Patent US5521866A successfully refreshed from Google Patents.
Patent US6328427B1 successfully refreshed from Google Patents.
US6328427B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of producing a wiring substrate
Assignee: Canon Inc
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Filing: 1997-07-21
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Granted: 2001-12-11
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Expires: 2017-07-21
Abstract
Abstract A flexible printed circuit board has a copper foil serving as a conductive pattern, a nickel layer and a gold layer stacked in sequence on a base film made of polymide at an area to be electrically connected by wire bonding. The wire bonding is made by an aluminum wire and the nickel layer having a thickness of 10 mum to 20 mum. An ink jet recording head for discharging ink droplets from a discharge port onto a recording medium for recording thereon is electrically connected to an ink discharge unit by the flexible printed circuit board.
Inventors
- 👤 Kenjiro Watanabe
- 👤 Koji Yamakawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:07
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/22; H05K3/24; H05K3/244; B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/14; B41J2/14016; B41J2/14024; B41J2/14072; B41J2/16; B41J2/1601; B41J2/1621; B41J2/1623; B41J2/164; B41J2/1643; H01; H01R; H01R12/00; H01R12/50; H01R12/59; H01R12/62; H05K3/30; H05K3/32; H05K3/328; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2203/00; H05K2203/04; H05K2203/049; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
121 words
A method of producing a flexible wiring substrate electrically connected to a substrate by wire bonding, comprising the steps of: providing a base film of polymide; stacking a conductive layer comprising copper on said base film; stacking a closely bonding metal layer comprising nickel by plating on said conductive layer, said closely bonding metal layer having a thickness of 10-20 μm, so that said closely bonding metal layer is a plated layer; forming a gold plating layer on said closely bonding metal layer; aligning a contact section of said flexible wiring substrate and a contact section of said substrate to a predetermined position; and ultrasonically melt bonding an aluminum wire to the respective contact sections, thereby electrically connecting the contact sections.
Claim 2
Independent Claim
121 words
A method of producing a flexible wiring substrate electrically connected to a substrate by wire bonding, comprising the steps of: providing a base film of polymide; stacking a conductive layer comprising copper on said base film; stacking a closely bonding metal layer comprising nickel by plating on said conductive layer, said closely bonding metal layer having a thickness of 10-20 μm, so that said closely bonding metal layer is a plated layer; forming a gold plating layer on said closely bonding metal layer; aligning a contact section of said flexible wiring substrate and a contact section of said substrate to a predetermined position; and ultrasonically melt bonding an aluminum wire to the respective contact sections, thereby electrically connecting the contact sections.
Claim 3
Independent Claim
136 words
A method of producing an ink jet recording head emitting an ink for recording on a recording medium, wherein a flexible wiring substrate electrically connects a recording apparatus to an ink emitting section, comprising the steps of: providing a base film of polymide; stacking a conductive layer comprising copper on said base film; stacking a closely bonding metal layer comprising nickel on said conductive layer, said closely bonding metal layer having a thickness of 10-20 μm, so that said closely bonding metal layer is a plated layer; forming a gold plating layer on said closely bonding metal layer; aligning a contact section of said flexible wiring substrate and a contact section of said substrate to a predetermined position; and ultrasonically melt bonding an aluminum wire to the respective contact sections, thereby electrically connecting the contact sections.
Claim 4
Independent Claim
136 words
A method of producing an ink jet recording head emitting an ink for recording on a recording medium, wherein a flexible wiring substrate electrically connects a recording apparatus to an ink emitting section, comprising the steps of: providing a base film of polymide; stacking a conductive layer comprising copper on said base film; stacking a closely bonding metal layer comprising nickel on said conductive layer, said closely bonding metal layer having a thickness of 10-20 μm, so that said closely bonding metal layer is a plated layer; forming a gold plating layer on said closely bonding metal layer; aligning a contact section of said flexible wiring substrate and a contact section of said substrate to a predetermined position; and ultrasonically melt bonding an aluminum wire to the respective contact sections, thereby electrically connecting the contact sections.
Claim 5
Independent Claim
37 words
A method according to either of claims 1 or 2 , further comprising the step of providing a common supporting body, and wherein said substrate and said wiring substrate are both supported on said common supporting body.
Claim 6
Dependent Claim
24 words
A method according to claim 3 , further comprising the step of providing a reinforcement plate between said wiring substrate and said supporting body.
Claim 7
Dependent Claim
28 words
A method according to claim 4 , further comprising the step of bonding the base film of said wiring substrate to said reinforcement plate using epoxy bonding film.
Claim 8
Dependent Claim
26 words
A method according to claim 3 , further comprising the step of bonding said wiring substrate to said supporting body using an epoxy type bonding film.
Claim 9
Dependent Claim
32 words
A wiring substrate according to claim 3 , wherein said substrate comprises an electro-thermal transducer generating energy for emitting an ink, and said electro-thermal transducer is electrically connected to said aluminum wire.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-12-10 | 2005-06-11 | 2005-12-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-12-10 | 2009-06-11 | 2009-12-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-12-10 | 2013-06-11 | 2013-12-11 | $7700.00 | Window Closed / Lapsed |