Patent US6369451B2 successfully refreshed from Google Patents.
US6369451B2
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US
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Solder balls and columns with stratified underfills on substrate for flip chip joining
Assignee: Chip Packaging Solutions LLC
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Filing: 1999-01-12
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Granted: 2002-04-09
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Expires: 2019-01-12
Abstract
Abstract The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on the substrate with each of said solder balls corresponding to a location of one of the input/output terminals on the integrated circuit wafer; 2) flipping the integrated circuit wafer for aligning each of the input/output terminals of the IC wafer to one of the solder balls; and 3) mounting the IC wafer onto the substrate for placing the I/O terminals on a corresponding solder ball and applying a reflow temperature for soldering the IC wafer to the substrate.
Inventors
- 👤 Paul T. Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 15:12
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0607; B23K3/0623; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W90/00; H10W90/701; B23K2101/00; B23K2101/36; B23K2101/40; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10719; H05K2203/00; H05K2203/04; H05K2203/041; H05K3/3465; H05K3/3473; H10W70/00; H10W70/60; H10W70/62; H10W70/65; H10W70/652; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12007; Y10T428/24; Y10T428/24802; Y10T428/24917
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
83 words
An integrated circuit (IC) package assembly comprising: an IC wafer having a plurality of input/output terminals each formed as a flip-chip solder-wettable metalization pad; a substrate for supporting and mounting said IC wafer thereon; and said substrate further having a plurality of solder attaching means disposed on top said substrate with each of said solder attaching means corresponding to a location of one of said input/output terminals on said integrated circuit wafer suitable for directly soldering and attaching to said solder-wettable metalization pad.
Claim 2
Dependent Claim
83 words
An integrated circuit (IC) package assembly comprising: an IC wafer having a plurality of input/output terminals each formed as a flip-chip solder-wettable metalization pad; a substrate for supporting and mounting said IC wafer thereon; and said substrate further having a plurality of solder attaching means disposed on top said substrate with each of said solder attaching means corresponding to a location of one of said input/output terminals on said integrated circuit wafer suitable for directly soldering and attaching to said solder-wettable metalization pad.
Claim 3
Dependent Claim
40 words
The IC package assembly of claim 1 wherein: said plurality of solder attaching means on said substrate are a plurality of solder balls disposed on top of said substrate suitable for directly soldering and attaching to said solder-wettable metalization pad.
Claim 4
Dependent Claim
44 words
The IC package assembly of claim 1 wherein: said plurality of solder attaching means on said substrate are a plurality of solder columns disposed on top of said substrate suitable for directly soldering and attaching to said solder-wettable metalization pad with sufficient standoff height.
Claim 5
Dependent Claim
44 words
The IC package assembly of claim 1 wherein: said plurality of solder attaching means on said substrate are a plurality of coated column each having a high-melting-point hourglass-shaped core with a predetermined standoff height for directly soldering and attaching to said solder-wettable metalization pad.
Claim 6
Dependent Claim
46 words
The IC package assembly of claim 1 wherein: said plurality of solder attaching means on said substrate are a plurality of coated solder balls each having a high-melting-point ball-shaped core with a predetermined standoff height suitable for directly soldering and attaching to said solder-wettable metalization pad.
Claim 7
Dependent Claim
41 words
The IC package assembly of claim 4 wherein: said plurality of solder columns are a plurality of I-shaped solder column disposed on top of said substrate with predetermined standoff height suitable for directly soldering and attaching to said solder-wettable metalization pad.
Claim 8
Dependent Claim
42 words
The IC package assembly of claim 1 further comprising: a photo-imageable layer disposed between said solder attaching means wherein said photo-imageable layer is provided to sustain a reflow temperature for directly soldering and attaching solder attaching means to said solder-wettable metalization pad.
Claim 9
Dependent Claim
23 words
The IC package assembly of claim 7 wherein: said photo-imageable layer disposed between said solder attaching means is a solvent dissolvable photo-imageable layer.
Claim 10
Dependent Claim
16 words
The IC package assembly of claim 7 wherein: said photo-imageable layer is an organic photo-imageable layer.
Claim 11
Dependent Claim
64 words
An integrated circuit (IC) package assembly comprising: an IC wafer having a plurality of input/output terminals each formed as a solder-wettable metalization pad; a substrate for supporting and mounting said IC waver thereon; and said substrate further includes a photo-imageable layer disposed on said substrate having a plurality of holes opened in locations corresponding to said plurality of input/output terminals of said IC wafer.
Claim 12
Dependent Claim
64 words
An integrated circuit (IC) package assembly comprising: an IC wafer having a plurality of input/output terminals each formed as a solder-wettable metalization pad; a substrate for supporting and mounting said IC waver thereon; and said substrate further includes a photo-imageable layer disposed on said substrate having a plurality of holes opened in locations corresponding to said plurality of input/output terminals of said IC wafer.
Claim 13
Dependent Claim
38 words
The IC package assembly of claim 10 further comprising: a plurality of solder attaching means filled in said holes with a soldering material suitable for directly soldering and attaching solder attaching means to said solder-wettable metalization contact pad.
Claim 14
Dependent Claim
37 words
The IC package assembly of claim 11 wherein: said solder attaching means filling said holes are solder pastes plated into said holes suitable for directly soldering and attaching solder attaching means to said solder-wettable metalization contact pad.
Claim 15
Dependent Claim
23 words
The IC package assembly of claim 10 wherein: said photo-imageable layer constituting an under-fill layer for packaging said IC wafer on said substrate.
Claim 16
Dependent Claim
30 words
The IC package assembly of claim 13 wherein: said under-fill layer further comprising at least two stratified under-fill layers wherein said layers having at least two different thermal expansion coefficients.
Claim 17
Dependent Claim
23 words
An integrated circuit (IC) wafer comprising: a plurality of input/output terminals wherein each of said input/output terminals comprising a solder-wettable metalization contact pad.
Claim 18
Dependent Claim
23 words
An integrated circuit (IC) wafer comprising: a plurality of input/output terminals wherein each of said input/output terminals comprising a solder-wettable metalization contact pad.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2005-04-08 | 2005-10-08 | 2006-04-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-04-08 | 2009-10-08 | 2010-04-09 | $3760.00 | Window Closed / Lapsed |
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