§
Luxuse
Patent Intelligence
Sign In
← Back to Patent Explorer
US6376908B1 Expired / Lapsed US ⏱️ 0.0 years remaining

Semiconductor plastic package and process for the production thereof

Assignee: Mitsubishi Gas Chemical Co Inc
•
Filing: 1998-12-08
•
Granted: 2002-04-23
•
Expires: 2018-12-08
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board. The metal sheet is insulated from front and reverse circuit conductors with a heat-resistant resin composition, and the metal sheet is provided with a clearance hole having a diameter greater than a diameter of each of at least two through holes. The through-holes are provided in the clearance hole, and a through-hole or through-holes are insulated from the metal sheet with a resin composition, with at least one through-hole being connected to the metal sheet. One surface of the metal sheet is provided with at least one protrusion portion which is of the same size as the semiconductor chip and exposed on a surface, and the semiconductor chip is fixed on the protrusion portion.

Inventors

  • 👤 Morio Gaku
  • 👤 Nobuyuki Ikeguchi
  • 👤 Nobuyuki Yamane

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 21:17
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H05; H05K; H05K1/00; H05K1/18; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/11; H05K1/111; H05K1/112; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W40/228; H05K1/03; H05K1/05; H05K1/056; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0382; H05K2201/09; H05K2201/09009; H05K2201/09054; H05K2203/00; H05K2203/04; H05K2203/049; H05K3/00; H05K3/02; H05K3/06; H05K3/44; H05K3/445; H10W70/682; H10W70/685; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/737; H10W90/751; H10W90/754

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 257 words
A semiconductor plastic package structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to another signal propagation circuit conductor formed on another surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin, the printed circuit board having a metal sheet of nearly a same size as the printed circuit board and nearly in a center in a thickness direction of the printed circuit board, the metal sheet being insulated from front and reverse circuit conductors with a heat-resistant resin composition, the metal sheet being provided with at least one clearance hole having a diameter greater than a diameter of a through hole, the through hole being provided in the at least one clearance hole, and the through-hole being insulated from the metal sheet with a resin composition, at least one additional through-hole being connected to the metal sheet, one surface of the metal sheet being provided with at least one protrusion portion which is of a same size as the semiconductor chip and exposed on a surface, the semiconductor chip being fixed on the at least one protrusion portion, and another surface of the metal sheet being provided with a protrusion surface exposed for diffusing heat.
Claim 2
Dependent Claim 257 words
A semiconductor plastic package structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to another signal propagation circuit conductor formed on another surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin, the printed circuit board having a metal sheet of nearly a same size as the printed circuit board and nearly in a center in a thickness direction of the printed circuit board, the metal sheet being insulated from front and reverse circuit conductors with a heat-resistant resin composition, the metal sheet being provided with at least one clearance hole having a diameter greater than a diameter of a through hole, the through hole being provided in the at least one clearance hole, and the through-hole being insulated from the metal sheet with a resin composition, at least one additional through-hole being connected to the metal sheet, one surface of the metal sheet being provided with at least one protrusion portion which is of a same size as the semiconductor chip and exposed on a surface, the semiconductor chip being fixed on the at least one protrusion portion, and another surface of the metal sheet being provided with a protrusion surface exposed for diffusing heat.
Claim 3
Dependent Claim 39 words
A semiconductor plastic package according to claim 1 , wherein the at least one protrusion portion has a diameter or a side length that is 40 to 90% of a diameter or a side length of the semiconductor chip.
Claim 4
Dependent Claim 20 words
A semiconductor plastic package according to claim 2 , wherein the signal propagation circuit conductors have at least three layers.
Claim 5
Dependent Claim 53 words
A semiconductor plastic package according to claim 1 , wherein the metal sheet has portion which corresponds to a part or a whole of a marginal portion of the printed circuit board and is exposed on both the printed circuit board surface and the another surface thereof or on the another surface thereof.
Claim 6
Dependent Claim 32 words
A semiconductor plastic package according to claim 1 , wherein the at least one clearance hole has the form of a slit having a width greater than a diameter of the through-hole.

References Cited (Backward Citations)

US4682270A Cited
US4890152A Cited
US5397917A Cited
DE4443424A1 Cited
US5642261A Cited
EP0692823A1 Cited
US5710459A Cited
US6097089A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2005-04-22 2005-10-22 2006-04-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2009-04-22 2009-10-22 2010-04-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2013-04-22 2013-10-22 2014-04-23 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag