Power heatsink for a circuit board

Claim 2

A heatsink for cooling an electronic device on a printed circuit board (PCB), said heatsink comprising a first attachment interface attachable to a mounting surface of the electronic device, said first attachment interface located on a heatsink portion formed to fit with an accommodation in the printed circuit board; a second attachment interface attachable to the printed circuit board; and a member extending away from said first interface.

Claim 3

The heatsink of claim 1 wherein said heatsink is electrically conductive.

Claim 4

The heatsink of claim 2 wherein said heatsink has an anchoring foot formed for attachment to a structure located aside from said printed circuit board.

Claim 5

The heatsink of claim 2 wherein said heatsink has a foot for connection to an electrical circuit.

Claim 6

The heatsink of claim 1 wherein said heatsink further comprises a card extraction tab.

Claim 7

The heatsink of claim 1 wherein said heatsink further comprises a first portion oriented to extend outwardly from the plane of the printed circuit board.

Claim 8

The heatsink of claim 1 wherein said member includes a first portion extending outwardly from the printed circuit board, and a second portion extending generally laterally from the first portion and separated from the PCB by a gap.

Claim 9

The heatsink of claim 1 wherein said member includes a riser extending outwardly from the PCB and a leg extending from the riser generally parallel to, and spaced from, the plane of the PCB.

Claim 10

The heatsink of claim 6 wherein said heatsink comprises first and second sections in a parallel, spaced relationship and a third section connecting said first section to said second section.

Claim 11

The heatsink of claim 1 wherein a top member extends outwardly from said member.

Claim 12

The heatsink of claim 10 wherein said top member has an allowance defined therein allowing introduction of the device therethrough.

Claim 13

The heatsink of claim 1 wherein said heatsink has a power device mounted thereon, said power device having leads extending therefrom, said leads being mountable to contacts on the printed circuit board.

Claim 14

A heatsink for cooling an electronic device on a printed circuit board (PCB), said heatsink comprising: a first attachment interfere attachable to a mounting surface of the electronic device, said first attachment interface located on a heatsink portion formed to fit with an accommodation in the printed circuit board; and a second attachment interface attachable to the printed circuit board, wherein said first and second attachment interfaces are located on opposite sides of said heatsink.

Claim 15

A heatsink for cooling an electronic device on a printed circuit board (PCB), said heatsink comprising: a first attachment interfere attachable to a mounting surface of the electronic device, said first attachment interface located on a heatsink portion formed to fit with an accommodation in the printed circuit board; and a second attachment interface attachable to the printed circuit board, wherein said first and second attachment interfaces are located on opposite sides of said heatsink.

Claim 16

The heatsink of claim 13 , said heatsink being chosen from the set of heatsinks consisting of heatsinks wherein: (a) said heatsink has said first attachment interface extending through said accommodation; (b) said heatsink has said first attachment interface extending part way into said accommodation; and (c) said heatsink has first attachment interface exposed by said accommodation.

Claim 17

The heatsink of claim 13 wherein said first attachment interface extends through said accommodation and said first attachment interface is chosen from the set of attachment interfaces consisting of (a) an attachment interface flush with a surface of said PCB; and (b) an attachment interface extending at least partially above said surface of said PCB.

Claim 18

The heatsink of claim 13 wherein said heatsink has a stepped portion located to lie in said accommodation.

Claim 19

The heatsink of claim 16 wherein said stepped portion has said first attachment interface located to lie flush with a surface of said PCB.

Claim 20

A printed circuit board assembly comprising: a printed circuit board (PCB) having a first and second surfaces and an opening in said PCB, said opening spanning from said first surface to said second surface; a heatsink comprising a first portion being attachable to said first surface, a leg extending through said opening and a casing seat portion extending from said leg, said casing seat portion being attachable to said second surface; and an electrical device having a casing mounted to said casing seat portion of said heatsink.

Claim 21

A printed circuit board assembly comprising: a printed circuit board (PCB) having a first and second surfaces and an opening in said PCB, said opening spanning from said first surface to said second surface; a heatsink comprising a first portion being attachable to said first surface, a leg extending through said opening and a casing seat portion extending from said leg, said casing seat portion being attachable to said second surface; and an electrical device having a casing mounted to said casing seat portion of said heatsink.

Claim 22

The assembly of claim 18 , said assembly being chosen from the set of assemblies consisting of assemblies wherein: (a) said heatsink has a casing seat portion extending through said opening and said casing is mounted to said casing seat portion; (b) said heatsink has a casing seat portion extending part way into said opening and said casing is mounted to said casing seat portion; and (c) said heatsink has a casing seat portion exposed by said opening and said casing seat portion is mounted through said opening.

Claim 23

The assembly of claim 18 wherein said heatsink has a casing seat portion that extends through said opening and said casing is mounted to said casing seat portion on an interface chosen from the set of interfaces consisting of (a) an interface flush with said second surface of said PCB; and (b) an interface extending at least partially above said second surface of said PCB.

Claim 24

The assembly of claim 18 wherein said heatsink has a casing seat portion that extends part way through said opening and said casing is mounted to said casing seat on an interface lying between said first and second surfaces of said PCB.

Claim 25

The assembly of claim 18 wherein said heatsink has a casing seat portion lying flush with said first surface of said PCB and said casing is located at least partially in said opening and is mounted to said casing seat.

Claim 26

The assembly of claim 18 wherein said casing and said heatsink form part of an electrically conductive path.

Claim 27

The assembly of claim 23 wherein said heatsink constitutes a voltage plane.

Claim 28

The assembly of claim 24 wherein said voltage plane is a ground plane.

Claim 29

The assembly of claim 23 wherein said heatsink has an electrical contact pin for locating in a socket of installation of said assembly in a computer.

Claim 30

The PCB assembly of claim 18 wherein said heatsink has a stepped portion located to lie in said opening.

Claim 31

The PCB assembly of claim 27 wherein said stepped portion has a casing seat located to lie flush with said second surface of said PCB.

Claim 32

The PCB assembly of claim 27 wherein said first and second surface of said PCB are substantially planar and parallel; said heatsink has a land mounted to said first surface of said PCB and lying in the plane of said first surface; and heatsink has a casing seat lying in a plane parallel to said plane of first surface; and said casing is mounted to said casing seat.

Claim 33

The PCB assembly of claim 18 wherein: said heatsink has a leg extending through said relief and a casing seat portion extending from said leg and lying along said other face of said PCB; and said casing is mounted to said casing seat portion.

Claim 34

The PCB assembly of claim 18 wherein said relief has in plan view, a form chosen from the set of shapes consisting of: (a) the shape of said casing in plan view; (b) a square; (c) a rectangle; (d) a circle; (e) a semicircle; (f) a rabbet let into an edge of said PCB; and (g) a rabbet let into a corner of said PCB.

Claim 35

A PCB assembly as claimed in claim 18 wherein said heatsink has a member standing outwardly from said one face of said PCB.

Claim 36

A PCB assembly as claimed in claim 32 wherein said heatsink has a leg extending outwardly from said first surface of said PCB; said leg has a distal end; and said heatsink has a wing extending from said distal end in spaced relationship from said first surface of said PCB.

Claim 37

The PCB assembly of claim 33 wherein said first surface of said PCB is substantially planar, and said wing has a support foot for mating with an adjacent structure located out of the plane of said first surface of said PCB.

Claim 38

The PCB assembly of claim 34 wherein said heatsink is electrically conductive and said foot is shaped for engagement with an electrically conductive socket.

Claim 39

The PCB assembly of claim 18 wherein another electrical device has a casing mounted to said heatsink and said other electrical device has at least one electrical contact connected to said first surface of said PCB.

Claim 40

The PCB assembly of claim 18 wherein: said opening is selected from the set of openings consisting of (a) an aperture having a continuous closed periphery let through the body of said PCB; (b) a rabbet extending inwardly from an edge of said PCB; and (c) a rabbet formed at a corner of said PCB; and first and second surfaces of said PCB arc substantially planar and mutually parallel; said heatsink has at least one substantially planar footing for mounting to said first surface; said heatsink has a stepped portion adjoining said footing, said stepped portion being located to extend through said relief; said stepped portion having a substantially planar casing seat lying flush with said second surface; said second surface having an electrical contact footprint adjacent to said relief; said casing is mounted to said casing seat and said at least one contact is connected to said footprint; said heatsink has a leg connected to said land portion, said leg extending substantially perpendicularly away from said one face of said PCB and having a distal end; said heatsink has a wing extending from said distal end of said leg substantially parallel to, and spaced from said first surface of said PCB; and said wing has a support foot for mating with a mounting socket, said foot lying out of the plane of said first surface.

Claim 41

A printed circuit board assembly comprising: a printed circuit board. (PCB) having a surface, said surface having an accommodation to fit with a component; a heatsink comprising a first attachment interface attachable to a mounting surface of the electronic device, said first attachment interface located on a heatsink portion formed to seat within said accommodation of the PCB; a second attachment interface attachable to the printed circuit board; and a member extending away from said first interface; and an electrical device having a casing and at least one electrical contact, said electrical contact being mounted to said surface, said casing being mounted to said heatsink.

Claim 42

A printed circuit board assembly comprising: a printed circuit board. (PCB) having a surface, said surface having an accommodation to fit with a component; a heatsink comprising a first attachment interface attachable to a mounting surface of the electronic device, said first attachment interface located on a heatsink portion formed to seat within said accommodation of the PCB; a second attachment interface attachable to the printed circuit board; and a member extending away from said first interface; and an electrical device having a casing and at least one electrical contact, said electrical contact being mounted to said surface, said casing being mounted to said heatsink.

Claim 43

The heatsink of claim 38 wherein said heatsink is electrically conductive.

Claim 44

The heatsink of claim 39 wherein said heatsink has an anchoring foot formed for attachment to a structure located aside from said printed circuit board.

Claim 45

The heatsink of claim 38 wherein said heatsink further comprises a card extraction tab.

Claim 46

The heatsink of claim 38 wherein said heatsink fisher comprises a first portion oriented to extend outwardly from the plane of the printed circuit board.

Claim 47

The heatsink of claim 38 wherein said member includes a first portion extending outwardly from the printed circuit board, and a second portion extending generally laterally from the first portion and separated from the PCB by a gap.