Exposure apparatus, semiconductor manufacturing apparatus, and semiconductor manufacturing method

Claim 2

An exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, said apparatus comprising: switching means for switching from the first job to the second job during or after a period of exposure by a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 3

The apparatus according to claim 1 , wherein the exposed substrate is unloaded to a developing unit connected in line or to a predetermined transfer device.

Claim 4

The apparatus according to claim 1 , wherein said switching means performs the switching operation in accordance with an instruction from a console of the exposure apparatus or an external controller connected to the exposure apparatus.

Claim 5

A semiconductor manufacturing apparatus comprising the exposure apparatus defined in claim 1 as exposure means.

Claim 6

An exposure apparatus for performing exposure processing for a plurality of substrates using original plates, including a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, said apparatus comprising: switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 7

An exposure apparatus for performing exposure processing for a plurality of substrates using original plates, including a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, said apparatus comprising: switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 8

The apparatus according to claim 5 , wherein the exposed substrate is unloaded to a developing unit connected in line or to a predetermined transfer device.

Claim 9

The apparatus according to claim 5 , wherein said switching means performs the switching operation in accordance with an instruction from a console of the exposure apparatus or an external controller connected to the exposure apparatus.

Claim 10

A semiconductor manufacturing apparatus comprising the exposure apparatus defined in claim 5 as exposure means.

Claim 11

An exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, said apparatus comprising: job switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed; and original plate switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of the final substrate to be exposed, by using the first original plate, and before the exposed final substrate is unloaded from the position at which the final substrate is exposed.

Claim 12

An exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, said apparatus comprising: job switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed; and original plate switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of the final substrate to be exposed, by using the first original plate, and before the exposed final substrate is unloaded from the position at which the final substrate is exposed.

Claim 13

The apparatus according to claim 9 , wherein the exposed substrate is unloaded to a developing unit connected in line or to a predetermined transfer device.

Claim 14

The apparatus according to claim 9 , wherein said job switching means and said original plate switching means perform the switching operation in accordance with an instruction from a console of the exposure apparatus or an external controller connected to the exposure apparatus.

Claim 15

A semiconductor manufacturing apparatus comprising the exposure apparatus defined in claim 9 as exposure means.

Claim 16

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of: switching, by the controller, from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 17

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of: switching, by the controller, from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 18

The method according to claim 13 , wherein the substrate is unloaded to a developing unit connected in line or to a predetermined transfer device.

Claim 19

The method according to claim 13 , wherein the step of switching is performed in accordance with an instruction from a console of the exposure mechanism or an external integral controller connected to the exposure mechanism.

Claim 20

The method according to claim 13 , wherein the step of switching from the first job to the second job, corresponding to the lot to be processed next, comprises loading the second job from the controller to the exposure mechanism.

Claim 21

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of: switching, by the controller, from the first original to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 22

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of: switching, by the controller, from the first original to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 23

The method according to claim 17 , wherein the substrate is unloaded to a developing unit connected in line or to a predetermined transfer device.

Claim 24

The method according to claim 17 , wherein the step of switching is performed in accordance with an instruction from a console of the exposure mechanism or an external integral controller connected to the exposure mechanism.

Claim 25

The method according to claim 17 , wherein the step of switching from the first original plage to the second original plate, corresponding to the lot to be processed next, comprises loading the original plate from the controller to the exposure mechanism.

Claim 26

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of: switching, by the controller, from the first job to the second job and switching from the first original plate to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job by using the original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 27

A semiconductor manufacturing method of controlling an exposure mechanism using a controller to perform exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, and manufacturing semiconductor devices from the exposed substrates, said method comprising the step of: switching, by the controller, from the first job to the second job and switching from the first original plate to the second original plate during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job by using the original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 28

The method according to claim 21 , wherein the substrate is unloaded to a developing unit connected in line or to a predetermined transfer device.

Claim 29

The method according to claim 21 , wherein the step of switching is performed in accordance with an instruction from a console of the exposure mechanism or an external integral controller connected to the exposure mechanism.

Claim 30

The method according to claim 21 , wherein the step of switching from the first job and the first original plate to the second job and the second original plate, corresponding to the lot to be processed next, comprises loading the second job and the second original plate from the controller to the exposure mechanism.

Claim 31

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, wherein the storage medium is executed in the exposure apparatus to operate as switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 32

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, wherein the storage medium is executed in the exposure apparatus to operate as switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 33

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates using a plurality of original plates, including a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, wherein the storage medium is executed in the exposure apparatus to operate as switching means for switching from the first original plate to the second original plage during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 34

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates using a plurality of original plates, including a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, wherein the storage medium is executed in the exposure apparatus to operate as switching means for switching from the first original plate to the second original plage during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed by using the first original plate, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed.

Claim 35

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, wherein the storage medium is executed in the exposure apparatus to operate as: job switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed, and original plate switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of the final substrate to be exposed, by using the first original plate, and before the exposed final substrate is unloaded from the position at which the final substrate is exposed.

Claim 36

A computer-readable storage medium which stores a control program of an exposure apparatus for performing exposure processing for a plurality of substrates in accordance with a plurality of jobs, including a first job and a second job to be performed subsequent to the first job, each of the jobs having predetermined operations and exposure parameters necessary for the exposure processing set in advance, using original plates, which include a first original plate and a second original plate to be used next to the first original plate, each of the original plates having a pattern to be used for exposing the plurality of substrates, wherein the storage medium is executed in the exposure apparatus to operate as: job switching means for switching from the first job to the second job during or after a period of exposure of a final shot of a final substrate of the plurality of substrates, to be exposed in accordance with the first job, and before the exposed final substrate is unloaded from a position at which the final substrate is exposed, and original plate switching means for switching from the first original plate to the second original plate during or after a period of exposure of a final shot of the final substrate to be exposed, by using the first original plate, and before the exposed final substrate is unloaded from the position at which the final substrate is exposed.