US6181003B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device packaged in plastic package
Assignee: Oki Electric Industry Co Ltd
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Filing: 1997-09-08
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Granted: 2001-01-30
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Expires: 2017-09-08
Abstract
Abstract A semiconductor device packaged in a plastic package, the semiconductor device being provided with a semiconductor device chip further provided with plural leads arranged along the top surface of the semiconductor device chip and a plastic mold covering the semiconductor device chip, wherein the plastic mold is limited to the top surface of the semiconductor device chip and the shape of the leads is J-shape or U-shape, whereby the connection between the leads and a printed board is made strong, resulting enhanced reliability of the semiconductor device from the electrical and mechanical viewpoints.
Inventors
- 👤 Shinji Ohuchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 10:41
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W70/427; H10W70/429; H10W74/00; H10W74/10; H10W74/111; H10W72/00; H10W72/071; H10W72/073; H10W72/075; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; H10W99/00
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
118 words
A semiconductor device comprising: a semiconductor device chip having a plurality of electrodes disposed on a top surface of said semiconductor device chip: a plurality of leads each having a first end and a second end, said first end being disposed on the top surface of said semiconductor device chip, and said second end being folded back at a location close to the edge of said semiconductor device chip, said second end being closer to the top surface of said semiconductor device chip than to a bottom surface of said semiconductor device chip; a plurality of conductor members connecting said electrodes and said leads; and a plastic mold covering said electrodes and said first end of said leads.
Claim 2
Dependent Claim
118 words
A semiconductor device comprising: a semiconductor device chip having a plurality of electrodes disposed on a top surface of said semiconductor device chip: a plurality of leads each having a first end and a second end, said first end being disposed on the top surface of said semiconductor device chip, and said second end being folded back at a location close to the edge of said semiconductor device chip, said second end being closer to the top surface of said semiconductor device chip than to a bottom surface of said semiconductor device chip; a plurality of conductor members connecting said electrodes and said leads; and a plastic mold covering said electrodes and said first end of said leads.
Claim 3
Dependent Claim
22 words
A semiconductor device in accordance with claim 1 , wherein said second end of said leads is disposed in said plastic mold.
Claim 4
Dependent Claim
25 words
A semiconductor device in accordance with claim 1 , wherein said second end of said leads is disposed over said first end of said leads.
References Cited (Backward Citations)
US5200364A
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US5053852A
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US5291038A
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US5548087A
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US5600179A
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US5844307A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-30 | 2004-07-31 | 2005-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-30 | 2008-07-31 | 2009-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-30 | 2012-07-31 | 2013-01-30 | $7700.00 | Window Closed / Lapsed |