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US6181015B1
Expired / Lapsed
US
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Face-down mounted surface acoustic wave device
Assignee: TDK Corp
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Filing: 1999-02-22
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Granted: 2001-01-30
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Expires: 2019-02-22
Abstract
Abstract In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21 a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to be put on at least a part of the main mounting surface 21 a so as to remain edge portions which do not cover at least a part of the electrode pattern 25, and a protection layer 32 for protecting the main mounting surface is further provided at a distance from the main mounting surface 21 a so as to be put on the electrically insulating layer 31, so that the bump electrodes 22 are connected to the electrode pattern 25 while being in contact with the edge portions of the electrically insulating layer 31 and the protection layer 32.
Inventors
- 👤 Masashi Gotoh
- 👤 Jitsuo Kanazawa
- 👤 Hajime Kuwajima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:50
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/02; H03H9/05; H03H9/10; H03H9/1064; H03H9/1085; H03H9/058; H03H9/059; H03H9/1092; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
118 words
A chip device comprising: a device substrate; an electrode pattern and an active region provided on a main mounting surface of said device substrate; an external electrode provided for face-down mounting; and a first electrically insulating layer formed on at least a part of said main mounting surface to form a frame body to expose said active region and at least a part of said electrode pattern; wherein said external electrodes are connected to said electrode pattern while said external electrodes are in contact with edge portions of said electrically insulating layer; and said first electrically insulating layer is interposed between said main mounting surface and a mount-side base substrate while not extending completely under said active region.
Claim 2
Dependent Claim
118 words
A chip device comprising: a device substrate; an electrode pattern and an active region provided on a main mounting surface of said device substrate; an external electrode provided for face-down mounting; and a first electrically insulating layer formed on at least a part of said main mounting surface to form a frame body to expose said active region and at least a part of said electrode pattern; wherein said external electrodes are connected to said electrode pattern while said external electrodes are in contact with edge portions of said electrically insulating layer; and said first electrically insulating layer is interposed between said main mounting surface and a mount-side base substrate while not extending completely under said active region.
Claim 3
Dependent Claim
41 words
A chip device according to claim 1 , further comprising: a second electrically insulating layer provided at a distance from said main mounting surface so as to be put on said first electrically insulating layer to protect said main mounting surface.
Claim 4
Dependent Claim
59 words
A chip device according to claim 1 , wherein said main mounting surface in said active region has comb electrodes for a surface acoustic wave device formed as a part of said electrode pattern, and said first electrically insulating layer comes into close contact with said mount-side substrate to thereby form a closed space which encloses said active region.
Claim 5
Dependent Claim
59 words
A chip device according to claim 2 , wherein said main mounting surface in said active region has comb electrodes for a surface acoustic wave device formed as a part of said electrode pattern, and said first electrically insulating layer comes into close contact with said mount-side substrate to thereby form a closed space which encloses said active region.
References Cited (Backward Citations)
US3885173A
Cited
JPH0555303A
Cited
EP0740343A2
Cited
US5757078A
Cited
JPH08307197A
Cited
JPH09246905A
Cited
JPH1174755A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-30 | 2004-07-31 | 2005-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-30 | 2008-07-31 | 2009-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-30 | 2012-07-31 | 2013-01-30 | $7700.00 | Window Closed / Lapsed |