Patent US6097857A successfully refreshed from Google Patents.
US6097857A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic module having optical and electrical interconnects
Assignee: University of North Carolina at Chapel Hill
•
Filing: 1999-05-11
•
Granted: 2000-08-01
•
Expires: 2019-05-11
Abstract
Abstract A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connections external to the microelectronic module, using a holographic substrate to optically link modules. The substrate may also be used to establish optical alignment of the hologram to an underlying optical emitter and/or optical detector without establishing electrical connections thereto.
Inventors
- 👤 Michael R. Feldman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 23:03
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/43; H; H10; H10W; H10W72/00; H10W90/00; H10W90/20; H10W90/293; G02B6/4201; G02B6/4219; G02B6/4228; G02B6/4232; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W72/851; H10W72/874; H10W72/877; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
92 words
A microelectronic module comprising: a substrate having a pair of opposing faces; an optical transmitter which generates an optical beam, the substrate being transparent to the optical beam; at least a first pad formed on a first surface of the substrate; at least a second pad formed on a predetermined surface of the optical transmitter corresponding to the at least a first pad; an optical element formed on a second face of the substrate; and alignment marks on the substrate to facilitate optical alignment of the optical element to the optical beam.
Claim 2
Dependent Claim
92 words
A microelectronic module comprising: a substrate having a pair of opposing faces; an optical transmitter which generates an optical beam, the substrate being transparent to the optical beam; at least a first pad formed on a first surface of the substrate; at least a second pad formed on a predetermined surface of the optical transmitter corresponding to the at least a first pad; an optical element formed on a second face of the substrate; and alignment marks on the substrate to facilitate optical alignment of the optical element to the optical beam.
Claim 3
Dependent Claim
41 words
The microelectronic module of claim 1, further comprising an integrated circuit chip having at least a third pad on a surface thereof and the first surface of the substrate containing another first pad corresponding to the at least a third pad.
Claim 4
Dependent Claim
20 words
The microelectronic module of claim 2, wherein the optical transmitter and the integrated circuit are electrically connected to one another.
Claim 5
Dependent Claim
33 words
The microelectronic module of claim 1, further comprising an electrical connector on at least one of the transmitter and the substrate to facilitate electrical connections to electronic elements external to the microelectronic module.
Claim 6
Dependent Claim
14 words
The microelectronic module of claim 1, wherein the substrate comprises more than one layer.
Claim 7
Dependent Claim
24 words
The microelectronic module of claim 1, further comprising a heat sink positioned on the optical transmitter on a surface thereeof opposite the predetermined surface.
Claim 8
Dependent Claim
21 words
The microelectronic module of claim 1, wherein the alignment marks are used during lithographic processes to accurately position the optical element.
Claim 9
Dependent Claim
27 words
The microelectronic module of claim 1, wherein the optical element is a hologram and the alignment marks are used during etching processes to accurately position the hologram.
Claim 10
Dependent Claim
92 words
A microelectronic module comprising: a substrate having a pair of opposing faces; an optical detector which receives an optical beam, the substrate being transparent to the optical beam; at least a first pad formed on a first surface of the substrate; at least a second pad formed on a predetermined surface of the optical detector corresponding to the at least a first pad; an optical element formed on a second face of the substrate; and alignment marks on the substrate to facilitate optical alignment of the optical element to the optical beam.
Claim 11
Dependent Claim
92 words
A microelectronic module comprising: a substrate having a pair of opposing faces; an optical detector which receives an optical beam, the substrate being transparent to the optical beam; at least a first pad formed on a first surface of the substrate; at least a second pad formed on a predetermined surface of the optical detector corresponding to the at least a first pad; an optical element formed on a second face of the substrate; and alignment marks on the substrate to facilitate optical alignment of the optical element to the optical beam.
Claim 12
Dependent Claim
41 words
The microelectronic module of claim 9, further comprising an integrated circuit chip having at least a third pad on a surface thereof and the first surface of the substrate containing another first pad corresponding to the at least a third pad.
Claim 13
Dependent Claim
20 words
The microelectronic module of claim 10, wherein the optical detector and the integrated circuit are electrically connected to one another.
Claim 14
Dependent Claim
33 words
The microelectronic module of claim 9, further comprising an electrical connector on at least one of the detector and the substrate to facilitate electrical connections to electronic elements external to the microelectronic module.
Claim 15
Dependent Claim
14 words
The microelectronic module of claim 9, wherein the substrate comprises more than one layer.
Claim 16
Dependent Claim
24 words
The microelectronic module of claim 9, further comprising a heat sink positioned on the optical transmitter on a surface thereof opposite the predetermined surface.
Claim 17
Dependent Claim
21 words
The microelectronic module of claim 9, wherein the alignment marks are used during lithographic processes to accurately position the optical element.
Claim 18
Dependent Claim
27 words
The microelectronic module of claim 9, wherein the optical element is a hologram and the alignment marks are used during etching processes to accurately position the hologram.
Claim 19
Dependent Claim
132 words
A microelectronic module comprising: an optical transmitter which generates a first optical beam and having at least a first pad on a first predetermined surface thereof; an optical detector which receives a second optical beam and having at least a second pad on a second predetermined surface thereof; a substrate having a pair of opposing faces, the substrate being transparent to the first and second optical beams; at least third and fourth pads formed on a first surface of the substrate corresponding to the at least a first pad and the at least a second pad; an optical element formed on a second face of the substrate; and alignment marks on the substrate to facilitate optical alignment of the optical element to at least one of the first and second optical beams.
Claim 20
Dependent Claim
132 words
A microelectronic module comprising: an optical transmitter which generates a first optical beam and having at least a first pad on a first predetermined surface thereof; an optical detector which receives a second optical beam and having at least a second pad on a second predetermined surface thereof; a substrate having a pair of opposing faces, the substrate being transparent to the first and second optical beams; at least third and fourth pads formed on a first surface of the substrate corresponding to the at least a first pad and the at least a second pad; an optical element formed on a second face of the substrate; and alignment marks on the substrate to facilitate optical alignment of the optical element to at least one of the first and second optical beams.
Claim 21
Dependent Claim
37 words
The microelectronic module of claim 17, further comprising an integrated circuit chip having the third pad on a surface thereof and the first surface of the substrate containing the fourth pad corresponding to the the third pad.
Claim 22
Dependent Claim
23 words
The microelectronic module of claim 18, wherein one of the optical transmitter and the optical detector is electrically connected to the integrated circuit.
Claim 23
Dependent Claim
35 words
The microelectronic module of claim 17, further comprising an electrical connector on at least one of the transmitter, the detector and the substrate to facilitate electrical connections to electronic elements external to the microelectronic module.
Claim 24
Dependent Claim
14 words
The microelectronic module of claim 17, wherein the substrate comprises more than one layer.
Claim 25
Dependent Claim
31 words
The microelectronic module of claim 17, further comprising a heat sink positioned on the optical transmitter and the optical detector on a surface thereof opposite the first and second predetermined surfaces.
Claim 26
Dependent Claim
21 words
The microelectronic module of claim 17, wherein the alignment marks are used during lithographic processes to accurately position the optical element.
Claim 27
Dependent Claim
27 words
The microelectronic module of claim 17, wherein the optical element is a hologram and the alignment marks are used during etching processes to accurately position the hologram.
References Cited (Backward Citations)
US4703993A
Cited
US4720634A
Cited
US4774630A
Cited
JPS6287943A
Cited
US4711997A
Cited
US4762382A
Cited
JPS6455506A
Cited
US4912545A
Cited
US4917450A
Cited
US4838630A
Cited
US4818045A
Cited
US4966430A
Cited
EP0420029A1
Cited
US5061027A
Cited
US5101460A
Cited
US5394490A
Cited
US5625734A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-01 | 2004-01-31 | 2004-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-01 | 2008-01-31 | 2008-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-01 | 2012-01-31 | 2012-08-01 | $7700.00 | Window Closed / Lapsed |