US6154371A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board assembly and method
Assignee: Cisco Technology Inc
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Filing: 1998-09-30
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Granted: 2000-11-28
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Expires: 2018-09-30
Abstract
Abstract A printed circuit board assembly incorporates an opening into which one or more integrated circuit packages at least partially fit, a plurality of electrical connection pads are disposed about the periphery of the opening, corresponding leads of the integrated circuit package are bonded to the pads, and the overall assembly is thinner than an assembly lacking the opening.
Inventors
- 👤 Glenn George Oba
- 👤 Indrajit Rajeev Gajendran
- 👤 Victor Vigdorchik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 09:22
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09072; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H05K3/36; H05K3/368
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
164 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface; and a second integrated circuit package disposed at least partially in said opening, said second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and said second integrated circuit package has at least a portion located outside said opening.
Claim 2
Dependent Claim
164 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface; and a second integrated circuit package disposed at least partially in said opening, said second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and said second integrated circuit package has at least a portion located outside said opening.
Claim 3
Dependent Claim
149 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface; and a second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and wherein said second integrated circuit package is located outside said opening.
Claim 4
Dependent Claim
149 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface; and a second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and wherein said second integrated circuit package is located outside said opening.
Claim 5
Dependent Claim
19 words
The assembly of claim 2 wherein said second integrated circuit package is located over said first integrated circuit package.
Claim 6
Dependent Claim
164 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and; a second integrated circuit package disposed at least partially in said opening, said second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and said second integrated circuit package has at least a portion located outside said opening.
Claim 7
Dependent Claim
164 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and; a second integrated circuit package disposed at least partially in said opening, said second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and said second integrated circuit package has at least a portion located outside said opening.
Claim 8
Dependent Claim
148 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and; a second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and said second integrated circuit package is located outside said opening.
Claim 9
Dependent Claim
148 words
A printed circuit board assembly, comprising: a printed circuit board having first and second opposed outer surfaces, an opening extending from said first outer surface, and a plurality of first connection pads disposed on said first outer surface adjacent to said opening; a first integrated circuit package received at least partially in said opening, and having a plurality of leads connected to corresponding ones of said plurality of first connection pads on said first outer surface, wherein said opening extends completely between said first and second opposed outer surfaces of said printed circuit board, and; a second integrated circuit package having a plurality of leads connected to corresponding second connection pads on said second opposed outer surface of said printed circuit board adjacent said opening, wherein said first integrated circuit package is located intermediate said opposed surfaces, and said second integrated circuit package is located outside said opening.
Claim 10
Dependent Claim
19 words
The assembly of claim 5 wherein said second integrated circuit package is located over said first integrated circuit package.
Claim 11
Independent Claim
146 words
A method of forming a printed circuit board assembly, comprising the steps of: forming a printed circuit board having an opening extending completely between a first outside surface and a second outside surface of said printed circuit board, having a plurality of connection pads disposed on said first surface about a periphery of said opening, and having a plurality of connection pads disposed on said second surface about a periphery of said opening; placing a first integrated circuit package completely in said opening; connecting leads of said first integrated circuit package to corresponding ones of said connection pads disposed on said first surface about a periphery of said opening; placing a second integrated circuit package completely in said opening; and connecting leads of said second integrated circuit package to corresponding ones of said connection pads disposed on said second surface about a periphery of said opening.
Claim 12
Independent Claim
146 words
A method of forming a printed circuit board assembly, comprising the steps of: forming a printed circuit board having an opening extending completely between a first outside surface and a second outside surface of said printed circuit board, having a plurality of connection pads disposed on said first surface about a periphery of said opening, and having a plurality of connection pads disposed on said second surface about a periphery of said opening; placing a first integrated circuit package completely in said opening; connecting leads of said first integrated circuit package to corresponding ones of said connection pads disposed on said first surface about a periphery of said opening; placing a second integrated circuit package completely in said opening; and connecting leads of said second integrated circuit package to corresponding ones of said connection pads disposed on said second surface about a periphery of said opening.
Claim 13
Independent Claim
148 words
A method of forming a printed circuit board assembly, comprising the steps of: forming a printed circuit board having an opening extending completely between a first outside surface and a second outside surface of said printed circuit board, having a plurality of connection pads disposed on said first surface about a periphery of said opening, and having a plurality of connection pads disposed on said second surface about a periphery of said opening; placing a first integrated circuit package completely in said opening; connecting leads of said first integrated circuit package to corresponding ones of said connection pads disposed on said first surface about a periphery of said opening; placing a second integrated circuit package at least partially in said opening; and connecting leads of said second integrated circuit package to corresponding ones of said connection pads disposed on said second surface about a periphery of said opening.
Claim 14
Independent Claim
148 words
A method of forming a printed circuit board assembly, comprising the steps of: forming a printed circuit board having an opening extending completely between a first outside surface and a second outside surface of said printed circuit board, having a plurality of connection pads disposed on said first surface about a periphery of said opening, and having a plurality of connection pads disposed on said second surface about a periphery of said opening; placing a first integrated circuit package completely in said opening; connecting leads of said first integrated circuit package to corresponding ones of said connection pads disposed on said first surface about a periphery of said opening; placing a second integrated circuit package at least partially in said opening; and connecting leads of said second integrated circuit package to corresponding ones of said connection pads disposed on said second surface about a periphery of said opening.
Claim 15
Dependent Claim
19 words
The method of claim 8, wherein said second integrated circuit package is located over said first integrated circuit package.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-28 | 2004-05-29 | 2004-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-28 | 2008-05-29 | 2008-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-28 | 2012-05-29 | 2012-11-28 | $7700.00 | Window Closed / Lapsed |