Process for producing wire connections on an electronic component assembly carrier made by the process

Claim 1

An assembly comprising an assembly carrier; at least one electrical or electronic component arranged on the assembly carrier; conductor paths arranged on the assembly carrier; a plurality of connection surfaces located between the component and the conductor paths at a distance from the conductor paths; first wires connecting the connection surfaces with at least a part of the connections of the component; and second wires connecting connection surfaces with the conductor paths, so that a first end of one of the first wires is connected with one of the connections of the component, a first end of one of the second wires is connected with one of the conductor paths, while a second end of the same first wire and a second end of the same second wire are connected with one of the connection surfaces associated with the one conductor path, the first end of the one first wire being connected with the one connection of the component and the first end of the one second wire being connected with the one conductor path by first ball-shaped deforming each of the first ends and then welding each ball-shaped deformed first end to the one connection of the component and to the one conductor path correspondingly, the second end of the same first wire and the second end of the same second wire being connected to the one connection surface by broadening out of each second end and then welding each broadened out second end to the one connection surface, and the connection surfaces being arranged between the component and ends of the conductor paths in several rows with offset relative to one another and also being arranged in a common plane on assembly carrier.