and the external wiring pattern being connected to the pads of the first semiconductor device by wires.
Claim 12
Dependent Claim
231 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and bonded onto the first semiconductor device by an adhesive agent, the first semiconductor device comprising: a first substrate having a first surface and peripheral portions on the first surface; a first electronic circuit provided in the first substrate, the first electronic circuit having terminals; and pads provided at the peripheral portions of the first substrate, the pads being connected to the first electronic circuit terminals, and the second semiconductor device comprising: a second substrate; a second electronic circuit provided in the second substrate, the second electronic circuit having terminals; an internal wiring pattern provided in the second substrate, the internal wiring pattern being connected to the second electronic circuit terminals; a protective layer contacting the second substrate, the protective layer covering the second substrate; vias provided on the second substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the second substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the second electronic circuit terminals, and the external wiring pattern being connected to the pads of the first semiconductor device by wires.
Claim 13
Dependent Claim
204 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and mounted on the first semiconductor device so that electronic-circuit surfaces of the first and second semiconductor devices match with each other and electronic circuits of the first and second semiconductor devices are interconnected by bumps, each of the first and second semiconductor devices comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern being connected to the bumps, wherein the external wiring patterns of the first and second semiconductor devices are interconnected by the bumps.
Claim 14
Dependent Claim
204 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and mounted on the first semiconductor device so that electronic-circuit surfaces of the first and second semiconductor devices match with each other and electronic circuits of the first and second semiconductor devices are interconnected by bumps, each of the first and second semiconductor devices comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern being connected to the bumps, wherein the external wiring patterns of the first and second semiconductor devices are interconnected by the bumps.
Claim 15
Dependent Claim
96 words
The semiconductor device of claim 10 , wherein the first semiconductor device includes: projection electrodes provided on the external wiring pattern of the first semiconductor device where the second semiconductor device is not mounted, the projection electrodes being connected to said external wiring pattern, the projection electrodes having a predetermined height above said external wiring pattern; and an enclosure layer of a resin material provided on the protective layer of the first semiconductor device, the enclosure layer covering sides of the projection electrodes and external surfaces of said external wiring pattern of the first semiconductor device.
Claim 16
Dependent Claim
156 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern including wire-bonding portions which are connected to pads of a printed wiring board by bonding wires.
Claim 17
Dependent Claim
156 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at arbitrary positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern including wire-bonding portions which are connected to pads of a printed wiring board by bonding wires.
Claim 18
Dependent Claim
186 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the electronic circuit terminals at arbitrary positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern having a portion located above each of the vias, and the external wiring pattern being connected to the vias at said portions; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 19
Dependent Claim
186 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided on the substrate and projecting from the protective layer, the vias being connected to the electronic circuit terminals at arbitrary positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern having a portion located above each of the vias, and the external wiring pattern being connected to the vias at said portions; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 20
Dependent Claim
193 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 21
Dependent Claim
193 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 22
Dependent Claim
139 words
A semiconductor device comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; lead wires connected to the external wiring pattern, the lead wires being supported by a tape; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering portions of the lead wires and external surfaces of the external wiring pattern.
Claim 23
Dependent Claim
139 words
A semiconductor device comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias; lead wires connected to the external wiring pattern, the lead wires being supported by a tape; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering portions of the lead wires and external surfaces of the external wiring pattern.
Claim 24
Dependent Claim
232 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and bonded onto the first semiconductor device by an adhesive agent, the first semiconductor device comprising: a first substrate having a first surface and peripheral portions on the first surface; a first electronic circuit provided in the first substrate, the first electronic circuit having terminals; and pads provided at the peripheral portions of the first substrate, the pads being connected to the first electronic circuit terminals, and the second semiconductor device comprising: a second substrate; a second electronic circuit provided in the second substrate, the second electronic circuit having terminals; an internal wiring pattern provided in the second substrate, the internal wiring pattern being connected to the second electronic circuit terminals; a protective layer contacting the second substrate, the protective layer covering the second substrate; vias provided directly on the second substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the second substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the second electronic circuit terminals, and the external wiring pattern being connected to the pads of the first semiconductor device by wires.
Claim 25
Dependent Claim
232 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and bonded onto the first semiconductor device by an adhesive agent, the first semiconductor device comprising: a first substrate having a first surface and peripheral portions on the first surface; a first electronic circuit provided in the first substrate, the first electronic circuit having terminals; and pads provided at the peripheral portions of the first substrate, the pads being connected to the first electronic circuit terminals, and the second semiconductor device comprising: a second substrate; a second electronic circuit provided in the second substrate, the second electronic circuit having terminals; an internal wiring pattern provided in the second substrate, the internal wiring pattern being connected to the second electronic circuit terminals; a protective layer contacting the second substrate, the protective layer covering the second substrate; vias provided directly on the second substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the second substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the second electronic circuit terminals, and the external wiring pattern being connected to the pads of the first semiconductor device by wires.
Claim 26
Dependent Claim
206 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and mounted on the first semiconductor device so that electronic circuit surfaces of the first and second semiconductor devices match with each other and electronic circuits of the first and second semiconductor devices are interconnected by bumps, each of the first and second semiconductor devices comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern being connected to the bumps, wherein the external wiring patterns of the first and second semiconductor devices are interconnected by the bumps.
Claim 27
Dependent Claim
206 words
A semiconductor device including a first semiconductor device and a second semiconductor device, in which the second semiconductor device is smaller in one-directional length than the first semiconductor device and mounted on the first semiconductor device so that electronic circuit surfaces of the first and second semiconductor devices match with each other and electronic circuits of the first and second semiconductor devices are interconnected by bumps, each of the first and second semiconductor devices comprising: a semiconductor substrate; an electronic circuit provided in the substrate, the electronic circuit having terminals; an internal wiring pattern provided in the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern being connected to the bumps, wherein the external wiring patterns of the first and second semiconductor devices are interconnected by the bumps.
Claim 28
Dependent Claim
157 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern including wire-bonding portions which are connected to pads of a printed wiring board by bonding wires.
Claim 29
Dependent Claim
157 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; an internal wiring pattern provided on the first surface of the substrate, the internal wiring pattern being connected to the electronic circuit terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the internal wiring pattern at central positions on the substrate; and an external wiring pattern contacting the protective layer, the external wiring pattern being connected to the vias to establish connections between the external wiring pattern and the electronic circuit terminals, and the external wiring pattern including wire-bonding portions which are connected to pads of a printed wiring board by bonding wires.
Claim 30
Dependent Claim
187 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the electronic circuit terminals at central positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern having a portion located above each of the vias, and the external wiring pattern being connected to the vias at said portions; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
Claim 31
Dependent Claim
187 words
A semiconductor device comprising: a semiconductor substrate having a first surface and a second surface, said semiconductor substrate containing an integrated circuit device; an electronic circuit provided on the first surface of the substrate, the electronic circuit having terminals; a protective layer contacting the first surface of the substrate, the protective layer covering the substrate; vias provided directly on the substrate and projecting from the protective layer, the vias being connected to the electronic circuit terminals at central positions on the substrate; an external wiring pattern contacting the protective layer, the external wiring pattern having a portion located above each of the vias, and the external wiring pattern being connected to the vias at said portions; projection electrodes provided on the external wiring pattern, the projection electrodes being connected to the external wiring pattern to establish connections between the projection electrodes and the electronic circuit terminals, the projection electrodes having a predetermined height above the external wiring pattern; and an enclosure layer of a resin material contacting the protective layer, the enclosure layer covering sides of the projection electrodes and external surfaces of the external wiring pattern.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-10-21 | 2006-04-22 | 2006-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-10-21 | 2010-04-22 | 2010-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-10-21 | 2014-04-22 | 2014-10-22 | $7700.00 | Window Closed / Lapsed |