Patent US6432742B1 successfully refreshed from Google Patents.
US6432742B1
Expired / Lapsed
US
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Methods of forming drop-in heat spreader plastic ball grid array (PBGA) packages
Assignee: Stats Chippac Pte Ltd
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Filing: 2000-08-17
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Granted: 2002-08-13
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Expires: 2020-08-17
Abstract
Abstract A method of fabricating a die-up laminated PBGA package, including the following steps. A mold chase for a PBGA package is provided. The mold chase has an open side with and exposed bottom wall and side walls, and a bottom side. The mold chase is positioned open side up. A heat spreader is dropped into the mold chase open side. The heat spreader has a lower protruding section, and lateral peripheral flanges with gaps therebetween. The protruding section contacts a portion of the bottom wall of the mold chase and the flanges contact a portion of the exposed side walls of the mold chase to thereby secure the heat spreader within the mold chase. A substrate, having a die affixed thereto in a die down position, is fixedly placed over the mold chase. The die being positioned within the space above the protruding section of the heat spreader. A flowable molding compound is applied within the space above the heat spreader and within the space 26′ below the heater spreader flanges 49, 59, completely filling these spaces to form a die-up laminated PBGA package. The flowable molding compound 30 is also flowable through the gaps.
Inventors
- 👤 Chow Seng Guan
- 👤 John Briar
- 👤 Loreto Y. Cantillep
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:07
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/70; H10W40/77; H10W40/778; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5525; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/736; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
176 words
A method of fabricating a die-up laminated PBGA package, including the steps of: providing a mold chase for a PBGA package; said mold chase having a bottom side, and an open side with an exposed bottom wall and side walls; said mold chase positioned open side up; dropping a heat spreader into said mold chase open side; said heat spreader having a lower protruding section, and lateral peripheral flanges with gaps therebetween; said protruding section contacting a portion of said bottom wall of said mold chase and said flanges contacting a portion of said exposed side walls of said mold chase to thereby secure said heat spreader within said mold chase; fixedly placing a substrate, having a die affixed thereto in a die down position, over said mold chase; said die positioned within said space above said protruding section; and applying a flowable molding compound within the space above said heat spreader and within the space below said heater spreader flanges to completely fill said spaces; said flowable molding compound also being flowable through said gaps.
Claim 2
Independent Claim
176 words
A method of fabricating a die-up laminated PBGA package, including the steps of: providing a mold chase for a PBGA package; said mold chase having a bottom side, and an open side with an exposed bottom wall and side walls; said mold chase positioned open side up; dropping a heat spreader into said mold chase open side; said heat spreader having a lower protruding section, and lateral peripheral flanges with gaps therebetween; said protruding section contacting a portion of said bottom wall of said mold chase and said flanges contacting a portion of said exposed side walls of said mold chase to thereby secure said heat spreader within said mold chase; fixedly placing a substrate, having a die affixed thereto in a die down position, over said mold chase; said die positioned within said space above said protruding section; and applying a flowable molding compound within the space above said heat spreader and within the space below said heater spreader flanges to completely fill said spaces; said flowable molding compound also being flowable through said gaps.
Claim 3
Dependent Claim
37 words
The method of claim 1 , wherein said heat spreader protruding section has an outer surface that is exposed in said die-up laminated PBGA package to form an exposed drop-in heat spreader ball grip array (XD-PBGA) package.
Claim 4
Dependent Claim
37 words
The method of claim 1 , wherein said heat spreader protruding section has an outer surface that is embedded within said die-up laminated PBGA package to form an embedded drop-in heat spreader ball grip array (MD-PBGA) package.
Claim 5
Dependent Claim
36 words
The method of claim 1 , wherein said heat spreader further includes at least one through-hole, whereby said flowable molding compound flows into said through-hole to increase adhesion of said heat spreader to said molding compound.
Claim 6
Dependent Claim
49 words
The method of claim 1 , wherein said heat spreader further includes at least one through-hole, whereby said flowable molding compound flows through said through-hole to assist in filling said space below said heat spreader flanges, and further to increase adhesion of said heat spreader to said molding compound.
Claim 7
Dependent Claim
16 words
The method of claim 1 , whereby said heat spreader further includes dimples contacting said substrate.
Claim 8
Dependent Claim
28 words
The method of claim 1 , whereby said heat spreader further includes dimples contacting said substrate; said dimples having a height above said heat spreader of 0.2 μm.
Claim 9
Dependent Claim
18 words
The method of claim 1 , whereby said heat spreader further includes dimples fixedly attached to said substrate.
Claim 10
Dependent Claim
35 words
The method of claim 1 , further including the step of: forming a ball grip array on the exposed side of said substrate; after fixedly placing said substrate over said molding compound filled mold chase.
Claim 11
Dependent Claim
16 words
The method of claim 1 , whereby said heat spreader serves as a common ground plane.
Claim 12
Dependent Claim
18 words
The method of claim 1 , whereby said heat spreader serves as an electro magnetic interference (EMI) shield.
Claim 13
Dependent Claim
45 words
The method of claim 1 , whereby said heat spreader further includes dimples contacting said exposed bottom wall of said mold chase to space said heat spreader from said exposed bottom wall of said mold chase and embed said heat spreader within said molding compound.
Claim 14
Independent Claim
205 words
A method of fabricating a die-up laminated PBGA package, including the steps of: providing a mold chase for a PBGA package; said mold chase having a bottom side, and an open side with an exposed bottom wall and side walls; said mold chase positioned open side up; dropping a heat spreader into said mold chase open side; said heat spreader having a lower protruding section, and lateral peripheral flanges with gaps therebetween; said protruding section contacting a portion of said bottom wall of said mold chase and said flanges contacting a portion of said exposed side walls of said mold chase to thereby secure said heat spreader within said mold chase; fixedly placing a substrate, having a die affixed thereto in a die down position, over said mold chase; said die positioned within said space above said protruding section; and applying a flowable molding compound within the space above said heat spreader and within the space below said heater spreader flanges to completely fill said spaces; said flowable molding compound also being flowable through said gaps; said heat spreader further including at least one through-hole, whereby said flowable molding compound flows into said through-hole to increase adhesion of said heat spreader to said molding compound.
Claim 15
Independent Claim
205 words
A method of fabricating a die-up laminated PBGA package, including the steps of: providing a mold chase for a PBGA package; said mold chase having a bottom side, and an open side with an exposed bottom wall and side walls; said mold chase positioned open side up; dropping a heat spreader into said mold chase open side; said heat spreader having a lower protruding section, and lateral peripheral flanges with gaps therebetween; said protruding section contacting a portion of said bottom wall of said mold chase and said flanges contacting a portion of said exposed side walls of said mold chase to thereby secure said heat spreader within said mold chase; fixedly placing a substrate, having a die affixed thereto in a die down position, over said mold chase; said die positioned within said space above said protruding section; and applying a flowable molding compound within the space above said heat spreader and within the space below said heater spreader flanges to completely fill said spaces; said flowable molding compound also being flowable through said gaps; said heat spreader further including at least one through-hole, whereby said flowable molding compound flows into said through-hole to increase adhesion of said heat spreader to said molding compound.
Claim 16
Dependent Claim
37 words
The method of claim 13 , wherein said heat spreader protruding section has an outer surface that is exposed in said die-up laminated PBGA package to form an exposed drop-in heat spreader ball grip array (XD-PBGA) package.
Claim 17
Dependent Claim
37 words
The method of claim 13 , wherein said heat spreader protruding section has an outer surface that is embedded within said die-up laminated PBGA package to form an embedded drop-in heat spreader ball grip array (MD-PBGA) package.
Claim 18
Dependent Claim
16 words
The method of claim 13 , whereby said heat spreader further includes dimples contacting said substrate.
Claim 19
Dependent Claim
28 words
The method of claim 13 , whereby said heat spreader further includes dimples contacting said substrate; said dimples having a height above said heat spreader of 0.2 μm.
Claim 20
Dependent Claim
18 words
The method of claim 13 , whereby said heat spreader further includes dimples fixedly attached to said substrate.
Claim 21
Dependent Claim
35 words
The method of claim 13 , further including the step of: forming a ball grip array on the exposed side of said substrate; after fixedly placing said substrate over said molding compound filled mold chase.
Claim 22
Dependent Claim
16 words
The method of claim 13 , whereby said heat spreader serves as a common ground plane.
Claim 23
Dependent Claim
18 words
The method of claim 13 , whereby said heat spreader serves as an electro magnetic interference (EMI) shield.
Claim 24
Dependent Claim
45 words
The method of claim 13 , whereby said heat spreader further includes dimples contacting said exposed bottom wall of said mold chase to space said heat spreader from said exposed bottom wall of said mold chase and embed said heat spreader within said molding compound.
Claim 25
Independent Claim
213 words
A method of fabricating a die-up laminated PBGA package, including the steps of: providing a mold chase for a PBGA package; said mold chase having a bottom side, and an open side with an exposed bottom wall and side walls; said mold chase positioned open side up; dropping a heat spreader into said mold chase open side; said heat spreader having a lower protruding section, and lateral peripheral flanges with gaps therebetween; said protruding section contacting a portion of said bottom wall of said mold chase and said flanges contacting a portion of said exposed side walls of said mold chase to thereby secure said heat spreader within said mold chase; fixedly placing a substrate, having a die affixed thereto in a die down position, over said mold chase; said die positioned within said space above said protruding section; said heat spreader further includes dimples contacting said substrate; and applying a flowable molding compound within the space above said heat spreader and within the space below said heater spreader flanges completely filling said spaces; said flowable molding compound also being flowable through said gaps; said heat spreader further includes at least one through-hole, whereby said flowable molding compound flows into said through-hole to increase adhesion of said heat spreader to said molding compound.
Claim 26
Independent Claim
213 words
A method of fabricating a die-up laminated PBGA package, including the steps of: providing a mold chase for a PBGA package; said mold chase having a bottom side, and an open side with an exposed bottom wall and side walls; said mold chase positioned open side up; dropping a heat spreader into said mold chase open side; said heat spreader having a lower protruding section, and lateral peripheral flanges with gaps therebetween; said protruding section contacting a portion of said bottom wall of said mold chase and said flanges contacting a portion of said exposed side walls of said mold chase to thereby secure said heat spreader within said mold chase; fixedly placing a substrate, having a die affixed thereto in a die down position, over said mold chase; said die positioned within said space above said protruding section; said heat spreader further includes dimples contacting said substrate; and applying a flowable molding compound within the space above said heat spreader and within the space below said heater spreader flanges completely filling said spaces; said flowable molding compound also being flowable through said gaps; said heat spreader further includes at least one through-hole, whereby said flowable molding compound flows into said through-hole to increase adhesion of said heat spreader to said molding compound.
Claim 27
Dependent Claim
37 words
The method of claim 23 , wherein said heat spreader protruding section has an outer surface that is exposed in said die-up laminated PBGA package to form an exposed drop-in heat spreader ball grip array (XD-PBGA) package.
Claim 28
Dependent Claim
37 words
The method of claim 23 , wherein said heat spreader protruding section has an outer surface that is embedded within said die-up laminated PBGA package to form an embedded drop-in heat spreader ball grip array (MD-PBGA) package.
Claim 29
Dependent Claim
19 words
The method of claim 23 , whereby said dimples having a height above said heat spreader of 0.2 μm.
Claim 30
Dependent Claim
15 words
The method of claim 23 , whereby said dimples are fixedly attached to said substrate.
Claim 31
Dependent Claim
35 words
The method of claim 23 , further including the step of: forming a ball grip array on the exposed side of said substrate; after fixedly placing said substrate over said molding compound filled mold chase.
Claim 32
Dependent Claim
16 words
The method of claim 23 , whereby said heat spreader serves as a common ground plane.
Claim 33
Dependent Claim
18 words
The method of claim 23 , whereby said heat spreader serves as an electro magnetic interference (EMI) shield.
Claim 34
Dependent Claim
41 words
The method of claim 23 , whereby said dimples contact said exposed bottom wall of said mold chase to space said heat spreader from said exposed bottom wall of said mold chase and embed said heat spreader within said molding compound.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-12 | 2006-02-11 | 2006-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-12 | 2010-02-11 | 2010-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-12 | 2014-02-11 | 2014-08-13 | $7700.00 | Window Closed / Lapsed |