Multi-chip semiconductor device and method of producing the same

Claim 1

A method of producing a semiconductor device comprising the steps of: a) mounting semiconductor chips on the upper major surface of a wiring circuit board; b) accommodating a packing member in a groove provided in a cap in which a plurality of radiating fins and a cavity are formed; c) attaching the cap to the wiring circuit board and attaching a base member to the underside of the wiring circuit board; and d) fixing the cap and the base member to each other using a screw coupling mechanism.

Claim 2

A method of producing a semiconductor device comprising the steps of: a) mounting semiconductor chips on the upper major surface of a wiring circuit board; b) accommodating a packing member in a groove provided in a cap in which a plurality of radiating fins and a cavity are formed; c) attaching the cap to the wiring circuit board and attaching a base member to the underside of the wiring circuit board; and d) fixing the cap and the base member to each other using a screw coupling mechanism.

Claim 3

A method of producing a semiconductor device comprising the steps of: a) mounting semiconductor chips on the upper major surface and the lower major surface of a circuit board including a ceramic base board having a higher heat conductivity than a normal ceramic base board; b) attaching upper heat conductive blocks either on the upper major surface of an upper group of semiconductor chips mounted on said circuit board or on the upper major surface of said ceramic base board or on both; c) forming a resin package for encapsulating said circuit board, said upper group of semiconductor chips, said upper heat conductive blocks and a lower group of semiconductor chips mounted on the lower major surface of said circuit board; d) lapping the upper major surface of said resin package formed in the step c) so as to expose said upper heat conductive blocks; and e) attaching a heat sink to the lapped upper major surface of said resin package.

Claim 4

A method of producing a semiconductor device comprising the steps of: a) mounting semiconductor chips on the upper major surface and the lower major surface of a circuit board including a ceramic base board having a higher heat conductivity than a normal ceramic base board; b) attaching upper heat conductive blocks either on the upper major surface of an upper group of semiconductor chips mounted on said circuit board or on the upper major surface of said ceramic base board or on both; c) forming a resin package for encapsulating said circuit board, said upper group of semiconductor chips, said upper heat conductive blocks and a lower group of semiconductor chips mounted on the lower major surface of said circuit board; d) lapping the upper major surface of said resin package formed in the step c) so as to expose said upper heat conductive blocks; and e) attaching a heat sink to the lapped upper major surface of said resin package.

Claim 5

A method of producing a semiconductor device comprising the steps of: a) mounting semiconductor chips on the upper major surface and the lower major surface of a circuit board including a ceramic base board having a higher heat conductivity than a normal ceramic base board; b) attaching upper heat conductive blocks either on the upper major surface of an upper group of semiconductor chips mounted on said circuit board or on the upper major surface of said ceramic base board or on both, and attaching lower heat conductive blocks either on the lower major surface of a lower group of semiconductor chips or on the lower major surface of said circuit board or on both; c) forming a resin package for encapsulating said circuit board, said upper group of semiconductor chips, said upper heat conductive blocks, the lower group of semiconductor chips mounted on the lower major surface of said circuit board and the lower heat conductive blocks; d) lapping the upper major surface of said resin package formed in the step c) so as to expose said upper heat conductive blocks, and lapping the lower major surface of said resin package so as to expose said lower heat conductive blocks; and e) attaching a heat sink to the lapped upper major surface of said resin package, and attaching, to the lapped lower major surface of said resin package, a heat conductive plate which dissipates the heat and transfers the heat to a motherboard on which the semiconductor device is mounted.

Claim 6

A method of producing a semiconductor device comprising the steps of: a) mounting semiconductor chips on the upper major surface and the lower major surface of a circuit board including a ceramic base board having a higher heat conductivity than a normal ceramic base board; b) attaching upper heat conductive blocks either on the upper major surface of an upper group of semiconductor chips mounted on said circuit board or on the upper major surface of said ceramic base board or on both, and attaching lower heat conductive blocks either on the lower major surface of a lower group of semiconductor chips or on the lower major surface of said circuit board or on both; c) forming a resin package for encapsulating said circuit board, said upper group of semiconductor chips, said upper heat conductive blocks, the lower group of semiconductor chips mounted on the lower major surface of said circuit board and the lower heat conductive blocks; d) lapping the upper major surface of said resin package formed in the step c) so as to expose said upper heat conductive blocks, and lapping the lower major surface of said resin package so as to expose said lower heat conductive blocks; and e) attaching a heat sink to the lapped upper major surface of said resin package, and attaching, to the lapped lower major surface of said resin package, a heat conductive plate which dissipates the heat and transfers the heat to a motherboard on which the semiconductor device is mounted.