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US6091889A Expired / Lapsed US ⏱️ 0.0 years remaining

Rapid thermal processor for heating a substrate

Assignee: National Science and Technology Council
•
Filing: 1999-01-08
•
Granted: 2000-07-18
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Expires: 2019-01-08
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Abstract

Abstract A planar inverted-cone susceptor, preferably made of silicon carbide, inversely disposed between a substrate and a holder of the Rapid Thermal Processor (RTP) so as to perform heat compensation on the substrate. Because the substrate is directly supported by the inverted-cone susceptor, heat stored in the wafer can be rapidly received by the inverted-cone susceptor. Thermal stress and thermal gradient can be effectively decreased in the wafer.

Inventors

  • 👤 Jenn-Gwo Hwu
  • 👤 Kuo-Chung Lee
  • 👤 Hong Chang
  • 👤 Chien-Lung Chen

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 11:59
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0431; H10P72/0436

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 89 words
A Rapid Thermal Processor for heating a substrate, comprising: a reaction chamber; a holder disposed in said reaction chamber; an invert-cone planar susceptor disposed on said holder for supporting said substrate, including an upper planar surface for supporting said substrate and a lower planar surface for being disposed on said holder, and made of a refractory material capable of resisting a temperature higher than 1000° C.; a heater disposed in said chamber for heating said substrate; and a gas distributor for distributing reaction gas coming into said reaction chamber.
Claim 2
Dependent Claim 89 words
A Rapid Thermal Processor for heating a substrate, comprising: a reaction chamber; a holder disposed in said reaction chamber; an invert-cone planar susceptor disposed on said holder for supporting said substrate, including an upper planar surface for supporting said substrate and a lower planar surface for being disposed on said holder, and made of a refractory material capable of resisting a temperature higher than 1000° C.; a heater disposed in said chamber for heating said substrate; and a gas distributor for distributing reaction gas coming into said reaction chamber.
Claim 3
Dependent Claim 33 words
The Rapid Thermal Processor as claimed in claim 1, wherein said inverted-cone planar susceptor is integrally made of a refractory material selected from the group consisting of silicon, quartz, graphite or silicon carbide.
Claim 4
Dependent Claim 16 words
The Rapid Thermal Processor as claimed in claim 2, wherein said substrate is a semiconductor wafer.
Claim 5
Dependent Claim 40 words
The Rapid Thermal Processor as claimed in claim 1, wherein said inverted-cone planar susceptor is composed of a plurality of plates which are laminated together with the upper plate larger than the lower plate, thereby forming an inverted-cone planar susceptor.
Claim 6
Dependent Claim 30 words
The Rapid Thermal Processor as claimed in claim 4, wherein said plates are made of a refractory material selected from the group consisting of silicon, quartz, graphite or silicon carbide.
Claim 7
Dependent Claim 16 words
The Rapid Thermal Processor as claimed in claim 5, wherein said substrate is a semiconductor wafer.

References Cited (Backward Citations)

US5418885A Cited
US5683518A Cited
US5820686A Cited
US5926615A Cited
US5841110A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-07-18 2004-01-17 2004-07-18 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-07-18 2008-01-17 2008-07-18 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-07-18 2012-01-17 2012-07-18 $7700.00 Window Closed / Lapsed

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