EP0567306A2
Expired / Lapsed
EP
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A multilayer printed circuit board and method for its manufacture
Assignee: Nippon CMK Corp
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Filing: 1993-04-21
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Granted: —
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Expires: 2013-04-21
Abstract
Abstract There is described a multilayer printed circuit board, and a method of manufacturing same. The manufacturing method comprises forming connection holes in lands on an inner substrate (1), and forming corresponding connection holes in the outer substrates (2, 3). The inner substrate (1) and the outer substrates (2, 3) are adhered to each other with adhesive sheets (8). Then the connection holes are filled with conductive paste (37). The connection holes (15, 16, 24, 25, 30, 31) in the outer substrates (2, 3) have a diameter larger than those of the connection holes (17, 26, 32) in the inner substrate (1) so that the exposed areas of the lands on the inner substrate are enlarged. The lands (12, 20, 28, 33) on the inner substrate (1) have contact with the conductive paste (37) over a large area to enhance conductivity. <IMAGE>
Inventors
- 👤 Masuo c/o Nippon CMK Corporation Matsumoto
- 👤 Fusao c/o Nippon CMK Corporation Birukawa
- 👤 Takazo c/o Nippon CMK Corporation Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 10:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069; H05K3/38; H05K3/386; H05K3/46; H05K3/4602; H05K3/4644; H05K3/4652; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/09818; H05K2201/09845; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/0554; H05K2203/06; H05K2203/063; H05K2203/10; H05K2203/107; H05K2203/14; H05K2203/1453; H05K3/0011; H05K3/0017; H05K3/002; H05K3/22; H05K3/28
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
86 words
A multilayer printed circuit board, comprising:- an inner substrate having a land and a connection hole; and an outer substrate having a land and a connection hole communicating with the connection hole of said inner substrate, the connection holes of said inner and outer substrates being filled with conductive paste to communicate the lands on said inner and outer substrates with each other, wherein the diameter of the connection hole of said outer substrate is larger than that of the connection hole of said inner substrate.
Claim 2
Dependent Claim
86 words
A multilayer printed circuit board, comprising:- an inner substrate having a land and a connection hole; and an outer substrate having a land and a connection hole communicating with the connection hole of said inner substrate, the connection holes of said inner and outer substrates being filled with conductive paste to communicate the lands on said inner and outer substrates with each other, wherein the diameter of the connection hole of said outer substrate is larger than that of the connection hole of said inner substrate.
Claim 3
Dependent Claim
31 words
A multilayer printed circuit board as claimed in claim 1, further comprising an air passage hole for allowing air inside the board to leak out during filling with said conductive paste.
Claim 4
Independent Claim
129 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of:- (a) forming a connection hole through a land on an inner substrate, forming a connection hole through a land on an outer substrate, the diameter of which latter is larger than that of the connection hole through said inner substrate; (b) laminating said inner and outer substrates through an adhesive sheet provided with a hole on the portion facing the connection hole of said inner substrate to communicate said connection hole of said inner substrate with said connection hole of said outer substrate, said hole of said adhesive sheet being larger than that of the connection hole of said inner substrate; and (c) filling said connection holes communicating with each other with conductive paste.
Claim 5
Independent Claim
129 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of:- (a) forming a connection hole through a land on an inner substrate, forming a connection hole through a land on an outer substrate, the diameter of which latter is larger than that of the connection hole through said inner substrate; (b) laminating said inner and outer substrates through an adhesive sheet provided with a hole on the portion facing the connection hole of said inner substrate to communicate said connection hole of said inner substrate with said connection hole of said outer substrate, said hole of said adhesive sheet being larger than that of the connection hole of said inner substrate; and (c) filling said connection holes communicating with each other with conductive paste.
Claim 6
Independent Claim
83 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of:- (a) laminating an outer substrate on an inner substrate provided with a land thereon; (b) forming a connection hole near said land and through said inner substrate; (c) forming a land on said outer substrate and a connection hole by removing the insulating layer inside the land on said outer substrate to expose the land on said inner substrate; and (d) filling said connection holes with conductive paste.
Claim 7
Independent Claim
83 words
A method of manufacturing a multilayer printed circuit board, said method comprising the steps of:- (a) laminating an outer substrate on an inner substrate provided with a land thereon; (b) forming a connection hole near said land and through said inner substrate; (c) forming a land on said outer substrate and a connection hole by removing the insulating layer inside the land on said outer substrate to expose the land on said inner substrate; and (d) filling said connection holes with conductive paste.
Claim 8
Independent Claim
27 words
A method as claimed in either one of claims 3 or 4, wherein said connection holes are filled with conductive paste before being filled with solder material.
References Cited (Backward Citations)
No citation records indexed.
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