US6455922B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Deformation-absorbing leadframe for semiconductor devices
Assignee: Texas Instruments Inc
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Filing: 2000-06-21
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Granted: 2002-09-24
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Expires: 2020-06-21
Abstract
Abstract A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member having at least one portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.
Inventors
- 👤 Ronaldo M. Arguelles
- 👤 Reynante T. Alvarado
- 👤 Leonardo S. Rimpillo, Jr.
- 👤 Teddy D. Weygan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 08:59
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/433
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
80 words
A metal leadframe and associated structure for use in combination with an integrated circuit chip, comprising: a chip mount pad having an area smaller than said chip intended for mounting; and a plurality of pad support members, each attached to the perimeter of said pad and to said leadframe; each of said support members having at least one metal portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support members.
Claim 2
Dependent Claim
80 words
A metal leadframe and associated structure for use in combination with an integrated circuit chip, comprising: a chip mount pad having an area smaller than said chip intended for mounting; and a plurality of pad support members, each attached to the perimeter of said pad and to said leadframe; each of said support members having at least one metal portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support members.
Claim 3
Dependent Claim
35 words
The leadframe and associated structure according to claim 1 further having a support member portion located outside the perimeter of said chip, configured in a geometry to absorb thermally induced deformations of said support member.
Claim 4
Dependent Claim
21 words
The leadframe and associated structure according to claim 1 having a thickness in the range from about 100 to 300 μm.
Claim 5
Dependent Claim
28 words
The leadframe and associated structure according to claim 3 comprising a metal or alloy selected from group consisting of copper, copper alloy, brass, aluminum, iron-nickel alloy, and invar.
Claim 6
Dependent Claim
20 words
The leadframe and associated structure according to claim 1 wherein said at least one metal portion has a meandering geometry.
Claim 7
Dependent Claim
19 words
The leadframe and associated structure according to claim 1 wherein said at least one metal portion has sinusoidal geometry.
Claim 8
Dependent Claim
19 words
The leadframe and associated structure according to claim 1 wherein said support member can accommodate a plurality of bendings.
Claim 9
Dependent Claim
79 words
A semiconductor device comprising: a metal leadframe and a chip mount pad; an integrated circuit chip mounted on pad, said pad having an area smaller than said chip, and a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; each of said support members having at least one metal portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.
Claim 10
Dependent Claim
79 words
A semiconductor device comprising: a metal leadframe and a chip mount pad; an integrated circuit chip mounted on pad, said pad having an area smaller than said chip, and a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; each of said support members having at least one metal portion located within the perimeter of said chip in a configuration operable to absorb thermally induced deformations of said support member.
Claim 11
Dependent Claim
17 words
A device as in claim 8 wherein said at least one metal portion has a meandering geometry.
Claim 12
Dependent Claim
17 words
A device as in claim 8 wherein said at least one metal potion has a sinusoidal geometry.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-09-23 | 2006-03-25 | 2006-09-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-09-23 | 2010-03-25 | 2010-09-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-09-23 | 2014-03-25 | 2014-09-24 | $7700.00 | Window Closed / Lapsed |