Patent US6452804B1 successfully refreshed from Google Patents.
US6452804B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
Assignee: Molex LLC
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Filing: 2001-03-08
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Granted: 2002-09-17
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Expires: 2021-03-08
Abstract
Abstract A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
Inventors
- 👤 II Joseph T. DiBene
- 👤 David H. Hartke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:56
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1092; G; G06; G06F; G06F1/00; G06F1/16; G06F1/18; G06F1/181; G06F1/182; G06F1/189; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H01R4/00; H01R4/58; H01R4/64; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/144; H05K3/00; H05K3/36; H05K3/368; H10; H10W; H10W40/00; H10W40/70; H10W40/73; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K1/0213; H05K1/0263; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/1031; H05K2201/10318; H05K2201/10325; H05K2201/10431; H05K2201/10598; H05K2201/10613; H05K2201/10621; H05K2201/10704; H05K2201/10734; H05K2201/20; H05K2201/2018; H05K2201/2036; H05K3/30; H05K3/301; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
126 words
A stack up assembly, comprising: a voltage regulation module ((VRM) circuit board having a first side and a second side; a thermally conductive plate having a first side and a second side, wherein the thermally conducive plate first side is disposed on and thermally coupled to the second side of the VRM circuit board and a microprocessor, having a first side and a second side, the microprocessor first side disposed on and thermally coupled to the thermally conductive plate second side; a socket, physically coupled to the second side of the microprocessor, the socket having a plurality of pins electrically coupled to the microprocessor; and an interposer circuit board, electrically coupled to the pins and coupled between the socket and the second side of the microprocessor.
Claim 2
Dependent Claim
126 words
A stack up assembly, comprising: a voltage regulation module ((VRM) circuit board having a first side and a second side; a thermally conductive plate having a first side and a second side, wherein the thermally conducive plate first side is disposed on and thermally coupled to the second side of the VRM circuit board and a microprocessor, having a first side and a second side, the microprocessor first side disposed on and thermally coupled to the thermally conductive plate second side; a socket, physically coupled to the second side of the microprocessor, the socket having a plurality of pins electrically coupled to the microprocessor; and an interposer circuit board, electrically coupled to the pins and coupled between the socket and the second side of the microprocessor.
Claim 3
Dependent Claim
17 words
The stack up assembly of claim 1 , wherein the thermally conductive plate is a vapor plate.
Claim 4
Dependent Claim
25 words
The stack up assembly of claim 1 , wherein the microprocessor is electrically coupled to the interposer circuit board by an organic land grid array.
Claim 5
Dependent Claim
17 words
The stack up assembly of claim 1 , wherein the socket is electrically coupled to a motherboard.
Claim 6
Dependent Claim
20 words
The stack up assembly of claim 1 , wherein the first side of the microprocessor faces in a downward direction.
Claim 7
Dependent Claim
21 words
The stack up assembly of claim 4 , wherein the vapor plate is thermally coupled to a plate via thermal standoffs.
Claim 8
Dependent Claim
21 words
The stack up assembly of claim 1 , wherein the VRM circuit board includes electrical components mounted on the first side.
Claim 9
Dependent Claim
23 words
The stack up assembly of claim 1 , further comprising a thermally conductive material displaced between the microprocessor and the thermally conductive plate.
Claim 10
Dependent Claim
39 words
The stack up assembly of claim 1 , further comprising: at least one power transmitting mechanical standoff, disposed between the VRM circuit board and the interposer board, providing electrical continuity between the VRM circuit board and the interposer board.
Claim 11
Dependent Claim
75 words
The stack up assembly of claim 9 , wherein: the interposer circuit board includes a power plane and a ground plane; the VRM board includes a power plane and a ground plane; the power transmitting mechanical standoff includes a first portion electrically coupling the interposer power plane and the VRM power plane; and a second portion, coaxial disposed in relation to the first portion electrically coupling the interposer ground plane and the VRM power plane.
Claim 12
Dependent Claim
66 words
The stack up assembly of claim 10 , further comprising: a second VRM circuit board having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the second VRM circuit board; a second microprocessor, having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
Claim 13
Dependent Claim
31 words
The stack up assembly of claim 11 , further comprising a frame, substantially surrounding the first VRM circuit board, the second VRM circuit board, the first microprocessor and the second microprocessor.
Claim 14
Dependent Claim
19 words
The stack up assembly of claim 12 , wherein the frame is electrically and mechanically coupled to a motherboard.
Claim 15
Dependent Claim
38 words
The stack up assembly of claim 13 , wherein the frame is further electrically and mechanically coupled to a plate, wherein the frame, plate, and motherboard, thus form a three dimensional electrically grounded structure substantially containing electromagnetic interference.
Claim 16
Dependent Claim
18 words
The stack up assembly of claim 14 , wherein the thermally conductive plate extends external to the frame.
Claim 17
Dependent Claim
20 words
The stack up assembly of claim 15 , further comprising a heat exchanger thermally coupled to the thermally conductive plate.
Claim 18
Dependent Claim
20 words
The stack up assembly of claim 16 , wherein the heat exchanger is mechanically bonded to the thermally conductive plate.
Claim 19
Dependent Claim
19 words
The stack up assembly of claim 17 , wherein the heat exchanger is brazed to the thermally conductive plate.
Claim 20
Dependent Claim
19 words
The stack up assembly of claim 17 , wherein the heat exchanger is soldered to the thermally conductive plate.
Claim 21
Dependent Claim
25 words
The stack up assembly of claim 17 , wherein the heat exchanger is thermally coupled to the thermally conductive plate by a thermally conductive polymer.
References Cited (Backward Citations)
US5734555A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-09-16 | 2006-03-18 | 2006-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-09-16 | 2010-03-18 | 2010-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-09-16 | 2014-03-18 | 2014-09-17 | $7700.00 | Window Closed / Lapsed |