Patent US6447888B2 successfully refreshed from Google Patents.
US6447888B2
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US
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Ceramic wiring board
Assignee: Kyocera Corp
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Filing: 2001-01-30
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Granted: 2002-09-10
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Expires: 2021-01-30
Abstract
Abstract A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constants wherein the ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of the crystal phase, and has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8x10-6/° C. and a specific inductive capacity at 1 MHz of not smaller than 10. The wiring board contains a capacitor and is very useful in realizing various electric circuit devices in small sizes, and can be further reliably mounted on a printed board that uses an organic resin as an insulating material.
Inventors
- 👤 Shinichi Suzuki
- 👤 Kenichi Nagae
- 👤 Yoshihiro Nakao
- 👤 Masanari Kokubu
- 👤 Masahiko Higashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:37
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/16; H05K1/162; C; C04; C04B; C04B35/00; C04B35/01; C04B35/46; C04B35/462; C04B35/50; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/69; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/0929; H05K2201/09309; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
94 words
A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constant wherein said ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of said crystal phase, and the ceramic sintered product has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10 −6 /° C., a specific inductive capacity at 1 MHz of not smaller than 10, and a porosity of not more than 0.5%.
Claim 2
Dependent Claim
94 words
A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constant wherein said ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of said crystal phase, and the ceramic sintered product has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10 −6 /° C., a specific inductive capacity at 1 MHz of not smaller than 10, and a porosity of not more than 0.5%.
Claim 3
Dependent Claim
34 words
A ceramic wiring board according to claim 1 , wherein said lanthanum titanate is expressed by the following formula, La 2 O 3 .x TiO 2 wherein x is a mol fraction satisfying 2≦x≦5.
Claim 4
Dependent Claim
28 words
A ceramic wiring board according to claim 1 , wherein said ceramic sintered product contains not leas than 10% by weight of a crystal phase of lanthanum titanate.
Claim 5
Dependent Claim
30 words
A ceramic wiring board according to claim 1 , wherein said ceramic sintered product contains a crystal phase of a composite oxide that contains Ti and an alkaline earth metal.
Claim 6
Dependent Claim
39 words
A ceramic wiring board to claim 4 , wherein said ceramic sintered product contains zirconium as a solid solution in said glass phase and/or in the crystal phase of the composite oxide containing Ti and the alkaline earth metal.
Claim 7
Dependent Claim
30 words
A ceramic wiring board according to claim 1 , wherein said ceramic sintered product contains a crystal phase of a composite oxide that contains Si and an alkaline earth metal.
Claim 8
Dependent Claim
129 words
A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constant, wherein said ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of said crystal phase, and the ceramic sintered product has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10 −6 /° C., a specific inductive capacity at 1 MHz of not smaller than 10, and a porosity of not more than 0.5%, and wherein said ceramic sintered product is obtained by firing 35 to 70% by weight of a glass component and 30 to 65% by weight of a filler component that contains at least lanthanum titanate.
Claim 9
Dependent Claim
129 words
A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constant, wherein said ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of said crystal phase, and the ceramic sintered product has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10 −6 /° C., a specific inductive capacity at 1 MHz of not smaller than 10, and a porosity of not more than 0.5%, and wherein said ceramic sintered product is obtained by firing 35 to 70% by weight of a glass component and 30 to 65% by weight of a filler component that contains at least lanthanum titanate.
Claim 10
Dependent Claim
31 words
A ceramic wiring board according to claim 7 , wherein said glass component has a coefficient of thermal expansion at 40 to 400° C. of 6 to 18×10 −6 /° C.
Claim 11
Dependent Claim
61 words
A ceramic wiring board according to claim 7 , wherein said filler component comprises: (a) lanthanum titanate; (b) at least one titanium compound selected from the group consisting of calcium titanate, strontium titanate, barium titanate and titania; and (c) an oxide containing zirconium; and said ceramic sintered product has a specific inductive capacity at 1 MHz of not smaller than 14.
Claim 12
Dependent Claim
36 words
A ceramic wiring board according to claim 9 , wherein said filler component (b) is used in an amount of from 20 to 80% by weight per the sum of the filler components (a), and (b).
Claim 13
Dependent Claim
37 words
A ceramic wiring board according to claim 9 , wherein said filler component (c) is used in an amount of from 5 to 30% by weight per the sum of the filler components (a), (b) and (c).
Claim 14
Dependent Claim
60 words
A ceramic wiring board according to claim 9 , wherein said filler component further contains (d) magnesium titanate, and said ceramic sintered product has a specific inductive capacity at 1 MHz to 3 GHz of not smaller than 14 and a dielectric loss tangent (tan δ) at 1 MHz to 3 GHz of not larger than 25 ×10 −4 .
Claim 15
Dependent Claim
37 words
A ceramic wiring board according to claim 12 , wherein said filler component (d) is used in an amount of from 20 to 80 % by weight per the sum of the filler components (a) and (d).
Claim 16
Dependent Claim
62 words
A ceramic wiring board according to claim 13 , wherein said filler component (b) is used in an amount of from 20 to 80% by weight per the sum of the filler components (a), (b) and (d), and said filler component (c) in an amount of from 5 to 30% by weight per the sum of the filler components (a) to (d).
Claim 17
Dependent Claim
69 words
A ceramic wiring board according to claim 7 , wherein said glass component contains 15 to 40% by weight of an alkaline earth metal oxide, 30 to 60% by weight of SiO 2 and 1 to 20% by weight of ZrO 2 , and said ceramic sintered product has a dielectric loss tangent (tan δ) at 1 MHz to 3 GHz of not larger than 30 ×40 −4 .
Claim 18
Dependent Claim
68 words
A ceramic wiring board according to claim 15 , wherein said ceramic sintered product has a peak intensity ratio I/I 0 of a maximum peak intensity I, as measured an X-ray diffraction measurement, is smaller than 1, wherein “I” means a maximum peak intensity of detected composite oxides containing alkaline earth metal and Si, and “I 0 ” means a maximum peak intensity of detected oxides containing Ti.
Claim 19
Dependent Claim
149 words
A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constant, wherein said ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of said crystal phase, and the ceramic sintered product has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10 −6 /° C., a specific inductive capacity at 1 MHz of not smaller than 10, and a porosity of not more than 0.5%, and wherein the ceramic wiring board comprises a laminate of the insulating layer of a high dielectric constant formed of said ceramic sintered product having a high dielectric constant and an insulating layer of a low dielectric constant formed of a ceramic sintered product having a low specific inductive capacity which is smaller than 10.
Claim 20
Dependent Claim
149 words
A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constant, wherein said ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of said crystal phase, and the ceramic sintered product has a coefficient of thermal expansion at 40 to 400° C. of not smaller than 8×10 −6 /° C., a specific inductive capacity at 1 MHz of not smaller than 10, and a porosity of not more than 0.5%, and wherein the ceramic wiring board comprises a laminate of the insulating layer of a high dielectric constant formed of said ceramic sintered product having a high dielectric constant and an insulating layer of a low dielectric constant formed of a ceramic sintered product having a low specific inductive capacity which is smaller than 10.
Claim 21
Dependent Claim
72 words
A ceramic wiring board according to claim 17 , wherein said ceramic sintered product of a low dielectric constant has, as a crystal phase, quartz and a composite oxide crystal containing Si and Mg, and has a difference in the thermal expansion at 40 to 400° C. of not larger than 0.5 ppm/° C. between said insulating layer of a high dielectric constant and said insulating layer of a low dielectric constant.
Claim 22
Dependent Claim
27 words
A ceramic wiring board according to claim 18 , wherein the composite oxide crystal containing Si and Mg is MgSiO 3 or Mg 2 SiO 5 .
Claim 23
Dependent Claim
26 words
A ceramic wiring board according to claim 1 , wherein said insulating layer of a high dielectric constant is arranged between a pair of electrode layers.
References Cited (Backward Citations)
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