US6462957B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
High performance orthogonal interconnect architecture without midplane
Assignee: RPX Clearinghouse LLC
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Filing: 2000-12-20
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Granted: 2002-10-08
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Expires: 2020-12-20
Abstract
Abstract An improved electrical interconnection between a first circuit board and a second circuit board is provided. In one embodiment, the first circuit board has a substantially rigid circuit portion having a plurality of circuit layers, including a first signal layer, and a first interconnection portion, including the first signal layer, for mating with a second interconnection portion of the second circuit board. The first circuit board also includes a flexible portion, including the first signal layer, for connecting the substantially rigid circuit portion to the first interconnection portion. The flexible portion allows the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the first circuit board and the second circuit board.
Inventors
- 👤 Herman Kwong
- 👤 Bao Chau L. Nguyen
- 👤 Van C. Au
- 👤 Paul A. Senyshyn
- 👤 Martin R. Handforth
- 👤 Rolf G. Meier
- 👤 Delfin Y. Montuno
- 👤 Ernst A. Munter
- 👤 Hasler R. Hayes
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:12
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K7/00; H05K7/14; H05K7/1438; H05K7/1439; H05K7/1445; H05K1/0213; H05K1/0237; H05K1/0239
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
146 words
An improved electrical interconnection between a first circuit board and a second circuit board, the first circuit board having a substantially rigid circuit portion including a first signal layer, the first circuit board also having a first interconnection portion including the first signal layer, the second circuit board having a second interconnection portion for mating with the first interconnection portion, the improvement comprising: a flexible portion, including the first signal layer, formed in the first circuit board for connecting the substantially rigid circuit portion to the first interconnection portion, the flexible portion allowing the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the substantially rigid circuit portion of the first circuit board and the second circuit board.
Claim 2
Dependent Claim
146 words
An improved electrical interconnection between a first circuit board and a second circuit board, the first circuit board having a substantially rigid circuit portion including a first signal layer, the first circuit board also having a first interconnection portion including the first signal layer, the second circuit board having a second interconnection portion for mating with the first interconnection portion, the improvement comprising: a flexible portion, including the first signal layer, formed in the first circuit board for connecting the substantially rigid circuit portion to the first interconnection portion, the flexible portion allowing the first interconnection portion to be oriented substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the substantially rigid circuit portion of the first circuit board and the second circuit board.
Claim 3
Dependent Claim
25 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 1 , wherein the first interconnection portion is flexible.
Claim 4
Dependent Claim
25 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 1 , wherein the first interconnection portion is rigid.
Claim 5
Dependent Claim
34 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 1 , wherein mating is accomplished through a direct electrical connection between the first and second circuit boards.
Claim 6
Dependent Claim
50 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 4 , wherein the direct electrical connection is accomplished by a male connector connected to the first interconnection portion and a female connector connected to the second interconnection portion for receiving the male connector.
Claim 7
Dependent Claim
46 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 4 , wherein the direct electrical connection is accomplished by a female connector connected to the first interconnection portion for receiving a male connector connected to the second interconnection portion.
Claim 8
Dependent Claim
33 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 1 , wherein the mating between the first and second circuit boards is accomplished through electromagnetic coupling.
Claim 9
Dependent Claim
67 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 7 , wherein the first interconnection portion further comprises an electrically conductive shield for shielding the first signal layer, the first electrically conductive shield having a first opening formed therein so as to expose the first signal layer, the electromagnetic coupling comprises aligning the first opening with the second interconnection portion.
Claim 10
Dependent Claim
51 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 8 , further comprising at least one dielectric constant material disposed between the first interconnection portion and the second circuit board in the area where the first opening is aligned with the second interconnection portion.
Claim 11
Dependent Claim
41 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 1 , wherein the first and second circuit boards further comprise respective first and second power connector portions which connect to form a power bus.
Claim 12
Dependent Claim
33 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 10 , wherein the first and second power connector portions are connected through a direct electrical connection.
Claim 13
Dependent Claim
50 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 11 , wherein the direct electrical connection is accomplished by a male connector connected to the first interconnection portion and a female connector connected to the second interconnection portion for receiving the male connector.
Claim 14
Dependent Claim
46 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 11 , wherein the direct electrical connection is accomplished by a female connector connected to the first interconnection portion for receiving a male connector connected to the second interconnection portion.
Claim 15
Dependent Claim
31 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 11 , wherein the first and second power connector portions are connected through electro-magnetic coupling.
Claim 16
Dependent Claim
35 words
The improved electrical interconnection between a first circuit board and a second circuit board of claim 1 , wherein the first circuit board is a switch card and the second board is a port card.
Claim 17
Independent Claim
146 words
A method for electrically interconnecting a first circuit board to a second circuit board, the first circuit board having a substantially rigid circuit portion including a first signal layer, the first circuit board also having a first interconnection portion including the first signal layer, the second circuit board having a second interconnection portion for mating with the first interconnection portion, the improvement comprising; forming a flexible portion, including the first signal layer, in the first circuit board for connecting the substantially rigid circuit portion to the first interconnection portion, the flexible portion allowing the first interconnection portion to be orientated substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the substantially rigid circuit portion of the first circuit board and the second circuit board.
Claim 18
Independent Claim
146 words
A method for electrically interconnecting a first circuit board to a second circuit board, the first circuit board having a substantially rigid circuit portion including a first signal layer, the first circuit board also having a first interconnection portion including the first signal layer, the second circuit board having a second interconnection portion for mating with the first interconnection portion, the improvement comprising; forming a flexible portion, including the first signal layer, in the first circuit board for connecting the substantially rigid circuit portion to the first interconnection portion, the flexible portion allowing the first interconnection portion to be orientated substantially perpendicular to the substantially rigid circuit portion such that a mating of the first interconnection portion with the second interconnection portion results in a substantially orthogonal electrical interconnection arrangement between the substantially rigid circuit portion of the first circuit board and the second circuit board.
Claim 19
Dependent Claim
31 words
The method of claim 16 , wherein the method of claim 16 further comprises the step of positioning the first interconnection portion in a position substantially perpendicular to the rigid portion.
Claim 20
Dependent Claim
29 words
The method of claim 16 , wherein mating comprises inserting a male connector connected to the first interconnection portion into a female connector connected to the second interconnection portion.
Claim 21
Dependent Claim
29 words
The method of claim 16 , wherein mating comprises inserting a male connector connected to the second interconnection portion into a female connector connected to the first interconnection portion.
Claim 22
Dependent Claim
54 words
The method of claim 16 , wherein the first interconnection portion further comprises an electrically conductive shield for shielding the signal layer, the first electrically conductive shield having a first opening formed therein so as to expose the signal layer, further comprising the step of aligning the first opening with the second interconnection portion.
Claim 23
Dependent Claim
41 words
The method of claim 20 further comprising the step of: placing at least one dielectric constant material between the first interconnection portion and the second circuit board in the area where the first opening is aligned with the second interconnection portion.
Claim 24
Dependent Claim
24 words
The method of claim 16 , wherein the first circuit board is a switch card and the second circuit board is a port card.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-10-07 | 2006-04-08 | 2006-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-10-07 | 2010-04-08 | 2010-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-10-07 | 2014-04-08 | 2014-10-08 | $7700.00 | Window Closed / Lapsed |