Patent US6462412B2 successfully refreshed from Google Patents.
US6462412B2
Expired / Lapsed
US
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Foldable, flexible laminate type semiconductor apparatus with reinforcing and heat-radiating plates
Assignee: Sony Corp
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Filing: 2001-01-17
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Granted: 2002-10-08
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Expires: 2021-01-17
Abstract
Abstract A laminate-type semiconductor apparatus utilizing a flexible substrate being mounted with a plurality of semiconductor devices, in which the laminate-type semiconductor apparatus is free from incurring heat-radiation problem and has a fully leveled connection parts with sufficiently durable strength whereby distinctively compatible with high-density mounting thereof. More particularly, the present invention provides a laminate-type semiconductor apparatus which comprises a foldable flexible substrate mounted with a plurality of laminated semiconductor devices thereon, in which the foldable flexible substrate is folded so that plurality of semiconductor-device mounting areas of the substrate are mutually superposed whereby forming a laminate structure of semiconductor-device mounting areas thereon. An externally connected terminal disposing area disposed with a plurality of externally connected terminals is formed on one surface thereof. In addition, a reinforcing plate is secured to the side of the externally connected terminal disposing area via a material portion (adhesive agent) having stress relaxing function. Further, a heat-radiating plate is secured onto a surface on the opposite side from the externally connected terminal disposing area.
Inventors
- 👤 Shigeki Kamei
- 👤 Saeko Takagi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:50
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W70/611; H10W90/00; H10W90/401; H10W72/00; H10W72/60; H10W74/00; H10W74/10; H10W74/15; H10W90/20; H10W90/291; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
116 words
A laminate-type semiconductor apparatus comprising a foldable flexible substrate and a plurality of semiconductor devices mounted on said foldable flexible substrate, wherein: a plurality of semiconductor-device mounting areas of said foldable flexible substrate are laminated in layers via mutual superposition by way of folding said flexible substrate; an externally connected terminal disposing area on which a plurality of externally connected terminals are disposed is formed on one surface of said flexible substrate; a reinforcing plate is disposed on a side of said externally connected terminal disposing area via a material portion having stress relaxing function; and a heat-radiating plate disposed on a surface being opposite from said externally connected terminal disposing area of said flexible substrate.
Claim 2
Dependent Claim
116 words
A laminate-type semiconductor apparatus comprising a foldable flexible substrate and a plurality of semiconductor devices mounted on said foldable flexible substrate, wherein: a plurality of semiconductor-device mounting areas of said foldable flexible substrate are laminated in layers via mutual superposition by way of folding said flexible substrate; an externally connected terminal disposing area on which a plurality of externally connected terminals are disposed is formed on one surface of said flexible substrate; a reinforcing plate is disposed on a side of said externally connected terminal disposing area via a material portion having stress relaxing function; and a heat-radiating plate disposed on a surface being opposite from said externally connected terminal disposing area of said flexible substrate.
Claim 3
Dependent Claim
17 words
The laminate-type semiconductor apparatus according to claim 1 , wherein said reinforcing plate is a metallic plate.
Claim 4
Dependent Claim
25 words
The laminate-type semiconductor apparatus according to claim 1 , wherein said material portion having stress relaxing function is an adhesive agent having stress relaxing function.
Claim 5
Dependent Claim
21 words
The laminate-type semiconductor apparatus according to claim 3 wherein said reinforcing plate is adhered to said substrate by said adhesive agent.
Claim 6
Dependent Claim
22 words
The laminate-type semiconductor apparatus according to claim 1 , wherein said material portion having stress relaxing function is a gelled adhesive agent.
Claim 7
Dependent Claim
22 words
The laminate-type semiconductor apparatus according to claim 5 wherein said reinforcing plate is adhered to said substrate by said gelled adhesive agent.
Claim 8
Dependent Claim
17 words
The laminate-type semiconductor apparatus according to claim 1 , wherein said flexible substrate is a polyimide substrate.
Claim 9
Dependent Claim
25 words
The laminate-type semiconductor apparatus according to claim 1 wherein said heat-radiating plate is bonded to said substrate with an adhesive agent having satisfactory thermal conductivity.
Claim 10
Dependent Claim
126 words
A laminate-type semiconductor apparatus comprising a foldable flexible substrate and a plurality of semiconductor devices mounted on said foldable flexible substrate, wherein: a plurality of semiconductor-device mounting areas of said foldable flexible substrate are laminated in layers via mutual superposition by way of folding said flexible substrate; an externally connected terminal disposing area on which a plurality of externally connected terminals are disposed is formed on one surface of said flexible substrate; means for adhering a reinforcing plate on a side of said externally connected terminal disposing area with means for providing a stress relaxing function; and a heat-radiating plate disposed on a surface being opposite from said externally connected terminal disposing area of said flexible substrate with an adhesive agent having a suitable thermal conductivity.
Claim 11
Dependent Claim
126 words
A laminate-type semiconductor apparatus comprising a foldable flexible substrate and a plurality of semiconductor devices mounted on said foldable flexible substrate, wherein: a plurality of semiconductor-device mounting areas of said foldable flexible substrate are laminated in layers via mutual superposition by way of folding said flexible substrate; an externally connected terminal disposing area on which a plurality of externally connected terminals are disposed is formed on one surface of said flexible substrate; means for adhering a reinforcing plate on a side of said externally connected terminal disposing area with means for providing a stress relaxing function; and a heat-radiating plate disposed on a surface being opposite from said externally connected terminal disposing area of said flexible substrate with an adhesive agent having a suitable thermal conductivity.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-10-07 | 2006-04-08 | 2006-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-10-07 | 2010-04-08 | 2010-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-10-07 | 2014-04-08 | 2014-10-08 | $7700.00 | Window Closed / Lapsed |