Patent US6274890B1 successfully refreshed from Google Patents.
US6274890B1
Expired / Lapsed
US
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Semiconductor light emitting device and its manufacturing method
Assignee: Toshiba Corp
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Filing: 1998-01-13
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Granted: 2001-08-14
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Expires: 2018-01-13
Abstract
Abstract A semiconductor light emitting device includes a semiconductor light emitting element ( 1 ), a resin stem ( 10 ) having a recess ( 7 ), and a projection ( 9 ) made of a light-transmissive thermosetting resin on the resin stem so as to cover the entire upper surface and continuous upper part of side surfaces of the resin stem to a predetermined depth. The recess is filled with a light-transmissive resin encapsulating element ( 5 ) to embed the semiconductor light emitting element, one end of an externally extended first lead ( 21 ) and one end of an externally extended second lead ( 22 ) electrically connected to first and second electrodes of the semiconductor light emitting element, and a bonding wires ( 4 ) connecting the second lead to the second electrode. The projection functions as a lens and is made by hardening a fluid-state resin in an encapsulating case mold. Since the projection extends over the upper surface and upper part of side surfaces continuous from the upper surface, it is firmly bonded to the resin stem with a high adherability.
Inventors
- 👤 Hiroaki Oshio
- 👤 Iwao Matsumoto
- 👤 Tsuguo Uchino
- 👤 Hiroshi Nagasawa
- 👤 Tadashi Umegi
- 👤 Satoshi Komoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:41
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/852; H10H20/853; H10H20/01; H10H20/034; H10H20/036; H10H20/0362; H10H20/84; H10H20/8506; H10H20/851; H10H20/854; H10H20/855; H10H20/857; H10H20/8514; H10H20/8515; H10H20/856; H10H20/882; H10W; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
212 words
A semiconductor light emitting device comprising: a semiconductor light emitting element; a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element; a light-transmissive resin filling said recess of said resin stem; and a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around, said projection not in contact with said first and second leads extending from said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
Claim 2
Dependent Claim
212 words
A semiconductor light emitting device comprising: a semiconductor light emitting element; a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element; a light-transmissive resin filling said recess of said resin stem; and a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around, said projection not in contact with said first and second leads extending from said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
Claim 3
Dependent Claim
43 words
The semiconductor light emitting device according to claim 1 wherein said projection forms a lens having a vertical axis aligned with a vertical axis of said resin stem, these center axes being aligned with a vertical axis of said semiconductor light emitting element.
Claim 4
Dependent Claim
25 words
The semiconductor light emitting device according to claim 2 wherein said resin stem has at least one through hole in the bottom of said recess.
Claim 5
Dependent Claim
29 words
The semiconductor light emitting device according to claim 2 wherein said resin stem has at least one through hole extending from the upper surface to the lower surface thereof.
Claim 6
Dependent Claim
28 words
The semiconductor light emitting device according to claim 2 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element into different wavelength light.
Claim 7
Dependent Claim
23 words
The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in said resin portion of said resin stem.
Claim 8
Dependent Claim
26 words
The semiconductor light emitting device according to claim 5 wherein said fluorescent element is applied onto inner wall surfaces of said recess of said resin stem.
Claim 9
Dependent Claim
37 words
The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in a mounting adhesive applied onto the bottom surface of said semiconductor light emitting element ( 1 , 1 ′, 1 ″).
Claim 10
Dependent Claim
22 words
The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in said light-transmissive resin filling said recess.
Claim 11
Dependent Claim
22 words
The semiconductor light emitting device according to claim 5 wherein said fluorescent element is contained in said light-transmissive resin forming said projection.
Claim 12
Dependent Claim
247 words
A semiconductor light emitting device comprising: a semiconductor light emitting element; a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element; a light-transmissive resin filling said recess of said resin stem; and a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around; wherein said recess of said resin stem is longer in a first horizontal direction in which said first and second leads extend than in a second horizontal direction normal to said first horizontal direction, and said projection is not in contact with said first and second leads at said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
Claim 13
Dependent Claim
247 words
A semiconductor light emitting device comprising: a semiconductor light emitting element; a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead externally extending from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element; a light-transmissive resin filling said recess of said resin stem; and a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around; wherein said recess of said resin stem is longer in a first horizontal direction in which said first and second leads extend than in a second horizontal direction normal to said first horizontal direction, and said projection is not in contact with said first and second leads at said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
Claim 14
Dependent Claim
48 words
The semiconductor light emitting device according to claim 11 wherein said first electrode of said semiconductor light emitting element is connected to said first lead a bonding wire, and said second electrode of said semiconductor light emitting element is connected to said second lead by a bonding wire.
Claim 15
Dependent Claim
43 words
The semiconductor light emitting device according to claim 12 wherein said projection forms a lens having a vertical axis aligned with a vertical axis of said resin stem, these center axes being aligned with a vertical axis of said semiconductor light emitting element.
Claim 16
Dependent Claim
28 words
The semiconductor light emitting device according to claim 13 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element into different wavelength light.
Claim 17
Dependent Claim
28 words
The semiconductor light emitting device according to claim 11 wherein the vertical center line of said recess is offset from the vertical center line of said resin stem.
Claim 18
Dependent Claim
56 words
The semiconductor light emitting device according to claim 15 wherein a second electrode of said semiconductor light emitting element is connected to said second lead a bonding wire, and the vertical center line of said recess is offset from the vertical center line of said resin stem toward the externally extending direction of said second lead.
Claim 19
Dependent Claim
43 words
The semiconductor light emitting device according to claim 16 wherein said projection forms a lens having a vertical axis aligned with a vertical axis of said resin stem, these center axes being aligned with a vertical axis of said semiconductor light emitting element.
Claim 20
Dependent Claim
28 words
The semiconductor light emitting device according to claim 17 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element into different wavelength light.
Claim 21
Dependent Claim
224 words
A semiconductor light emitting device comprising: a semiconductor light emitting element; a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead extending externally from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element; a light-transmissive resin filling said recess of said resin stem; and a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around; wherein inner side surfaces of said recess serve as reflective surfaces, and said projection is not in contact with said first and second leads on said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
Claim 22
Dependent Claim
224 words
A semiconductor light emitting device comprising: a semiconductor light emitting element; a resin stem having a first lead, a second lead and a resin portion partly covering said first and second leads, one end of said first lead and one end of said second lead extending externally from the lower part of the side surfaces of said resin portion, and said resin portion having a recess containing said semiconductor light emitting element, the other end of said first lead electrically connected to a first electrode of said semiconductor light emitting element, and the other end of said second lead electrically connected to a second electrode of said semiconductor light emitting element; a light-transmissive resin filling said recess of said resin stem; and a projection comprising a light-transmissive thermosetting resin to cover the entire upper surface of said resin stem, said projection extending down onto side surfaces of said resin stem to a predetermined distance from said upper surface to continuously cover the upper part of the side surfaces all around; wherein inner side surfaces of said recess serve as reflective surfaces, and said projection is not in contact with said first and second leads on said side surfaces of said resin portion, wherein said lower part of said side surfaces protrude farther than said upper part of said side surfaces of said resin portion.
Claim 23
Dependent Claim
64 words
The semiconductor light emitting device according to claim 19 wherein said resin portion of said resin stem is made from a thermoplastic resin not less than 65 weight % and a filler agent not more than 35 weight %, said filler agent being a high reflective material containing titanium oxide, silicon oxide, and/or aluminum oxide, and titanium oxide occupying 10 to 15 weight %.
Claim 24
Dependent Claim
43 words
The semiconductor light emitting device according to claim 20 wherein said projection forms a lens having a vertical axis aligned with a vertical axis of said resin stem, these center axes being aligned with a vertical axis of said semiconductor light emitting element.
Claim 25
Dependent Claim
28 words
The semiconductor light emitting device according to claim 21 further comprising a fluorescent element for converting light emanating from said semiconductor light emitting element into different wavelength light.
Claim 26
Dependent Claim
16 words
The semiconductor light emitting device according to claim 1 wherein said resin portion is thermoplastic resin.
Claim 27
Dependent Claim
16 words
The semiconductor light emitting device according to claim 11 wherein said resin portion is thermoplastic resin.
Claim 28
Dependent Claim
16 words
The semiconductor light emitting device according to claim 19 wherein said resin portion is thermoplastic resin.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-08-13 | 2005-02-12 | 2005-08-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-08-13 | 2009-02-12 | 2009-08-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-08-13 | 2013-02-12 | 2013-08-14 | $7700.00 | Window Closed / Lapsed |