Patent US4750099A successfully refreshed from Google Patents.
Patent US3046002A successfully refreshed from Google Patents.
US6433285B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed wiring board, IC card module using the same, and method for producing IC card module
Assignee: Adeia Semiconductor Advanced Technologies Inc
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Filing: 2000-12-14
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Granted: 2002-08-13
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Expires: 2020-12-14
Abstract
Abstract The present invention provides a printed wiring board, an IC card module including the printed wiring board, and a method for fabricating the IC card module, for improving reliability of IC cards. The printed wiring board and the IC card module of the invention include: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone; and terminals for external connection formed on the top surface of the base. The terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-claimed regions.
Inventors
- 👤 Kenji Maeda
- 👤 Takashi Takata
- 👤 Hiroki Naraoka
- 👤 Hajime Homma
- 👤 Shigeru Nonoyama
- 👤 Yoshiyuki Arai
- 👤 Yuichiro Yamada
- 👤 Fumito Ito
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 16:51
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/072; G06K19/077; G06K19/07743; G06K19/07745; H; H05; H05K; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10; H10W; H10W70/00; H10W70/60; H10W70/699; H10W74/00; H10W74/01; H10W74/016; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
115 words
An IC card module comprising: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone of the resin sealing region that are not clamped; a semiconductor device mounted on a top surface of the base; terminals for external connection formed on the top surface of the base; wiring formed on the top surface of the base for connecting the semiconductor device and the terminals; and a resin for sealing the semiconductor device, wherein the terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-clamped regions.
Claim 2
Dependent Claim
115 words
An IC card module comprising: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone of the resin sealing region that are not clamped; a semiconductor device mounted on a top surface of the base; terminals for external connection formed on the top surface of the base; wiring formed on the top surface of the base for connecting the semiconductor device and the terminals; and a resin for sealing the semiconductor device, wherein the terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-clamped regions.
Claim 3
Dependent Claim
27 words
The IC card module of claim 1 , wherein the wiring is formed along routes passing through the non-clamped regions on the top surface of the base.
Claim 4
Dependent Claim
33 words
The IC card module of claim 2 , wherein the non-clamped regions on the top surface of the base correspond to a resin injection gate and an air vent of the sealing mold.
Claim 5
Dependent Claim
52 words
The IC card module of claim 1 , wherein at least one layer of inner wiring and then an insulating layer are formed on the top surface of the base, the semiconductor device is formed on the insulating layer, and portions of the wiring located in the periphery zone constitute inner wiring.
Claim 6
Dependent Claim
26 words
The IC card module of claim 1 , wherein a solid pattern is formed on portions of the periphery zone that do not have the wiring.
Claim 7
Dependent Claim
34 words
The IC card module of claim 5 , wherein a top surface of the solid pattern is at a height equal to or greater than the height of a top surface of the wiring.
Claim 8
Dependent Claim
20 words
The IC card module of claim 6 , wherein the solid pattern functions as power source wiring or grounding wiring.
Claim 9
Dependent Claim
48 words
The IC card module of claim 1 , further comprising a semiconductor device formed on a back surface of the base, wiring for connecting the semiconductor device formed on the back surface and the terminals, and a resin for sealing the semiconductor device formed on the back surface.
Claim 10
Dependent Claim
133 words
A printed wiring board comprising: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions of the periphery zone of the resin sealing region that are not clamped; connection lands formed on the top surface of the base for connection with a semiconductor device; terminals for external connection formed on the top surface of the base; and wiring formed on the top surface of the base for connecting the connection lands and the terminals; and wherein the terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-clamped regions, and the wiring is formed along routes passing through the non-clamped regions on the top surface of the base.
Claim 11
Dependent Claim
133 words
A printed wiring board comprising: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions of the periphery zone of the resin sealing region that are not clamped; connection lands formed on the top surface of the base for connection with a semiconductor device; terminals for external connection formed on the top surface of the base; and wiring formed on the top surface of the base for connecting the connection lands and the terminals; and wherein the terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-clamped regions, and the wiring is formed along routes passing through the non-clamped regions on the top surface of the base.
Claim 12
Dependent Claim
33 words
The printed wiring board of claim 9 , wherein the non-clamped regions on the top surface of the base correspond to a resin injection gate and an air vent of the sealing mold.
Claim 13
Dependent Claim
26 words
The printed wiring board of claim 9 , wherein a solid pattern is formed on portions of the periphery zone that do not have the wiring.
Claim 14
Dependent Claim
34 words
The printed wiring board of claim 11 , wherein a top surface of the solid pattern is at a height equal to or greater than the height of a top surface of the wiring.
Claim 15
Dependent Claim
53 words
The printed wiring board of claim 9 , wherein at least one layer of inner wiring and then an insulating layer are formed on the top surface of the base, the semiconductor device is formed on the insulating layer, and portions of the wiring located in the periphery zone constitute the inner wiring.
Claim 16
Independent Claim
197 words
A method for fabricating an IC card module, comprising the steps of: (a) preparing a printed wiring board comprising: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone of the resin sealing region that are not clamped; connection lands formed on the top surface of the base for connection with a semiconductor device; terminals for external connection formed on the top surface of the base; and wiring formed on the top surface of the base for connecting the connection lands and the terminals, wherein the terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-clamped regions, and the wiring is formed along routes passing through the non-clamped regions on the top surface of the base; (b) mounting the semiconductor device in the resin sealing region by securing the semiconductor device to the base; (c) connecting the semiconductor device and the connection lands by means of conductive members; and (d) clamping the printed wiring board with a sealing mold to seal the semiconductor device with a resin.
Claim 17
Independent Claim
197 words
A method for fabricating an IC card module, comprising the steps of: (a) preparing a printed wiring board comprising: a base having a resin sealing region, clamped regions in a periphery zone of the resin sealing region clamped with a sealing mold, and non-clamped regions in the periphery zone of the resin sealing region that are not clamped; connection lands formed on the top surface of the base for connection with a semiconductor device; terminals for external connection formed on the top surface of the base; and wiring formed on the top surface of the base for connecting the connection lands and the terminals, wherein the terminals are formed in a region other than any of the resin sealing region, the clamped regions, and the non-clamped regions, and the wiring is formed along routes passing through the non-clamped regions on the top surface of the base; (b) mounting the semiconductor device in the resin sealing region by securing the semiconductor device to the base; (c) connecting the semiconductor device and the connection lands by means of conductive members; and (d) clamping the printed wiring board with a sealing mold to seal the semiconductor device with a resin.
Claim 18
Dependent Claim
41 words
The method of claim 14 , wherein in the step (a) of preparing a printed wiring board, the non-clamped regions on the top surface of the base correspond to a resin injection gate and an air vent of the sealing mold.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-12 | 2006-02-11 | 2006-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-12 | 2010-02-11 | 2010-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-12 | 2014-02-11 | 2014-08-13 | $7700.00 | Window Closed / Lapsed |