US6125039A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid module
Assignee: Taiyo Yuden Co Ltd
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Filing: 1999-03-29
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Granted: 2000-09-26
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Expires: 2019-03-29
Abstract
Abstract A hybrid module comprising a circuit board, a heat generating circuit component mounted on the circuit board and a mother board on which the circuit board is mounted, wherein the circuit component is mounted on the circuit board opposing the mother board, and the surface of the circuit component is fixed to a thermally conductive member having a shape like a film and formed on the mother board. With such an arrangement, heat generated in the circuit component is transmitted to the mother board via the thermally conductive member.
Inventors
- 👤 Kazutaka Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 17:22
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H05; H05K; H05K1/00; H05K1/02; H05K1/14; H05K1/141; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W90/00; H05K1/18; H05K1/182; H05K1/183; H05K2201/00; H05K2201/06; H05K2201/066; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09781; H05K2201/10; H05K2201/10227; H05K2201/10386; H05K2201/10431; H05K2201/10439; H05K2201/10477; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H05K3/3426; H05K3/3431; H05K3/3436; H05K3/3442; H05K3/36; H05K3/368; H10W70/682; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
89 words
A hybrid module comprising: a circuit board having a recess formed in a main surface thereof; a mother board mounted to said circuit board at said main surface thereof; a heat generating circuit component mounted in the recess, said circuit component having a main surface which is substantially flush with the main surface of said circuit board and having electrodes provided only on a surface opposite to its main surface; and a thermally conductive film member provided between said mother board and said main surface of said circuit component.
Claim 2
Dependent Claim
89 words
A hybrid module comprising: a circuit board having a recess formed in a main surface thereof; a mother board mounted to said circuit board at said main surface thereof; a heat generating circuit component mounted in the recess, said circuit component having a main surface which is substantially flush with the main surface of said circuit board and having electrodes provided only on a surface opposite to its main surface; and a thermally conductive film member provided between said mother board and said main surface of said circuit component.
Claim 3
Dependent Claim
23 words
The hybrid module according to claim 1, wherein the main surface of said circuit board is soldered on said thermally conductive film member.
Claim 4
Dependent Claim
26 words
The hybrid module according to claim 1, wherein the main surface of said circuit board has either an epoxy resin or a silicon resin provided thereon.
Claim 5
Dependent Claim
25 words
The hybrid module according to claim 1, wherein said circuit component is sealed within said recess with a resin except for the main surface thereof.
Claim 6
Dependent Claim
19 words
The hybrid module according to claim 1, wherein said thermally conductive film member is made from a metal plate.
Claim 7
Dependent Claim
22 words
The hybrid module according to claim 1, wherein said recess has a diameter greater than that of the circuit component contained therein.
Claim 8
Dependent Claim
47 words
The hybrid module according to claim 6, wherein terminal electrodes are provided on a lower surface of the circuit board, and the terminal electrodes and land electrodes of the mother board are connected with each other via solder interposed therebetween and having the shape of a ball.
Claim 9
Dependent Claim
45 words
The hybrid module according to claim 1, wherein a circuit arranged on the circuit board is connected with a mother board circuit by soldering lead terminals formed from a metal plate member provided on the circuit board onto land electrodes provided on the mother board.
Claim 10
Dependent Claim
45 words
The hybrid module according to claim 1, wherein a circuit arranged on the circuit board is connected with a mother board circuit by soldering terminal electrodes formed from a metallic film member provided on the circuit board onto land electrodes provided on the mother board.
Claim 11
Dependent Claim
102 words
A hybrid module comprising: a circuit board having at least two recesses formed in a main surface thereof; a mother board mounted to said circuit board at said main surface thereof; a heat generating circuit component mounted in each of the recesses, said circuit components each having a main surface which is substantially flush with the main surface of said circuit board and having electrodes provided only on the surface opposite to its main surface; and at least two thermally conductive film members, each of the thermally conductive film members being provided between a circuit component main surface and the mother board.
Claim 12
Dependent Claim
102 words
A hybrid module comprising: a circuit board having at least two recesses formed in a main surface thereof; a mother board mounted to said circuit board at said main surface thereof; a heat generating circuit component mounted in each of the recesses, said circuit components each having a main surface which is substantially flush with the main surface of said circuit board and having electrodes provided only on the surface opposite to its main surface; and at least two thermally conductive film members, each of the thermally conductive film members being provided between a circuit component main surface and the mother board.
Claim 13
Dependent Claim
23 words
The hybrid module according to claim 10, wherein the main surface of said circuit board is soldered on said thermally conductive film members.
Claim 14
Dependent Claim
26 words
The hybrid module according to claim 10, wherein the main surface of said circuit board has either an epoxy resin or a silicon resin provided thereon.
Claim 15
Dependent Claim
31 words
The hybrid module according to claim 10, wherein at least one of said circuit components is sealed within one of said recesses with a resin except for the main surface thereof.
Claim 16
Dependent Claim
23 words
The hybrid module according to claim 10, wherein at least one of said thermally conductive film members is made from a metal plate.
Claim 17
Dependent Claim
62 words
The hybrid module according to claim 10, wherein said thermally conductive film members are made from distinct metal plates and each of said thermally conductive film members has a thickness corresponding to the thickness of the circuit component to be mounted so that the main surface of said circuit component is located substantially flush with the main surface of said circuit board.
Claim 18
Dependent Claim
24 words
The hybrid module according to claim 10, wherein at least one of said recesses have a diameter greater than the circuit component contained therein.
Claim 19
Dependent Claim
45 words
The hybrid module according to claim 10, wherein a circuit arranged on the circuit board is connected with a mother board circuit by soldering lead terminals formed from a metal plate member provided on the circuit board onto land electrodes provided on the mother board.
Claim 20
Dependent Claim
45 words
The hybrid module according to claim 10, wherein a circuit arranged on the circuit board is connected with a mother board circuit by soldering terminal electrodes formed from a metallic film member provided on the circuit board onto land electrodes provided on the mother board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-09-26 | 2004-03-27 | 2004-09-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-09-26 | 2008-03-27 | 2008-09-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-09-26 | 2012-03-27 | 2012-09-26 | $7700.00 | Window Closed / Lapsed |