US6154366A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structures and processes for fabricating moisture resistant chip-on-flex packages
Assignee: Intel Corp
•
Filing: 1999-11-23
•
Granted: 2000-11-28
•
Expires: 2019-11-23
Abstract
Abstract A chip-on-flex package which includes at least one moisture barrier layer to prevent metal corrosion and delamination of flex component layers. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side, wherein the microelectronic die active surface includes at least one contact. A flex component is attached by a first surface to the microelectronic die active surface. At least one conductive trace is disposed on a second surface of the flex component and extends through the flex component to contact at least one of the contacts. An encapsulation material is adjacent the microelectronic die side and a bottom surface of the flex component. A moisture barrier is disposed on the flex component and the conductive trace(s). A second moisture barrier may be disposed on the encapsulation material. A heat dissipation device may also be incorporated into the chip-on-flex package.
Inventors
- 👤 Qing Ma
- 👤 Chun Mu
- 👤 Harry Fujimoto
- 👤 John Carruthers
- 👤 Jian Li
- 👤 Chuanbin Pan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:06
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W70/01; H10W70/05; H10W70/08; H10W70/09; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/20; H10W72/241; H10W72/90; H10W72/941; H10W72/9413
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
124 words
A microelectronic package, comprising: a microelectronic die having an active surface, a back surface, and at least one side, said microelectronic die active surface including at least one contact; a flex component having a first surface attached to said microelectronic die active surface; at least one conductive trace disposed on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; encapsulation material adjacent said at least one microelectronic die side, wherein a first surface of said encapsulation material is adjacent said bottom surface of said flex component; and a first moisture barrier disposed on said flex component and said at least one conductive trace.
Claim 2
Dependent Claim
124 words
A microelectronic package, comprising: a microelectronic die having an active surface, a back surface, and at least one side, said microelectronic die active surface including at least one contact; a flex component having a first surface attached to said microelectronic die active surface; at least one conductive trace disposed on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; encapsulation material adjacent said at least one microelectronic die side, wherein a first surface of said encapsulation material is adjacent said bottom surface of said flex component; and a first moisture barrier disposed on said flex component and said at least one conductive trace.
Claim 3
Dependent Claim
15 words
The microelectronic package of claim 1, wherein said first moisture barrier comprises a metal oxide.
Claim 4
Dependent Claim
22 words
The microelectronic package of claim 2, wherein said metal oxide is selected from the group consisting of tungsten oxide and titanium oxide.
Claim 5
Dependent Claim
15 words
The microelectronic package of claim 1, wherein said first moisture barrier comprises an organic coating.
Claim 6
Dependent Claim
12 words
The microelectronic package of claim 4, wherein said organic coating comprises polychloro-trifluro-ethylene.
Claim 7
Dependent Claim
21 words
The microelectronic package of claim 1, further including a second moisture barrier disposed on a second surface of said encapsulation material.
Claim 8
Dependent Claim
15 words
The microelectronic package of claim 6, wherein said second moisture barrier comprises a metal oxide.
Claim 9
Dependent Claim
22 words
The microelectronic package of claim 7, wherein said metal oxide is selected from the group consisting of tungsten oxide and titanium oxide.
Claim 10
Dependent Claim
15 words
The microelectronic package of claim 6, wherein said second moisture barrier comprises an organic coating.
Claim 11
Dependent Claim
12 words
The microelectronic package of claim 9, wherein said organic coating comprises polychloro-trifluro-ethylene.
Claim 12
Dependent Claim
21 words
The microelectronic package of claim 1, further including a heat dissipation device in thermal contact with said microelectronic die back surface.
Claim 13
Dependent Claim
122 words
A microelectronic package, comprising: a microelectronic die having an active surface, and at least one side, said microelectronic die active surface including at least one contact; a flex component having a first surface attached to said microelectronic die active surface; at least one conductive trace disposed on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; a back side moisture barrier adjacent said at least one microelectronic die side and said bottom surface of said flex component; encapsulation material adjacent said back side moisture barrier; and a moisture barrier disposed on said flex component and said at least one conductive trace.
Claim 14
Dependent Claim
122 words
A microelectronic package, comprising: a microelectronic die having an active surface, and at least one side, said microelectronic die active surface including at least one contact; a flex component having a first surface attached to said microelectronic die active surface; at least one conductive trace disposed on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; a back side moisture barrier adjacent said at least one microelectronic die side and said bottom surface of said flex component; encapsulation material adjacent said back side moisture barrier; and a moisture barrier disposed on said flex component and said at least one conductive trace.
Claim 15
Dependent Claim
14 words
The microelectronic package of claim 12, wherein said moisture barrier comprises a metal oxide.
Claim 16
Dependent Claim
22 words
The microelectronic package of claim 13, wherein said metal oxide is selected from the group consisting of tungsten oxide and titanium oxide.
Claim 17
Dependent Claim
14 words
The microelectronic package of claim 12, wherein said moisture barrier comprises an organic coating.
Claim 18
Dependent Claim
12 words
The microelectronic package of claim 15, wherein said organic coating comprises polychloro-trifluro-ethylene.
Claim 19
Dependent Claim
16 words
The microelectronic package of claim 12, wherein said back side moisture barrier comprises a metal oxide.
Claim 20
Dependent Claim
22 words
The microelectronic package of claim 17, wherein said metal oxide is selected from the group consisting of tungsten oxide and titanium oxide.
Claim 21
Dependent Claim
16 words
The microelectronic package of claim 12, wherein said back side moisture barrier comprises an organic coating.
Claim 22
Dependent Claim
12 words
The microelectronic package of claim 19, wherein said organic coating comprises polychloro-trifluro-ethylene.
Claim 23
Dependent Claim
21 words
The microelectronic package of claim 12, further including a heat dissipation device in thermal contact with said microelectronic die back surface.
Claim 24
Independent Claim
131 words
A method of fabrication a microelectronic package, comprising: providing a microelectronic die having an active surface, a back surface, and at least one side, said microelectronic die active surface including at least one contact; attaching a first surface of a flex component to said microelectronic die active surface; disposing at least one conductive trace on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; disposing an encapsulation material adjacent said at least one microelectronic die side, wherein a first surface of said encapsulation material is adjacent said bottom surface of said flex component; and disposing a first moisture barrier on said flex component and said at least one conductive trace.
Claim 25
Independent Claim
131 words
A method of fabrication a microelectronic package, comprising: providing a microelectronic die having an active surface, a back surface, and at least one side, said microelectronic die active surface including at least one contact; attaching a first surface of a flex component to said microelectronic die active surface; disposing at least one conductive trace on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; disposing an encapsulation material adjacent said at least one microelectronic die side, wherein a first surface of said encapsulation material is adjacent said bottom surface of said flex component; and disposing a first moisture barrier on said flex component and said at least one conductive trace.
Claim 26
Dependent Claim
18 words
The method of claim 22, further comprising attaching a heat dissipation device to said microelectronic die back surface.
Claim 27
Dependent Claim
26 words
The method of claim 23, wherein said disposing said encapsulation material comprises disposing said encapsulation material adjacent at least one side of said heat dissipation device.
Claim 28
Dependent Claim
43 words
The method of claim 24, wherein said disposing said encapsulation material comprises disposing said encapsulation material adjacent a back surface of said heat dissipation device; and further comprising removing a portion of said encapsulation material to expose said heat dissipation device back surface.
Claim 29
Independent Claim
128 words
A method of fabricating a microelectronic package, comprising: providing a microelectronic die having an active surface, and at least one side, said microelectronic die active surface including at least one contact; attaching a first surface of a flex component to said microelectronic die active surface; disposing at least one conductive trace on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; forming a back side moisture barrier adjacent said at least one microelectronic die side and said bottom surface of said flex component; encapsulation material adjacent said back side moisture barrier; and disposing a moisture barrier on said flex component and said at least one conductive trace.
Claim 30
Independent Claim
128 words
A method of fabricating a microelectronic package, comprising: providing a microelectronic die having an active surface, and at least one side, said microelectronic die active surface including at least one contact; attaching a first surface of a flex component to said microelectronic die active surface; disposing at least one conductive trace on a second surface of said flex component, wherein a portion of said at least one conductive trace extends through said flex component to contact said at least one said contact; forming a back side moisture barrier adjacent said at least one microelectronic die side and said bottom surface of said flex component; encapsulation material adjacent said back side moisture barrier; and disposing a moisture barrier on said flex component and said at least one conductive trace.
Claim 31
Dependent Claim
18 words
The method of claim 26, further comprising attaching a heat dissipation device to said microelectronic die back surface.
Claim 32
Dependent Claim
31 words
The method of claim 27, wherein said forming said back side moisture barrier further comprises forming said back side moisture barrier adjacent at least one side of said heat dissipation device.
Claim 33
Dependent Claim
75 words
The method of claim 28, wherein said forming said back side moisture barrier further comprises forming said back side moisture barrier adjacent a back side of said heat dissipation device; wherein said disposing said encapsulation material further comprises disposing said encapsulation material adjacent said moisture barrier adjacent said heat dissipation device back surface; and further comprising removing a portion of said encapsulation material and said moisture barrier to expose said heat dissipation device back surface.
References Cited (Backward Citations)
US4544989A
Cited
US5422513A
Cited
US5353498A
Cited
US5497033A
Cited
US5650662A
Cited
US5527741A
Cited
US5701032A
Cited
US5745984A
Cited
US5784780A
Cited
US5703400A
Cited
US6011694A
Cited
US5868887A
Cited
US6020637A
Cited
US6025995A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-28 | 2004-05-29 | 2004-11-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-28 | 2008-05-29 | 2008-11-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-28 | 2012-05-29 | 2012-11-28 | $7700.00 | Window Closed / Lapsed |