US6281448B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board and electronic components
Assignee: Panasonic Holdings Corp
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Filing: 1999-08-10
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Granted: 2001-08-28
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Expires: 2019-08-10
Abstract
Abstract A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
Inventors
- 👤 Masahide Tsukamoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:34
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H10; H10W; H10W99/00; H05K1/18; H05K1/181; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3478; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/42; H05K3/429; H05K3/46; H05K3/4602; H05K3/4611; H05K3/4614; H05K3/462; H05K3/4644; H05K3/4652; H05K3/4658; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W74/00; H10W74/10; H10W74/111; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2201/09536; H05K2201/09563; H05K2201/096; H05K2201/10; H05K2201/10227; H05K2201/10378; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/14; H05K2203/1461; H05K3/007; H05K3/10; H05K3/20; H05K3/22; H05K3/28; H05K3/4007; H05K3/4623; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155; Y10T29/49165; Y10T29/49345
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
146 words
A resin printed circuit board comprising: a base material layer made of an insulative resin and having a first via hole; and an insulting layer having a second via hole, said insulating layer being provided on at least one surface of said base material layer, wherein said first and second via holes are filled with a conductive material, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, and wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer.
Claim 2
Dependent Claim
146 words
A resin printed circuit board comprising: a base material layer made of an insulative resin and having a first via hole; and an insulting layer having a second via hole, said insulating layer being provided on at least one surface of said base material layer, wherein said first and second via holes are filled with a conductive material, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, and wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer.
Claim 3
Dependent Claim
17 words
A printed circuit board according to claim 1 , wherein said conductive material is a conductive paste.
Claim 4
Dependent Claim
36 words
A printed circuit board according to claim 2 , wherein said conductive material with which said first via hole is filled and said conductive material with which said second via hole is filled are the same.
Claim 5
Dependent Claim
35 words
A printed circuit board according to claim 2 , wherein said conductive material with which said first via hole is filled and said conductive material with which said second via hole is filled are different.
Claim 6
Dependent Claim
23 words
A printed circuit board according to claim 1 , wherein said insulating layer is provided on both surfaces of said base material layer.
Claim 7
Dependent Claim
19 words
A printed circuit board according to claim 1 , wherein a wiring portion is provided outside said insulating layer.
Claim 8
Dependent Claim
19 words
A printed circuit board according to claim 1 , wherein a wiring portion is provided inside said insulating layer.
Claim 9
Dependent Claim
18 words
A printed circuit board according to claim 7 , wherein said insulating layer comprises a plurality of layers.
Claim 10
Dependent Claim
19 words
A multilayer printed circuit board wherein a plurality of said printed circuit boards according to claim 1 are laminated.
Claim 11
Dependent Claim
41 words
A circuit component mount unit wherein a circuit component is mounted to said multilayer printed circuit board according to claim 9 , said circuit component being connected to a wiring portion of an outermost layer of said multilayer printed circuit board.
Claim 12
Dependent Claim
19 words
A circuit component mount unit according to claim 10 , wherein said circuit component includes a base integrated circuit.
Claim 13
Dependent Claim
39 words
A circuit component mount unit wherein a circuit component is mounted to said printed circuit board according to claim 1 , said circuit component being connected to a wiring portion of an outermost layer of said printed circuit board.
Claim 14
Dependent Claim
19 words
A circuit component mount unit according to claim 12 , wherein said circuit component includes a bare integrated circuit.
Claim 15
Dependent Claim
32 words
A printed circuit board according to claim 1 , wherein said insulative resin is one of an aramid epoxy prepreg, an insulative film coated with an adhesive, and a sheet-form unhardened adhesive.
Claim 16
Dependent Claim
172 words
An electronic component package comprising: a base material layer made of an insulative resin and having a first via hole, said base material having a copper foil pad attached to one surface; an insulating layer having a second via hole, said insulating layer being provided on another surface of said base material; and an electronic component having an electrode so as to correspond to a position of said second via hole, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, wherein said first and second via holes are filled with a conductive material, and wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer.
Claim 17
Dependent Claim
172 words
An electronic component package comprising: a base material layer made of an insulative resin and having a first via hole, said base material having a copper foil pad attached to one surface; an insulating layer having a second via hole, said insulating layer being provided on another surface of said base material; and an electronic component having an electrode so as to correspond to a position of said second via hole, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, wherein said first and second via holes are filled with a conductive material, and wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer.
Claim 18
Dependent Claim
17 words
An electronic component package according to claim 15 , wherein said conductive material is a copper paste.
Claim 19
Dependent Claim
16 words
An electronic component package according to claim 15 , wherein said conductive material includes an abrasive.
Claim 20
Dependent Claim
19 words
An electronic component package according to claim 15 , wherein said insulating layer and said conductive material have flexibility.
Claim 21
Dependent Claim
20 words
An electronic component package according to claim 15 , wherein said electrode of said electronic component is an aluminum electrode.
Claim 22
Dependent Claim
154 words
An electronic component package comprising: a base material layer made of an insulative resin and having a first via hole; an insulating layer having a second via hole, said insulating layer being provided on a surface of said base material; and an electronic component having an electrode so as to correspond to a position of said second via hole, wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer, wherein said first and second via holes are filled with a conductive material, and wherein said conductive material with which said first via hole is filled is solderable.
Claim 23
Dependent Claim
154 words
An electronic component package comprising: a base material layer made of an insulative resin and having a first via hole; an insulating layer having a second via hole, said insulating layer being provided on a surface of said base material; and an electronic component having an electrode so as to correspond to a position of said second via hole, wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer, wherein said first and second via holes are filled with a conductive material, and wherein said conductive material with which said first via hole is filled is solderable.
Claim 24
Dependent Claim
112 words
A printed circuit board comprising: a base material layer having a first via hole; and an insulting layer having a second via hole, said insulating layer being provided on at least one surface of said base material layer, wherein said first and second via holes each are filled with a conductive material, wherein said conductive material filling first via hole is different from said conductive material filling said second via hole, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, and wherein a part of said conductive material from said second via hole also is embedded in said first via hole.
Claim 25
Dependent Claim
112 words
A printed circuit board comprising: a base material layer having a first via hole; and an insulting layer having a second via hole, said insulating layer being provided on at least one surface of said base material layer, wherein said first and second via holes each are filled with a conductive material, wherein said conductive material filling first via hole is different from said conductive material filling said second via hole, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, and wherein a part of said conductive material from said second via hole also is embedded in said first via hole.
Claim 26
Dependent Claim
37 words
A printed circuit board according to claims 1 and 21 further comprising a via pad over said second via hole, said via pad having a cross-sectional area smaller than said cross-sectional area of said first via hole.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-27 | 2005-02-26 | 2005-08-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-27 | 2009-02-26 | 2009-08-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-27 | 2013-02-26 | 2013-08-28 | $7700.00 | Window Closed / Lapsed |