US4806111A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Connector structure
Assignee: Hitachi Ltd
•
Filing: 1986-11-03
•
Granted: 1989-02-21
•
Expires: 2006-11-03
Abstract
Abstract A connector structure comprising an electrically conductive plate having a plurality of through holes formed therein, an electrically insulated film formed on the inner wall of at least one of the through holes, an electrically conductive film formed on the inner wall of at least one other through hole, and an electrically conductive material of a low melting point provided within the through holes. The low melting point material provided in the through holes whose inner walls are coated with an electrically insulating film is insulated from the electrically conductive plate and such through holes may serve to receive signal propagating pins. The low melting point material in the through holes whose inner walls are coated with an electrically conductive film are tightly bonded to its inner wall due to the wettability between the low melting point material and the electrically conductive film so that such through holes may serve to receive a common potential pin to electrically stabilize the electrically conductive plate and to reduce electrical capacitance unnecessarily formed between the signal propagating pin receiving through holes. Thus, the connector structure is adapted for a high speed signal transmission without suffering substantial crosstalk noise.
Inventors
- 👤 Masaaki Nishi
- 👤 Moritoshi Yasunaga
- 👤 Ryotaro Kamikawai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 18:53
CPC Classifications
H; H01; H01R; H01R12/00; H01R12/50; H01R12/51; H01R12/52; H01R13/00; H01R13/02; H01R13/03; H01R13/648; H01R13/658; H01R13/6581; H01R13/6585; H01R13/6586; H01R4/00; H01R4/02; H01R4/028; Y; Y10; Y10S; Y10S439/00; Y10S439/931
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
79 words
A connector structure comprising: an electrically conductive plate having a plurality of through holes formed therein; an electrically insulating film formed on the inner wall of at least one of said plurality of through holes with at least one of said plurality of through holes being not covered with an electrically insulating film; an electrically conductive film formed on the inner wall of at least one of the through holes which is not covered with an electrically insulating film.
Claim 2
Dependent Claim
79 words
A connector structure comprising: an electrically conductive plate having a plurality of through holes formed therein; an electrically insulating film formed on the inner wall of at least one of said plurality of through holes with at least one of said plurality of through holes being not covered with an electrically insulating film; an electrically conductive film formed on the inner wall of at least one of the through holes which is not covered with an electrically insulating film.
Claim 3
Dependent Claim
45 words
A connector structure according to claim 1, in which the thickness of the insulating film on the inner wall of at least one of the through holes is less than 1/3 as that of the insulating film on the inner wall of other through holes.
Claim 4
Dependent Claim
28 words
A connector structure according to claim 1, in which at least one of the electrically insulating film on the inner wall of through holes is a ferroelectric film.
Claim 5
Dependent Claim
19 words
A connector structure according to claim 1, in which said electrically conductive material is a low melting point metal.
Claim 6
Dependent Claim
24 words
A connector structure according to claim 1, in which said electrically insulating film on the inner wall of through holes is an oxide film.
Claim 7
Dependent Claim
31 words
A connector structure according to claim 1, in which said electrically insulating film on the inner wall of through hole said at least one is made of a high molecular compound.
Claim 8
Dependent Claim
92 words
A connector structure comprising: an electrically conductive plate having a plurality of through holes formed therein; an electrically insulating film formed on the inner wall of at least one of said plurality of through holes with at least one of said plurality of through holes being not covered with an electrically insulating film; an electrically conductive material provided within at least one of those of said plurality of through holes; and an electrically conductive film formed on at least one of the electrically insulating film on the inner wall of through holes.
Claim 9
Dependent Claim
92 words
A connector structure comprising: an electrically conductive plate having a plurality of through holes formed therein; an electrically insulating film formed on the inner wall of at least one of said plurality of through holes with at least one of said plurality of through holes being not covered with an electrically insulating film; an electrically conductive material provided within at least one of those of said plurality of through holes; and an electrically conductive film formed on at least one of the electrically insulating film on the inner wall of through holes.
Claim 10
Dependent Claim
96 words
A connector structure comprising: an electrically conductive plate made of a material having a temperature coefficient substantially identical with that of a semiconductor substrate in which semiconductor devices may be formed, said plate having a plurality of through holes formed therein; an electrically insulating film formed on the inner wall of at least one of said plurality of through holes with at least one of said plurality of through holes being not covered with an electrically insulating film; and an electrically conductive material provided within at least one of those of said plurality of through holes.
Claim 11
Dependent Claim
96 words
A connector structure comprising: an electrically conductive plate made of a material having a temperature coefficient substantially identical with that of a semiconductor substrate in which semiconductor devices may be formed, said plate having a plurality of through holes formed therein; an electrically insulating film formed on the inner wall of at least one of said plurality of through holes with at least one of said plurality of through holes being not covered with an electrically insulating film; and an electrically conductive material provided within at least one of those of said plurality of through holes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-21 | 1992-08-22 | 1993-02-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-21 | 1996-08-22 | 1997-02-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-21 | 2000-08-22 | 2001-02-21 | $7700.00 | Window Closed / Lapsed |