US6098024A
Expired / Lapsed
US
⏱️ 0.0 years remaining
System for process data association using LaPlace Everett interpolation
Assignee: Advanced Micro Devices Inc
•
Filing: 1997-12-05
•
Granted: 2000-08-01
•
Expires: 2017-12-05
Abstract
Abstract A method of utilizing associated process data parameters in the manufacture of semiconductor wafers by converting tool-based data to lot based data in order to predict wafer electrical test results from measured in-line critical dimensions, lot based data and the converted tool-based data. The converted tool-based data is obtained by interpolating data between a measurement obtained from a tool at a first time and a measurement obtained from the tool at a second time. The data association is obtained using LaPlace-Everett interpolation. The converted tool-based data can also be obtained by extrapolating data from the historical measurements taken from the tool.
Inventors
- 👤 Ming Chun Chen
- 👤 Paul J. Steffan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 09:11
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/23
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
173 words
A method of utilizing associated process data parameters to predict wafer electrical test results during the manufacture of semiconductor wafers, the method comprising: starting a wafer in a series of semiconductor manufacturing processes; setting process parameters for a first process in the series of semiconductor manufacturing processes; running the first process; measuring in-line critical dimensions of the wafer after the running of the first process; determining a first set of lot based data obtained from the measured in-line critical dimensions of the wafer; converting tool based data obtained from the measured in-line critical dimensions of the wafer to a second set of lot based data by interpolating tool based data between a first measurement obtained from a tool at a first time and a second measurement obtained from the tool at a second time using LaPlace-Everett Interpolation; and predicting wafer electrical test results for the wafer from the measured in-line critical dimensions, the first set of lot based data and the second set of lot based data converted from the tool based data.
Claim 2
Independent Claim
173 words
A method of utilizing associated process data parameters to predict wafer electrical test results during the manufacture of semiconductor wafers, the method comprising: starting a wafer in a series of semiconductor manufacturing processes; setting process parameters for a first process in the series of semiconductor manufacturing processes; running the first process; measuring in-line critical dimensions of the wafer after the running of the first process; determining a first set of lot based data obtained from the measured in-line critical dimensions of the wafer; converting tool based data obtained from the measured in-line critical dimensions of the wafer to a second set of lot based data by interpolating tool based data between a first measurement obtained from a tool at a first time and a second measurement obtained from the tool at a second time using LaPlace-Everett Interpolation; and predicting wafer electrical test results for the wafer from the measured in-line critical dimensions, the first set of lot based data and the second set of lot based data converted from the tool based data.
Claim 3
Dependent Claim
29 words
The method of claim 1 wherein converting tool based data to a second set of lot based data comprises extrapolating tool based data from previously obtained tool based data.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-01 | 2004-01-31 | 2004-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-01 | 2008-01-31 | 2008-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-01 | 2012-01-31 | 2012-08-01 | $7700.00 | Window Closed / Lapsed |