Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
248 words
A method for forming a square oxide structure without a rounding effect at its corners comprising the steps of: a. providing a semiconductor structure having a pad layer thereon; b. forming a first dielectric layer on said pad layer and forming a Second dielectric layer on said first dielectric layer; said second dielectric layer being composed of a different material than said first dielectric layer; c. patterning said Second dielectric layer to form openings in said Second dielectric layer in a first direction; d. forming a second photosensitive mask over said Second dielectric layer and said first dielectric layer; said second photosensitive mask having a plurality of parallel openings in a second direction perpendicular to said first direction; thereby forming square openings where said openings in said second photosensitive mask intersect said openings in said Second dielectric layer; e. etching said first dielectric layer through said square openings where said openings in said second photosensitive mask and said openings in said Second dielectric layer intersect; thereby forming square openings in said first dielectric layer; f. removing said second photosensitive mask; g. removing said Second dielectric layer; whereby exposed portions of said pad layer are also removed; h. etching a trench in said semiconductor structure through said square openings in said first dielectric layer; and i. forming an STI oxide layer over said semiconductor structure and said first dielectric layer and etching said STI oxide layer back to form square oxide areas without a rounding effect at its corners.
Claim 2
Independent Claim
248 words
A method for forming a square oxide structure without a rounding effect at its corners comprising the steps of: a. providing a semiconductor structure having a pad layer thereon; b. forming a first dielectric layer on said pad layer and forming a Second dielectric layer on said first dielectric layer; said second dielectric layer being composed of a different material than said first dielectric layer; c. patterning said Second dielectric layer to form openings in said Second dielectric layer in a first direction; d. forming a second photosensitive mask over said Second dielectric layer and said first dielectric layer; said second photosensitive mask having a plurality of parallel openings in a second direction perpendicular to said first direction; thereby forming square openings where said openings in said second photosensitive mask intersect said openings in said Second dielectric layer; e. etching said first dielectric layer through said square openings where said openings in said second photosensitive mask and said openings in said Second dielectric layer intersect; thereby forming square openings in said first dielectric layer; f. removing said second photosensitive mask; g. removing said Second dielectric layer; whereby exposed portions of said pad layer are also removed; h. etching a trench in said semiconductor structure through said square openings in said first dielectric layer; and i. forming an STI oxide layer over said semiconductor structure and said first dielectric layer and etching said STI oxide layer back to form square oxide areas without a rounding effect at its corners.
Claim 3
Dependent Claim
21 words
The method of claim 1 wherein said second photosensitive mask has a thickness of between about 7000 Angstroms and 10000 Angstroms.
Claim 4
Dependent Claim
27 words
The method of claim 1 wherein said first dielectric layer is composed of silicon nitride and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 5
Dependent Claim
27 words
The method of claim 2 wherein said first dielectric layer is composed of silicon nitride and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 6
Dependent Claim
27 words
The method of claim 1 wherein said second dielectric layer is composed of silicon dioxide and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 7
Dependent Claim
26 words
The method of claim 4 wherein said second dielectric layer is composed of silicon dioxide has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 8
Dependent Claim
42 words
The method of claim 1 wherein said Second dielectric layer is patterned by forming a first photosensitive mask over said Second dilectric layer having a plurality of parallel openings in said first direction, and etching said Second dielectric layer through said openings.
Claim 9
Independent Claim
247 words
A method for forming a square floating gate in a split-gate cell without a rounding effect at its corners, comprising the steps of: a. providing a semiconductor structure having a pad layer on said semiconductor structure, and a polysilicon layer on said pad layer; b. forming a first dielectric layer on said polysilicon layer; c. forming a Second dielectric layer on said first dielectric layer; d. patterning said Second dielectric layer; thereby forming a plurality of parallel openings in said Second dielectric layer in a first direction; e. forming a second photosensitive mask over said Second dielectric layer and said first dielectric layer; said second photosensitive mask having a plurality of parallel openings in a second direction perpendicular to said first direction; whereby said openings in said second photosensitive mask and said openings in said Second dielectric layer form square openings at their intersection; f. etching said first dielectric layer through said openings in said second photosensitive mask and said openings in said Second dielectric layer; thereby forming square openings in said first dielectric layer; g. removing said second photosensitive mask; h. removing said Second dielectric layer; i. growing polysilicon oxide structures in said square openings in said first dielectric layer, thereby forming a plurality of square polysilicon oxide hard masks having a pattern of openings therebetween; and j. etching said polysilicon layer through said pattern of openings between said polysilicon oxide hard masks; thereby forming square floating gate polysilicon regions under said polysilicon oxide hard masks.
Claim 10
Independent Claim
247 words
A method for forming a square floating gate in a split-gate cell without a rounding effect at its corners, comprising the steps of: a. providing a semiconductor structure having a pad layer on said semiconductor structure, and a polysilicon layer on said pad layer; b. forming a first dielectric layer on said polysilicon layer; c. forming a Second dielectric layer on said first dielectric layer; d. patterning said Second dielectric layer; thereby forming a plurality of parallel openings in said Second dielectric layer in a first direction; e. forming a second photosensitive mask over said Second dielectric layer and said first dielectric layer; said second photosensitive mask having a plurality of parallel openings in a second direction perpendicular to said first direction; whereby said openings in said second photosensitive mask and said openings in said Second dielectric layer form square openings at their intersection; f. etching said first dielectric layer through said openings in said second photosensitive mask and said openings in said Second dielectric layer; thereby forming square openings in said first dielectric layer; g. removing said second photosensitive mask; h. removing said Second dielectric layer; i. growing polysilicon oxide structures in said square openings in said first dielectric layer, thereby forming a plurality of square polysilicon oxide hard masks having a pattern of openings therebetween; and j. etching said polysilicon layer through said pattern of openings between said polysilicon oxide hard masks; thereby forming square floating gate polysilicon regions under said polysilicon oxide hard masks.
Claim 11
Dependent Claim
21 words
The method of claim 8 wherein said second photosensitive mask has a thickness of between about 7000 Angstroms and 10000 Angstroms.
Claim 12
Dependent Claim
27 words
The method of claim 8 wherein said first dielectric layer is composed of silicon nitride and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 13
Dependent Claim
27 words
The method of claim 9 wherein said first dielectric layer is composed of silicon nitride and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 14
Dependent Claim
27 words
The method of claim 8 wherein said Second dielectric layer is composed of silicon dioxide and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 15
Dependent Claim
27 words
The method of claim 9 wherein said Second dielectric layer is composed of silicon dioxide and has a thickness of between about 1500 Angstroms and 2000 Angstroms.
Claim 16
Dependent Claim
42 words
The method of claim 8 wherein said Second dielectric layer is patterned by forming a first photosensitive mask over said Second dielectric layer having a plurality of parallel openings in said first direction, and etching said Second dielectric layer through said openings.