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US6446573B2 Expired / Lapsed US ⏱️ 0.0 years remaining

Plasma process device

Assignee: Sharp Corp
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Filing: 2001-08-09
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Granted: 2002-09-10
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Expires: 2021-08-09
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Abstract

Abstract A plasma process device capable of forming homogeneous plasma and coping with a large size substrate less costly can be obtained. The plasma process device includes a processing chamber, microwave guiding means, a shower plate and a reaction gas supply passage. The microwave guiding means guides a microwave into the processing chamber. The shower plate has a gas inlet hole to supply to the processing chamber a reaction gas attaining a plasma state by the microwave, and a lower surface facing the processing chamber and an upper surface positioned on the opposite side of the lower surface. The reaction gas supply passage is positioned on the upper surface of the shower plate and supplies the reaction gas to the gas inlet hole. A wall surface of the reaction gas supply passage includes an upper surface of the shower plate and a conductor wall surface opposing the upper surface.

Inventors

  • 👤 Masaki Hirayama
  • 👤 Tadahiro Ohmi
  • 👤 Tatsushi Yamamoto
  • 👤 Takamitsu Tadera

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 08:59
CPC Classifications
C; C23; C23C; C23C16/00; C23C16/44; C23C16/455; C23C16/45563; C23C16/45565; C23C16/50; C23C16/511; H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32192; H01J37/32431; H01J37/3244; H10; H10P; H10P72/00; H10P72/04; H10P72/0402

Claims Analysis

Total Claims: 14
Claim 1
Independent Claim 166 words
A plasma process device comprising: a processing chamber having an electrically conductive top wall for performing a processing using a plasma; microwave guiding means for guiding a microwave into said processing chamber; a dielectric shower plate having at least one gas inlet hole for supplying to said processing chamber a reaction gas attaining a plasma state by said microwave, said shower plate having a lower surface facing said processing chamber and an upper surface positioned on a side opposite to said lower surface; and a reaction gas supply passage to supply said reaction gas to said gas inlet hole, said reaction gas supply passage having a first wall portion including said upper surface of said shower plate, and a second wall portion including an electrically conductive surface of said top wall of said chamber arranged facing said upper surface, said reaction gas supply passage being formed at a region other than the transmission path of microwaves guided to said processing chamber by said microwave guiding means.
Claim 2
Dependent Claim 166 words
A plasma process device comprising: a processing chamber having an electrically conductive top wall for performing a processing using a plasma; microwave guiding means for guiding a microwave into said processing chamber; a dielectric shower plate having at least one gas inlet hole for supplying to said processing chamber a reaction gas attaining a plasma state by said microwave, said shower plate having a lower surface facing said processing chamber and an upper surface positioned on a side opposite to said lower surface; and a reaction gas supply passage to supply said reaction gas to said gas inlet hole, said reaction gas supply passage having a first wall portion including said upper surface of said shower plate, and a second wall portion including an electrically conductive surface of said top wall of said chamber arranged facing said upper surface, said reaction gas supply passage being formed at a region other than the transmission path of microwaves guided to said processing chamber by said microwave guiding means.
Claim 3
Dependent Claim 59 words
The plasma process device according to claim 1 , wherein an isolation distance between said lower surface of said shower plate facing said processing chamber and said electrically conductive wall surface facing said upper surface on the opposite side of said lower surface is provided, said isolation distance being an integral multiple of half guide wavelengths of said microwave.
Claim 4
Dependent Claim 67 words
The plasma process device according to claim 2 , wherein: said reaction gas supply passage is isolated from said microwave guiding means by an electrical conductor; and said device further comprises: a vessel member forming said processing chamber; a pedestal secured to said vessel member; and a shower plate securing member to secure said shower plate to said pedestal by pressing said shower plate to said pedestal.
Claim 5
Dependent Claim 47 words
The plasma process device according to claim 1 , further comprising: a vessel member forming said processing chamber; a pedestal secured to said vessel member; and a shower plate securing member to secure said shower plate to said pedestal by pressing said shower plate to said pedestal.
Claim 6
Dependent Claim 33 words
The plasma process device according to claim 1 , further comprising flow rate control means for controlling the flow rate of the reaction gas in the gas inlet hole in said shower plate.
Claim 7
Dependent Claim 27 words
The plasma process device of claim 5 , wherein: said flow rate control means includes a plug inserted to the gas inlet hole in said shower plate.
Claim 8
Dependent Claim 118 words
The plasma process device according to claim 1 , wherein: said microwave guiding means is formed on said processing chamber, said shower plate is positioned between said processing chamber and said microwave guiding means, said microwave guiding means defines an opening to guide a microwave into said processing chamber, said reaction gas supply passage is formed in a region other than a region positioned under the opening of said microwave guiding means, and an isolation distance between said lower surface of said shower plate facing said processing chamber and said electrically conductive surface opposing said upper surface positioned on the opposite side of said lower surface is an integral multiple of one half guide wavelengths of said microwave.
Claim 9
Dependent Claim 113 words
The plasma process device according to claim 1 , wherein: said microwave guiding means is formed on sad processing chamber, said shower plate is positioned between said processing chamber and said microwave guiding means, said microwave guiding means defines an opening to guide a microwave into said processing chamber, said reaction gas supply passage is formed in a region other than a region positioned under the opening of said microwave guiding means; and said device further comprises: a vessel member forming said processing chamber; a pedestal secured to said vessel member; and a shower plate securing member to secure said shower plate to said pedestal by pressing said shower plate to said pedestal.
Claim 10
Dependent Claim 99 words
The plasma processing device according to claim 1 , wherein: said microwave guiding means is formed on said processing chamber, said shower plate is positioned between said processing chamber and said microwave guiding means, said microwave guiding means defines an opening to guide a microwave into said processing chamber, said reaction gas supply passage is formed in a region other than a region positioned under the opening of said microwave guiding means, and said device further comprises flow rate control means for controlling the flow rate of the reaction gas in the gas outlet hole in said shower plate.
Claim 11
Dependent Claim 28 words
The plasma process device according to claim 9 , wherein: said flow rate control means includes a plug inserted to the gas inlet hole in said shower plate.
Claim 12
Dependent Claim 71 words
The plasma process device according to claim 1 , wherein: said reaction gas supply passage is isolated from said microwave guiding means by an electrical conductor; and an isolation distance between said lower surface of said shower plate facing said processing chamber and said electrically conductive surface opposing said upper surface positioned on the opposite side of said lower surface is an integral multiple of half guide wavelengths of the microwave.
Claim 13
Dependent Claim 53 words
The plasma process device according to claim 1 , wherein: said reaction gas supply passage is isolated from said microwave guiding means by an electrical conductor; and said device further comprises flow rate control means for controlling the flow rate of the reaction gas in the gas inlet hole in said shower plate.
Claim 14
Dependent Claim 28 words
The plasma process device according to claim 12 , wherein: said flow rate control means includes a plug inserted into the gas inlet hole in said shower plate.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2005-09-09 2006-03-11 2006-09-10 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2009-09-09 2010-03-11 2010-09-10 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2013-09-09 2014-03-11 2014-09-10 $7700.00 Window Closed / Lapsed

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