Abstract A Si 1−x Ge x /Si 1−y C y short-period superlattice which functions as a single SiGeC layer is formed by alternately growing Si 1−x Ge x layers (0<x<1) and Si 1−y C y layers (0<y<1) each having a thickness corresponding to several atomic layers which is small enough to prevent discrete quantization levels from being generated. This provides a SiGeC mixed crystal which is free from Ge—C bonds and has good crystalline quality and thermal stability. The Si 1−x Ge x /Si 1−y C y short-period superlattice is fabricated by a method in which Si 1−x Ge x layers and Si 1−y C y layers are epitaxially grown alternately, or a method in which a Si/Si 1−x Ge x short-period superlattice is first formed and then C ions are implanted into the superlattice followed by annealing for allowing implanted C ions to migrate to Si layers.
A semiconductor crystal comprising a superlattice structure including two or more periods of alternately stacked C included first layers containing Si and Ge as major components and second layers containing Si and C as major components, wherein the concentration of C in the first layers is lower than the concentration of C in the second layers, wherein the concentration of C in an interface of the superlattice structure changes continuously, and wherein the superlattice structure functions as a single SiGeC layer.
Claim 2
Dependent Claim
81 words
A semiconductor crystal comprising a superlattice structure including two or more periods of alternately stacked C included first layers containing Si and Ge as major components and second layers containing Si and C as major components, wherein the concentration of C in the first layers is lower than the concentration of C in the second layers, wherein the concentration of C in an interface of the superlattice structure changes continuously, and wherein the superlattice structure functions as a single SiGeC layer.
Claim 3
Dependent Claim
49 words
The semiconductor crystal of claim 1 , wherein the thickness of each of the C included first layers containing Si and Ge as major components and the second layers containing Si and C as major components is smaller than a thickness which allows discrete quantization levels to be generated.
Claim 4
Dependent Claim
111 words
A semiconductor device comprising: a substrate; a first semiconductor layer containing at least Si, formed on the substrate; and a second semiconductor layer formed in contact with the first semiconductor layer for functioning as a SiGeC layer, wherein the second semiconductor layer has a structure including at least two or more periods of alternately stacked C included first layers containing Si and Ge as major components and second layers containing Si and C as major components, wherein the concentration of C in the first layers is lower than the concentration of C in the second layers, and wherein the concentration of C in an interface of the superlattice structure changes continuously.
Claim 5
Dependent Claim
111 words
A semiconductor device comprising: a substrate; a first semiconductor layer containing at least Si, formed on the substrate; and a second semiconductor layer formed in contact with the first semiconductor layer for functioning as a SiGeC layer, wherein the second semiconductor layer has a structure including at least two or more periods of alternately stacked C included first layers containing Si and Ge as major components and second layers containing Si and C as major components, wherein the concentration of C in the first layers is lower than the concentration of C in the second layers, and wherein the concentration of C in an interface of the superlattice structure changes continuously.
Claim 6
Dependent Claim
49 words
The semiconductor device of claim 3 , wherein the thickness of each of the C included first layers containing Si and Ge as major components and the second layers containing Si and C as major components is smaller than a thickness which allows discrete quantization levels to be generated.