US6174174B1 — Socket for IC and method for manufacturing IC

Claim 1

Independent Claim 167 words

A socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to said contact electrodes; an anisotropic electrically conductive adhesive arranged on said contact electrodes of said printed circuit board; a base block arranged on said one surface of said printed circuit board and having an opening for setting said IC therein, said opening facing said anisotropic electrically conductive adhesive; and a plurality of coil-shaped contacts arranged in said opening, one ends of which are positioned above said contact electrodes via said anisotropic electrically conductive adhesive and the other ends of which are protruded from said opening; said contact electrodes and the coil-shaped contacts facing each other via said anisotropic electrically conductive adhesive being mechanically and electrically connected to each other via said anisotropic electrically conductive adhesive.

Claim 2

Dependent Claim 167 words

A socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to said contact electrodes; an anisotropic electrically conductive adhesive arranged on said contact electrodes of said printed circuit board; a base block arranged on said one surface of said printed circuit board and having an opening for setting said IC therein, said opening facing said anisotropic electrically conductive adhesive; and a plurality of coil-shaped contacts arranged in said opening, one ends of which are positioned above said contact electrodes via said anisotropic electrically conductive adhesive and the other ends of which are protruded from said opening; said contact electrodes and the coil-shaped contacts facing each other via said anisotropic electrically conductive adhesive being mechanically and electrically connected to each other via said anisotropic electrically conductive adhesive.

Claim 3

Dependent Claim 25 words

The socket for an IC according to claim 1 wherein said coil-shaped contacts are connected to said anisotropic electrically conductive adhesive by curing on heating.

Claim 4

Dependent Claim 42 words

The socket for an IC according to claim 1 wherein said opening is made up of a plurality of through-holes in which said coil-shaped contacts are positioned, with the ends of said coil-shaped contacts being protruded via upper portions of said through-holes.

Claim 5

Dependent Claim 32 words

The socket for an IC according to claim 1 wherein said terminal electrodes provided on said printed circuit board are formed at a pitch enlarged from the pitch of said contact electrodes.

Claim 6

Dependent Claim 45 words

The socket for an IC according to claim 1 wherein said opening in said base block is positioned facing said anisotropic electrically conductive adhesive on the bottom surface of a recess formed in an outer lateral surface at a mid portion of said base block.

Claim 7

Dependent Claim 31 words

The socket for an IC according to claim 5 further comprising: an adapter fitted in said recess for operating as a frame used to delimit the setting position for the IC.

Claim 8

Dependent Claim 194 words

A socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes respectively connected to said contact electrodes; a base block for setting said IC therein, said base block being arranged on said one surface of said printed circuit board and having a plurality of through-holes facing sais contact electrodes; an electrically conductive film formed on an inner peripheral surface of each of said through-holes; and a plurality of coil-shaped contacts arranged in said plural through-holes, one ends of said coil-shaped contacts being contacted with said contact electrodes and the opposite ends thereof being protruded from said through-holes; said coil-shaped contacts having the opposite ends thereof thrust by said external electrodes of the IC so that the coil-shaped contacts are contacted with the electrically conductive films provided in said through-holes, said electrically conductive films operating in conjunction with said coil-shaped contacts as a connecting conductor between the external electrodes of the IC and said contact electrodes.

Claim 9

Dependent Claim 194 words

A socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes respectively connected to said contact electrodes; a base block for setting said IC therein, said base block being arranged on said one surface of said printed circuit board and having a plurality of through-holes facing sais contact electrodes; an electrically conductive film formed on an inner peripheral surface of each of said through-holes; and a plurality of coil-shaped contacts arranged in said plural through-holes, one ends of said coil-shaped contacts being contacted with said contact electrodes and the opposite ends thereof being protruded from said through-holes; said coil-shaped contacts having the opposite ends thereof thrust by said external electrodes of the IC so that the coil-shaped contacts are contacted with the electrically conductive films provided in said through-holes, said electrically conductive films operating in conjunction with said coil-shaped contacts as a connecting conductor between the external electrodes of the IC and said contact electrodes.

Claim 10

Dependent Claim 32 words

The socket for an IC according to claim 7 wherein said terminal electrodes formed on said printed circuit board are formed at a pitch enlarged from the pitch of the contact electrodes.

Claim 11

Dependent Claim 56 words

The socket for an IC according to claim 7 wherein an anisotropic electrically conductive adhesive is interposed between said printed circuit board and the base block, said contact electrodes and the coil-shaped contacts facing each other via said anisotropic electrically conductive adhesive being mechanically and electrically connected to each other via said anisotropic electrically conductive adhesive.

Claim 12

Dependent Claim 63 words

The socket for an IC according to claim 7 wherein an electrode film is formed as-one with said electrically conductive film on the rim of the opening of each through-hole towards the printed circuit board, said electrode film being electrically connected via the anisotropic electrically conductive adhesive to said contact electrodes adapted for facing said electrode film via said anisotropic electrically conductive adhesive.

Claim 13

Dependent Claim 135 words

A socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes respectively connected to said contact electrodes; a base block for setting said IC therein, said base block being arranged on said one surface of said printed circuit board and having a plurality of through-holes facing sais contact electrodes; a magnetic film formed on an inner peripheral surface of each of said through-holes; and a plurality of coil-shaped contacts arranged in said plural through-holes, one ends of said coil-shaped contacts being contacted with said contact electrodes and the other ends thereof being protruded from said through-holes.

Claim 14

Dependent Claim 135 words

A socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes respectively connected to said contact electrodes; a base block for setting said IC therein, said base block being arranged on said one surface of said printed circuit board and having a plurality of through-holes facing sais contact electrodes; a magnetic film formed on an inner peripheral surface of each of said through-holes; and a plurality of coil-shaped contacts arranged in said plural through-holes, one ends of said coil-shaped contacts being contacted with said contact electrodes and the other ends thereof being protruded from said through-holes.

Claim 15

Dependent Claim 31 words

The socket for an IC according to claim 11 wherein an electrically conductive film is layered on the magnetic film provided on the inner peripheral surface of each of the through-hole.

Claim 16

Dependent Claim 56 words

The socket for an IC according to claim 11 wherein an anisotropic electrically conductive adhesive is interposed between said printed circuit board and the base block, said contact electrodes and the coil-shaped contacts facing each other via said anisotropic electrically conductive adhesive being mechanically and electrically connected to each other via said anisotropic electrically conductive adhesive.

Claim 17

Dependent Claim 32 words

The socket for an IC according to claim 11 wherein said terminal electrodes provided on said printed circuit board are formed at a pitch enlarged from the pitch of said contact electrodes.

Claim 18

Independent Claim 220 words

A method for producing an IC using a socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to said contact electrodes, an anisotropic electrically conductive adhesive arranged on said contact electrodes of said printed circuit board, a base block arranged on said one surface of said printed circuit board and having an opening for setting said IC therein, said opening facing said anisotropic electrically conductive adhesive, and a plurality of coil-shaped contacts arranged in said opening, one ends of which are positioned above said contact electrodes via said anisotropic electrically conductive adhesive and the other ends of which are protruded from said opening, said contact electrodes and the coil-shaped contacts facing each other via said anisotropic electrically conductive adhesive being mechanically and electrically connected to each other via said anisotropic electrically conductive adhesive, said method comprising: a step of testing electrical properties of the IC with the IC being set on said base block of said socket for contacting said external electrodes of the IC with said coil-shaped contacts, with said terminal electrodes being connected to a test board.

Claim 19

Independent Claim 220 words

A method for producing an IC using a socket for an IC comprising: a printed circuit board on one surface of which a plurality of contact electrodes are arranged at the same pitch as an arraying pitch of external electrodes for the IC and on the opposite surface of which are arranged a plurality of terminal electrodes connected to said contact electrodes, an anisotropic electrically conductive adhesive arranged on said contact electrodes of said printed circuit board, a base block arranged on said one surface of said printed circuit board and having an opening for setting said IC therein, said opening facing said anisotropic electrically conductive adhesive, and a plurality of coil-shaped contacts arranged in said opening, one ends of which are positioned above said contact electrodes via said anisotropic electrically conductive adhesive and the other ends of which are protruded from said opening, said contact electrodes and the coil-shaped contacts facing each other via said anisotropic electrically conductive adhesive being mechanically and electrically connected to each other via said anisotropic electrically conductive adhesive, said method comprising: a step of testing electrical properties of the IC with the IC being set on said base block of said socket for contacting said external electrodes of the IC with said coil-shaped contacts, with said terminal electrodes being connected to a test board.

Claim 20

Dependent Claim 35 words

The method according to claim 15 wherein said terminal electrodes provided on said printed circuit board of said socket for the IC are formed at a pitch enlarged from the pitch of said contact electrodes.

Claim 21

Dependent Claim 42 words

The method according to claim 15 wherein said opening provided in said socket for the IC is made up of a plurality of through-holes facing said contact electrodes via said anisotropic electrically conductive adhesive, said coil-shaped contacts being positioned in said through-holes.

Claim 22

Dependent Claim 27 words

The method according to claim 17 wherein an electrically conductive film is formed on the inner peripheral surface of the through-hole of said socket for the IC.

Claim 23

Dependent Claim 26 words

The method according to claim 17 wherein a magnetic film is formed on the inner peripheral surface of the through-hole of said socket for the IC.

Claim 24

Dependent Claim 31 words

The method according to claim 17 wherein a magnetic film and an electrically conductive film are layered on the inner peripheral surface of the through-hole of said socket for the IC.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2004-01-16	2004-07-17	2005-01-16	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2008-01-16	2008-07-17	2009-01-16	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2012-01-16	2012-07-17	2013-01-16	$7700.00	Window Closed / Lapsed

Socket for IC and method for manufacturing IC

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