Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
110 words
An integrated circuit structure formed in a semiconductor substrate and including: at least one electronic integrated circuit element; an antenna coil arranged to receive data and energy to supply said electronic integrated circuit element; and a metal protective ring situated at the periphery of said electronic integrated circuit structure to protect elements of said electronic integrated circuit structure from mechanical stress or corrosion; wherein said protective ring is arranged with at least one ohmic interruption, so that it does not form a closed circuit on itself, in order that the antenna coil is insensitive to the presence of the protective ring, thereby enabling operation of said electronic integrated circuit element.
Claim 2
Dependent Claim
110 words
An integrated circuit structure formed in a semiconductor substrate and including: at least one electronic integrated circuit element; an antenna coil arranged to receive data and energy to supply said electronic integrated circuit element; and a metal protective ring situated at the periphery of said electronic integrated circuit structure to protect elements of said electronic integrated circuit structure from mechanical stress or corrosion; wherein said protective ring is arranged with at least one ohmic interruption, so that it does not form a closed circuit on itself, in order that the antenna coil is insensitive to the presence of the protective ring, thereby enabling operation of said electronic integrated circuit element.
Claim 3
Dependent Claim
21 words
The integrated circuit structure of claim 1, wherein said antenna coil and said electronic integrated circuit element together define a transponder.
Claim 4
Dependent Claim
17 words
The integrated circuit structure of claim 1, wherein said protective ring is arranged with four ohmic interruptions.
Claim 5
Independent Claim
107 words
A method for manufacturing an integrated circuit structure formed in a semiconductor substrate, said method comprising the steps: manufacturing at least one electronic integrated circuit element in a semiconductor substrate; manufacturing an antenna coil arranged to receive data and energy to supply said electronic integrated circuit element; and manufacturing a metal protective ring situated at the periphery of said integrated circuit structure, said protective ring being arranged with at least one ohmic interruption, so that it does not form a closed circuit on itself, in order that the antenna coil is insensitive to the presence of the protective ring, thereby enabling operation of said integrated circuit structure.
Claim 6
Independent Claim
107 words
A method for manufacturing an integrated circuit structure formed in a semiconductor substrate, said method comprising the steps: manufacturing at least one electronic integrated circuit element in a semiconductor substrate; manufacturing an antenna coil arranged to receive data and energy to supply said electronic integrated circuit element; and manufacturing a metal protective ring situated at the periphery of said integrated circuit structure, said protective ring being arranged with at least one ohmic interruption, so that it does not form a closed circuit on itself, in order that the antenna coil is insensitive to the presence of the protective ring, thereby enabling operation of said integrated circuit structure.
Claim 7
Dependent Claim
15 words
The method of claim 4, wherein said protective ring is arranged with four ohmic interruptions.
Claim 8
Independent Claim
120 words
A method for manufacturing an integrated circuit structure formed in a semiconductor substrate, said method comprising the steps: manufacturing at least one electronic integrated circuit element in a semiconductor substrate; manufacturing an antenna coil arranged to receive data and energy to supply said electronic integrated circuit element; and manufacturing a metal protective ring situated at the periphery of said integrated circuit structure to protect elements of said integrated circuit structure against mechanical stress or corrosion, said protective ring being arranged with at least one ohmic interruption, so that it does not form a closed circuit on itself, in order that the antenna coil is insensitive to the presence of the protective ring, thereby enabling operation of said integrated circuit structure.
Claim 9
Independent Claim
120 words
A method for manufacturing an integrated circuit structure formed in a semiconductor substrate, said method comprising the steps: manufacturing at least one electronic integrated circuit element in a semiconductor substrate; manufacturing an antenna coil arranged to receive data and energy to supply said electronic integrated circuit element; and manufacturing a metal protective ring situated at the periphery of said integrated circuit structure to protect elements of said integrated circuit structure against mechanical stress or corrosion, said protective ring being arranged with at least one ohmic interruption, so that it does not form a closed circuit on itself, in order that the antenna coil is insensitive to the presence of the protective ring, thereby enabling operation of said integrated circuit structure.
Claim 10
Dependent Claim
15 words
The method of claim 6, wherein said protective ring is arranged with four ohmic interruptions.