US6396116B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit packaging for optical sensor devices
Assignee: Micron Technology Inc
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Filing: 2000-02-25
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Granted: 2002-05-28
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Expires: 2020-02-25
Abstract
Abstract An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.
Inventors
- 👤 Michael G. Kelly
- 👤 James-Yu Chang
- 👤 Gary Dean Sasser
- 👤 Andrew Arthur Hunter
- 👤 Cheng-Cheng Chang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 09:31
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/50; H10F39/00; H10F39/80; H10F39/804; H10F39/811; H10F77/40; H10F77/407
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
270 words
An optical device structure comprising: a first substrate comprising: a first major surface and a second major surface; an optical sensor located at said first major surface; a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; a second substrate comprising; a first major surface and a second major surface; means, aligned with said optical sensor, for allowing light to be detected by said optical sensor; a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate; a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and a circuit board comprising; a first major surface and a second major surface; a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate; a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads of said circuit board; wherein said optical sensor is electrically connected to said third plurality of conductive pads of said circuit board.
Claim 2
Dependent Claim
270 words
An optical device structure comprising: a first substrate comprising: a first major surface and a second major surface; an optical sensor located at said first major surface; a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; a second substrate comprising; a first major surface and a second major surface; means, aligned with said optical sensor, for allowing light to be detected by said optical sensor; a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate; a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and a circuit board comprising; a first major surface and a second major surface; a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate; a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads of said circuit board; wherein said optical sensor is electrically connected to said third plurality of conductive pads of said circuit board.
Claim 3
Dependent Claim
28 words
The optical device structure of claim 1 wherein said means for allowing light to be detected by said optical sensor includes a through hole within said second substrate.
Claim 4
Dependent Claim
39 words
The optical device structure of claim 1 further including an optical glass cover connected to said second surface of said second substrate, wherein said optical glass cover completely covers or substantially covers said through hole within said second substrate.
Claim 5
Dependent Claim
19 words
The optical device structure of claim 1 further including an optical grade structural adhesive formed over said optical sensor.
Claim 6
Dependent Claim
28 words
The optical device structure of claim 1 wherein said second major surface of said first substrate is physically connected to said first major surface of said circuit board.
Claim 7
Dependent Claim
14 words
The optical device structure of claim 1 wherein said second substrate is optically transparent.
Claim 8
Dependent Claim
40 words
The optical device structure of claim 1 further including an optical lens system that is connected to said second major surface of said second substrate and aligned with said optical sensor such that light is focused onto said optical sensor.
Claim 9
Dependent Claim
23 words
The optical device structure of claim 1 wherein said second substrate includes an optically transparent and monolithic lens element or multiple lens elements.
Claim 10
Dependent Claim
26 words
The optical device structure of claim 8 wherein said first substrate, said second substrate, and said circuit board are integrated with a hand held camera housing.
Claim 11
Dependent Claim
41 words
The optical device structure of claim 1 wherein said plurality of interconnects includes solder balls that form electrical connections between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board.
Claim 12
Dependent Claim
173 words
An optical device structure comprising: a first substrate comprising: a first major surface and a second major surface; an optical sensor located at said first major surface; a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; and a circuit board comprising; a first major surface and a second major surface; means, aligned with said optical sensor, for allowing light to be detected by said optical sensor; a plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate; a plurality of interconnects flip chip bonded between said plurality of connection points of said first substrate and said plurality of conductive pads of said circuit board; a plurality of conductive leads physically connected to said circuit board and electrically connected to said plurality of conductive pads; wherein said optical sensor is electrically connected to said plurality of conductive leads of said circuit board.
Claim 13
Dependent Claim
173 words
An optical device structure comprising: a first substrate comprising: a first major surface and a second major surface; an optical sensor located at said first major surface; a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; and a circuit board comprising; a first major surface and a second major surface; means, aligned with said optical sensor, for allowing light to be detected by said optical sensor; a plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate; a plurality of interconnects flip chip bonded between said plurality of connection points of said first substrate and said plurality of conductive pads of said circuit board; a plurality of conductive leads physically connected to said circuit board and electrically connected to said plurality of conductive pads; wherein said optical sensor is electrically connected to said plurality of conductive leads of said circuit board.
Claim 14
Dependent Claim
27 words
The optical structure of claim 11 wherein said means for allowing light to be detected by said optical sensor includes a through hole within said circuit board.
Claim 15
Dependent Claim
39 words
The optical device structure of claim 11 further including an optical glass cover connected to said second surface of said circuit board, wherein said optical glass cover completely covers or substantially covers said through hole within said circuit board.
Claim 16
Dependent Claim
19 words
The optical device structure of claim 11 further including an optical grade structural adhesive formed over said optical sensor.
Claim 17
Dependent Claim
39 words
The optical device structure of claim 11 wherein said plurality of interconnects includes solder balls that form electrical connections between said plurality of connection points of said first substrate and said plurality of conductive pads of said circuit board.
Claim 18
Dependent Claim
40 words
The optical device structure of claim 11 further including an optical lens system that is connected to said second major surface of said circuit board and aligned with said optical sensor such that light is focused onto said optical sensor.
Claim 19
Dependent Claim
14 words
The optical device structure of claim 11 wherein said circuit board is optically transparent.
Claim 20
Dependent Claim
29 words
The optical device structure of claim 11 wherein said circuit board includes a monolithic lens element or multiple lens elements that includes conductive patterning on said first major surface.
Claim 21
Dependent Claim
41 words
The optical device structure of claim 18 wherein said optically transparent and monolithic lens element or multiple lens elements forms a portion of a hand held camera housing and wherein said first substrate is located within said hand held camera housing.
Claim 22
Dependent Claim
268 words
An optical device structure comprising: a first substrate comprising: a first major surface and a second major surface; an optical sensor located at said first major surface; a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; a second substrate comprising; a first major surface and a second major surface; a through hole, aligned with said optical sensor, for allowing light to be detected by said optical sensor; a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate; a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and a circuit board comprising; a first major surface and a second major surface; a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate; a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads; wherein said optical sensor is electrically connected to said third plurality of conductive pads on said circuit board.
Claim 23
Dependent Claim
268 words
An optical device structure comprising: a first substrate comprising: a first major surface and a second major surface; an optical sensor located at said first major surface; a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; a second substrate comprising; a first major surface and a second major surface; a through hole, aligned with said optical sensor, for allowing light to be detected by said optical sensor; a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate; a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and a circuit board comprising; a first major surface and a second major surface; a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate; a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads; wherein said optical sensor is electrically connected to said third plurality of conductive pads on said circuit board.
Claim 24
Dependent Claim
51 words
The optical device structure of claim 20 wherein said second substrate is an optically transparent and monolithic lens element or multiple lens elements and wherein said first substrate, said optically transparent and monolithic lens element or multiple lens elements, and said circuit board are integrated with a hand held camera housing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-05-27 | 2005-11-26 | 2006-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-05-27 | 2009-11-26 | 2010-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-05-27 | 2013-11-26 | 2014-05-28 | $7700.00 | Window Closed / Lapsed |