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US6143581A Expired / Lapsed US ⏱️ 0.0 years remaining

Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

Assignee: Micron Technology Inc
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Filing: 1999-02-22
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Granted: 2000-11-07
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Expires: 2019-02-22
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Abstract

Abstract A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

Inventors

  • 👤 Mark S. Johnson
  • 👤 Todd O. Bolken

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 15:34
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14336; B29C45/14418; B29C45/14639; B29C45/14655; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W74/114; B29C2045/14672; H10W72/00; H10W72/071; H10W72/075; H10W72/90; H10W72/951; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T428/00; Y10T428/13; Y10T428/1352; Y10T428/23; Y10T428/239

Claims Analysis

Total Claims: 30
Claim 1
Independent Claim 68 words
A method of encapsulating an article having first and second surfaces, comprising: positioning a first molding section in a sealing relationship with the first surface of the article; positioning a second molding section adjacent the second surface of the article; filling the first molding section thereby forcing the second surface of the article into a sealing engagement with the second molding section; and filling the second molding section.
Claim 2
Independent Claim 68 words
A method of encapsulating an article having first and second surfaces, comprising: positioning a first molding section in a sealing relationship with the first surface of the article; positioning a second molding section adjacent the second surface of the article; filling the first molding section thereby forcing the second surface of the article into a sealing engagement with the second molding section; and filling the second molding section.
Claim 3
Dependent Claim 46 words
The method of claim 1 wherein said step of filling said first and second molding sections includes the step of filling said first and second molding sections with an encapsulating material chosen from a class consisting of epoxies, including thermo-set resins, silicones, sycar, polyimides, and polyurethanes.
Claim 4
Dependent Claim 13 words
The method of claim 2 including the step of curing said encapsulating material.
Claim 5
Independent Claim 68 words
A method of encapsulating an electrical device positioned on a flexible substrate, comprising: positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section; forming a seal between the substrate and the second molding section by filling the first molding section; and filling the second molding section.
Claim 6
Independent Claim 68 words
A method of encapsulating an electrical device positioned on a flexible substrate, comprising: positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section; forming a seal between the substrate and the second molding section by filling the first molding section; and filling the second molding section.
Claim 7
Dependent Claim 31 words
The method of claim 4 wherein said step of filling said first and second molding sections includes the step of filling said first and second molding sections with a thermo-set resin.
Claim 8
Dependent Claim 13 words
The method of claim 4 including the step of curing said thermo-set resin.
Claim 9
Independent Claim 100 words
A method, comprising: mounting an electrical device on a first surface of a flexible substrate such that leads from the electrical device extend to a second surface of the flexible substrate; connecting the leads to traces formed in the second surface of the flexible substrate; positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section; forming a seal between the substrate and the second molding section by filling the first molding section; and filling the second molding section.
Claim 10
Independent Claim 100 words
A method, comprising: mounting an electrical device on a first surface of a flexible substrate such that leads from the electrical device extend to a second surface of the flexible substrate; connecting the leads to traces formed in the second surface of the flexible substrate; positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section; forming a seal between the substrate and the second molding section by filling the first molding section; and filling the second molding section.
Claim 11
Dependent Claim 37 words
The method of claim 7 wherein said step of positioning a portion of the flexible substrate carrying the electrical device within a molding cavity results in the electrical device being located completely within the first molding section.
Claim 12
Dependent Claim 40 words
The method of claim 8 wherein said step of positioning a portion of the flexible substrate carrying the electrical device within a molding cavity results in the leads and connections to traces being located completely within the second molding section.
Claim 13
Dependent Claim 36 words
The method of claim 7 wherein said step of filling said first and second molding sections includes the step of filling said first and second molding sections with a thermo-set resin to form a molded article.
Claim 14
Dependent Claim 13 words
The method of claim 10 including the step of curing said thermo-set resin.
Claim 15
Dependent Claim 17 words
The method of claim 7 including the step of removing said molded article from the molding cavity.
Claim 16
Dependent Claim 27 words
The method of claim 7 including the step of separating said portion of the flexible substrate carrying the electrical device from the remaining portion of the substrate.
Claim 17
Dependent Claim 55 words
The method of claim 7 wherein said step of positioning said portion of the flexible substrate carrying the electrical device within said molding cavity results in the creation of a path between the portion of the cavity defined by said first molding section and the portion of the cavity defined by said second molding section.
Claim 18
Independent Claim 41 words
A method of dynamic encapsulation, comprising: filling a first molding cavity positioned in a sealing relationship with an article to be encapsulated; dynamically creating a sealing relationship between the article and a second molding cavity; and filling the second molding cavity.
Claim 19
Independent Claim 41 words
A method of dynamic encapsulation, comprising: filling a first molding cavity positioned in a sealing relationship with an article to be encapsulated; dynamically creating a sealing relationship between the article and a second molding cavity; and filling the second molding cavity.
Claim 20
Dependent Claim 32 words
The method of claim 15 wherein said step of dynamically creating a sealing relationship includes the step of allowing the article to flex into a sealing engagement with the second molding cavity.
Claim 21
Independent Claim 103 words
A method, comprising: mounting an electrical device to a first surface of a flexible substrate such that leads from the electrical device extend to a second surface of the flexible substrate; connecting the leads to traces formed in the second surface of the flexible substrate; positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section; filling the first molding cavity to dynamically create a sealing relationship between the flexible substrate and the second molding cavity; and filling the second molding cavity.
Claim 22
Independent Claim 103 words
A method, comprising: mounting an electrical device to a first surface of a flexible substrate such that leads from the electrical device extend to a second surface of the flexible substrate; connecting the leads to traces formed in the second surface of the flexible substrate; positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section; filling the first molding cavity to dynamically create a sealing relationship between the flexible substrate and the second molding cavity; and filling the second molding cavity.
Claim 23
Dependent Claim 37 words
The method of claim 17 wherein said step of positioning a portion of the flexible substrate carrying the electrical device within a molding cavity results in the electrical device being located completely within the first molding section.
Claim 24
Dependent Claim 40 words
The method of claim 18 wherein said step of positioning a portion of the flexible substrate carrying the electrical device within a molding cavity results in the leads and connections to traces being located completely within the second molding section.
Claim 25
Independent Claim 43 words
A method of transfer molding, comprising: positioning a first portion of encapsulated material on a first surface by transfer molding; and positioning a second portion of encapsulated material, of smaller surface area than said first portion, on a second surface by transfer molding.
Claim 26
Independent Claim 43 words
A method of transfer molding, comprising: positioning a first portion of encapsulated material on a first surface by transfer molding; and positioning a second portion of encapsulated material, of smaller surface area than said first portion, on a second surface by transfer molding.
Claim 27
Independent Claim 85 words
A method of asymmetric transfer molding, comprising: positioning an article to be encapsulated within a molding cavity defined by first and second mold sections, said article forming a seal with said first mold section; filling said first mold section by transfer molding, said first mold section defining a first surface area; and filling said second mold section by transfer molding, said second mold section defining a second surface area, said second surface area being smaller than said first surface area of said first mold section.
Claim 28
Independent Claim 85 words
A method of asymmetric transfer molding, comprising: positioning an article to be encapsulated within a molding cavity defined by first and second mold sections, said article forming a seal with said first mold section; filling said first mold section by transfer molding, said first mold section defining a first surface area; and filling said second mold section by transfer molding, said second mold section defining a second surface area, said second surface area being smaller than said first surface area of said first mold section.
Claim 29
Dependent Claim 32 words
The method of claim 21 wherein said steps of filling said first and second mold sections each include the step of filling said first and second mold sections with a thermo-set resin.
Claim 30
Dependent Claim 30 words
The method of claim 21 wherein said second surface area of said second mold section is approximately three times smaller than said first surface area of said first mold section.

References Cited (Backward Citations)

US4744637A Cited
US5070041A Cited
US5270573A Cited
US5766987A Cited
US5874324A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-11-07 2004-05-08 2004-11-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-11-07 2008-05-08 2008-11-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-11-07 2012-05-08 2012-11-07 $7700.00 Window Closed / Lapsed

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