US6088915A
Expired / Lapsed
US
⏱️ 0.0 years remaining
C4-GT stand off rigid flex interposer method
Assignee: Intel Corp
•
Filing: 1998-11-24
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Granted: 2000-07-18
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Expires: 2018-11-24
Abstract
Abstract An integrated circuit package that contains an integrated circuit that is mounted to a bond portion of a substrate. The bond portion of the substrate is separated from a contact portion of the substrate by a flexible portion. The contact portion is attached to a printed circuit board by a plurality of solder joints. The flexible portion decouples the bond portion from the contact portion to allow relative movement between the package and the circuit board to minimize the strain on the solder joints. The package may also contain a spacer that separates a heat pipe from the integrated circuit and controls the thickness of a thermal grease located between the circuit and the pipe.
Inventors
- 👤 Gregory Turturro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:34
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W40/00; H10W40/70; H10W40/77; H10W70/67; H10W70/688; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144; Y10T29/49146
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
38 words
A method comprising: placing a spacer between an integrated circuit and a heat conductive member, said spacer creating a cavity between the integrated circuit and the heat conductive member; and filling said cavity with a thermally conductive material.
Claim 2
Independent Claim
38 words
A method comprising: placing a spacer between an integrated circuit and a heat conductive member, said spacer creating a cavity between the integrated circuit and the heat conductive member; and filling said cavity with a thermally conductive material.
Claim 3
Dependent Claim
16 words
The method as recited in claim 1, wherein said thermally conductive material comprises a thermal grease.
Claim 4
Dependent Claim
16 words
The method as recited in claim 1, wherein said thermally conductive material comprises a thermal epoxy.
References Cited (Backward Citations)
US3626252A
Cited
US4092697A
Cited
US4654966A
Cited
US5311060A
Cited
US5276586A
Cited
US5550406A
Cited
US5532906A
Cited
US5467251A
Cited
US5672548A
Cited
US5744863A
Cited
US5572407A
Cited
US5585671A
Cited
US5586010A
Cited
US5706171A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-18 | 2004-01-17 | 2004-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-18 | 2008-01-17 | 2008-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-18 | 2012-01-17 | 2012-07-18 | $7700.00 | Window Closed / Lapsed |