Patent US6428189B1 successfully refreshed from Google Patents.
US6428189B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
L.E.D. thermal management
Assignee: Relume Technologies Inc
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Filing: 2000-10-10
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Granted: 2002-08-06
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Expires: 2020-10-10
Abstract
Abstract A heat dissipater ( 30 ) of a metallic or metal material is disposed in parallel relationship to a circuit board ( 12 ). The assembly is characterized by the circuit board 12 presenting a hole ( 32 ) therethrough and surrounding each of a plurality of LEDs ( 20, 22 or 24 ). A heat sink ( 28 ) integral with each LED ( 20, 22 or 24 ) is disposed in thermal contact with the heat dissipater ( 30 ) for conveying heat from the LEDs ( 20, 22 and 24 ) to the heat dissipater ( 30 ). In other words, each LED ( 20, 22 or 24 ) extends through the hole ( 32 ) in the circuit board ( 12 ) with the light emitting portion or lens ( 34 ) extending from one of the surfaces ( 14 or 16 ) of the circuit board ( 12 ) and the heat sink ( 28 ) extending from the other one of the surfaces ( 14 or 16 ) of the circuit board ( 12 ). A thermal coupling agent ( 36 or 38 ) is disposed between the heat sink ( 28 ) and the heat dissipater ( 30 ) for providing a full thermal path between the heat sink ( 28 ) and the heat dissipater ( 30 ). In FIG. 3, the first surface ( 14 ) of the circuit board ( 12 ), with the electrical leads ( 26 ) soldered or adhesively attached to the traces ( 18 ) thereon, faces the heat dissipater ( 30 ). The circuit board ( 12 ) is spaced from the heat dissipater ( 30 ) and, in FIG. 3, the traces ( 18 ) face the heat dissipater. A step in the fabrication of the present invention is the disposing of a thermally insulating cap ( 40 ) around the heat sink ( 28 ) while disposing the LED ( 24 ) on the circuit board ( 12 ) to protect the LED from damage during soldering.
Inventors
- 👤 Peter A. Hochstein
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:30
CPC Classifications
F; F21; F21V; F21V29/00; F21V29/50; F21V29/70; F21V29/71; F21V29/713; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/021; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/858; H10H20/8582; F21Y; F21Y2115/00; F21Y2115/10; H05K1/18; H05K1/182; H05K2201/00; H05K2201/10; H05K2201/10007; H05K2201/10106; H05K2201/10431; H05K2201/1056; H05K3/00; H05K3/0058; H05K3/0061; Y; Y10; Y10S; Y10S362/00; Y10S362/80
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
190 words
An electrically driven light-emitting-diode (LED) lamp assembly comprising; an electrically insulating circuit board ( 12 ) having opposed first and second surfaces ( 14 and 16 ), electrically conductive circuit traces ( 18 ) on said first surface ( 14 ) of said circuit board ( 12 ), a plurality of LEDs ( 20 , 22 or 24 ) each having a pair of electrical leads ( 26 ) in electrical engagement with said traces ( 18 ), each of said LEDs ( 20 , 22 or 24 ) including a heat sink ( 28 ), a heat dissipater ( 30 ) disposed in parallel relationship to said circuit board ( 12 ), said assembly characterized by said circuit board ( 12 ) presenting a hole ( 32 ) therethrough and around each LED ( 20 , 22 or 24 ), and said heat sink ( 28 ) of each LED ( 20 , 22 or 24 ) being disposed in thermal contact with said heat dissipater ( 30 ) for conveying heat from said LEDs ( 20 , 22 or 24 ) to said heat dissipater ( 30 ).
Claim 2
Dependent Claim
190 words
An electrically driven light-emitting-diode (LED) lamp assembly comprising; an electrically insulating circuit board ( 12 ) having opposed first and second surfaces ( 14 and 16 ), electrically conductive circuit traces ( 18 ) on said first surface ( 14 ) of said circuit board ( 12 ), a plurality of LEDs ( 20 , 22 or 24 ) each having a pair of electrical leads ( 26 ) in electrical engagement with said traces ( 18 ), each of said LEDs ( 20 , 22 or 24 ) including a heat sink ( 28 ), a heat dissipater ( 30 ) disposed in parallel relationship to said circuit board ( 12 ), said assembly characterized by said circuit board ( 12 ) presenting a hole ( 32 ) therethrough and around each LED ( 20 , 22 or 24 ), and said heat sink ( 28 ) of each LED ( 20 , 22 or 24 ) being disposed in thermal contact with said heat dissipater ( 30 ) for conveying heat from said LEDs ( 20 , 22 or 24 ) to said heat dissipater ( 30 ).
Claim 3
Dependent Claim
83 words
An assembly as set forth in claim 1 wherein said heat sink ( 28 ) presents an area facing said heat dissipater ( 30 ) and including a thermal coupling agent ( 36 or 38 ) between said heat sink ( 28 ) and said heat dissipater ( 30 ) for providing a full thermal path between said heat sink ( 28 ) and said heat dissipater ( 30 ) over the entirety of said area of said heat sink ( 28 ).
Claim 4
Dependent Claim
20 words
An assembly as set forth in claim 2 wherein said thermal coupling agent ( 38 ) is an electrical insulator.
Claim 5
Dependent Claim
24 words
An assembly as set forth in claim 1 wherein said circuit board ( 12 ) is spaced from said heat dissipater ( 30 ).
Claim 6
Dependent Claim
27 words
An assembly as set forth in claim 1 wherein said second surface 16 of said circuit board ( 12 ) faces said heat dissipater ( 30 ).
Claim 7
Dependent Claim
36 words
An assembly as set forth in claim 1 wherein said first surface ( 14 ) of said circuit board ( 12 ) with said traces ( 18 ) thereon faces said heat dissipater ( 30 ).
Claim 8
Dependent Claim
23 words
An assembly as set forth in claim 6 wherein said traces ( 18 ) are spaced from said heat dissipater ( 30 ).
Claim 9
Independent Claim
187 words
A method of fabricating an electrically driven light-emitting-diode (LED) lamp assembly with LEDs ( 20 , 22 or 24 ) having a heat sink ( 28 ), said method comprising the steps of; disposing a plurality of LEDs ( 20 , 22 or 24 ) each having a pair of electrical leads ( 26 ) in electrical engagement with electrically conductive circuit traces ( 18 ) on a first surface ( 14 ) of an electrically insulating circuit board ( 12 ), and disposing a heat dissipater ( 30 ) in parallel relationship to the circuit board ( 12 ), said method characterized by disposing each LED ( 20 , 22 or 24 ) in a hole ( 32 ) through the circuit board ( 12 ) and around each LED ( 20 , 22 or 24 ) with the heat sink ( 28 ) of each LED ( 20 , 22 or 24 ) being disposed in thermal contact with the heat dissipater ( 30 ) for conveying heat from the LEDs ( 20 , 22 or 24 ) to the heat dissipater ( 30 ).
Claim 10
Independent Claim
187 words
A method of fabricating an electrically driven light-emitting-diode (LED) lamp assembly with LEDs ( 20 , 22 or 24 ) having a heat sink ( 28 ), said method comprising the steps of; disposing a plurality of LEDs ( 20 , 22 or 24 ) each having a pair of electrical leads ( 26 ) in electrical engagement with electrically conductive circuit traces ( 18 ) on a first surface ( 14 ) of an electrically insulating circuit board ( 12 ), and disposing a heat dissipater ( 30 ) in parallel relationship to the circuit board ( 12 ), said method characterized by disposing each LED ( 20 , 22 or 24 ) in a hole ( 32 ) through the circuit board ( 12 ) and around each LED ( 20 , 22 or 24 ) with the heat sink ( 28 ) of each LED ( 20 , 22 or 24 ) being disposed in thermal contact with the heat dissipater ( 30 ) for conveying heat from the LEDs ( 20 , 22 or 24 ) to the heat dissipater ( 30 ).
Claim 11
Dependent Claim
66 words
A method as set forth in claim 8 including disposing a thermal coupling agent ( 36 or 38 ) between the heat sink ( 28 ) and the heat dissipater ( 30 ) for providing a full thermal path between the heat sink ( 28 ) and the heat dissipater ( 30 ) over the entirety of the area of the heat sink ( 28 ).
Claim 12
Dependent Claim
80 words
A method as set forth in claim 8 including disposing a thermal coupling agent ( 38 ) that is an electrical insulator between the heat sink ( 28 ) and the heat dissipater ( 30 ) for providing a full thermal path between the heat sink ( 28 ) and the heat dissipater ( 30 ) over the entirety of the area of the heat sink ( 28 ) while preventing electrical current between adjacent heat sink ( 28 ).
Claim 13
Dependent Claim
23 words
A method as set forth in claim 8 including spacing the circuit board ( 12 ) from the heat dissipater ( 30 ).
Claim 14
Dependent Claim
44 words
A method as set forth in claim 8 including spacing the circuit board ( 12 ) from the heat dissipater ( 30 ) with the first surface ( 14 ) having the traces ( 18 ) thereon facing the heat dissipater ( 30 ).
Claim 15
Dependent Claim
38 words
A method as set forth in claim 8 including disposing a thermally insulating cap ( 40 ) around the heat sink ( 28 ) while disposing the LED ( 24 ) on the circuit board ( 12 ).
Claim 16
Dependent Claim
22 words
A method as set forth in claim 13 including soldering the leads ( 26 ) to the circuit traces ( 18 ).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-05 | 2006-02-04 | 2006-08-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-05 | 2010-02-04 | 2010-08-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-05 | 2014-02-04 | 2014-08-06 | $7700.00 | Window Closed / Lapsed |