US6088237A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device socket, assembly and methods
Assignee: Micron Technology Inc
•
Filing: 1998-12-08
•
Granted: 2000-07-11
•
Expires: 2018-12-08
Abstract
Abstract A socket that secures bare and minimally packaged semiconductor devices substantially perpendicularly relative to a carrier substrate. The socket includes intermediate conductive elements and a member which moves the intermediate conductive elements between an insertion position and a biased position. After placement of the intermediate conductive elements into an insertion position, a semiconductor device may be inserted into a receptacle of the socket with minimal insertion force. Movement of the member to a biased position facilitates biasing of the intermediate conductive elements against a bond pad of the semiconductor device. The intermediate conductive elements establish an electrical connection between the semiconductor device and the carrier substrate. A first embodiment of the socket includes a member which moves transversely relative to the remainder of the socket. In a second embodiment of the socket, the member moves vertically relative to the socket body.
Inventors
- 👤 Warren M. Farnworth
- 👤 Larry D. Kinsman
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:20
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1007; H01; H01R; H01R12/00; H01R12/70; H01R12/82; H01R12/85; H01R12/89
Claims Analysis
Total Claims: 70
Claim 1
Independent Claim
84 words
A socket for orienting a semiconductor die including at least one exposed bond pad substantially perpendicularly relative to a carrier substrate, comprising: a body including a receptacle formed therein and adapted to receive the semiconductor die; an intermediate conductive element disposed within said receptacle; and a member disposed within said receptacle, configured to bias said intermediate conductive element against a corresponding exposed bond pad, and at least partially defining an elongated slot within which an end of the semiconductor die is to be disposed.
Claim 2
Dependent Claim
84 words
A socket for orienting a semiconductor die including at least one exposed bond pad substantially perpendicularly relative to a carrier substrate, comprising: a body including a receptacle formed therein and adapted to receive the semiconductor die; an intermediate conductive element disposed within said receptacle; and a member disposed within said receptacle, configured to bias said intermediate conductive element against a corresponding exposed bond pad, and at least partially defining an elongated slot within which an end of the semiconductor die is to be disposed.
Claim 3
Dependent Claim
15 words
The socket of claim 1, wherein said member is moveable transversely relative to said body.
Claim 4
Dependent Claim
15 words
The socket of claim 1, wherein said member is moveable vertically relative to said body.
Claim 5
Dependent Claim
17 words
The socket of claim 1, wherein said member comprises a cam which is rotatable about an axis.
Claim 6
Dependent Claim
17 words
The socket of claim 4, wherein said axis is positioned off-center along a length of said cam.
Claim 7
Dependent Claim
27 words
The socket of claim 1, further comprising an actuator element operatively connected to said member and configured to control movement of said member relative to said body.
Claim 8
Dependent Claim
13 words
The socket of claim 6, wherein said actuator element extends through said body.
Claim 9
Dependent Claim
11 words
The socket of claim 1, further comprising a member-position retention component.
Claim 10
Dependent Claim
14 words
The socket of claim 1, wherein said intermediate conductive element comprises a leaf spring.
Claim 11
Dependent Claim
19 words
The socket of claim 1, wherein said intermediate conductive element has a length of about 11/2 mm or less.
Claim 12
Dependent Claim
19 words
The socket of claim 1, wherein said intermediate conductive element has a length of about 1 mm or less.
Claim 13
Dependent Claim
23 words
The socket of claim 1, wherein said member is configured to bias said intermediate conductive element away from said corresponding exposed bond pad.
Claim 14
Dependent Claim
21 words
The socket of claim 1, wherein said member is adapted to at least partially eject the semiconductor die from said receptacle.
Claim 15
Dependent Claim
16 words
The socket of claim 1, wherein said intermediate conductive element is fixedly engaged by said member.
Claim 16
Dependent Claim
16 words
The socket of claim 1, wherein said intermediate conductive element extends upwardly through said elongated slot.
Claim 17
Dependent Claim
15 words
The socket of claim 1, wherein said member is configured to support the semiconductor die.
Claim 18
Dependent Claim
12 words
The socket of claim 1, wherein said member includes a camming edge.
Claim 19
Dependent Claim
22 words
The socket of claim 17, wherein said camming edge includes at least one tooth comprising a biasing end and an insertion end.
Claim 20
Dependent Claim
26 words
The socket of claim 18, wherein said biasing end is configured to facilitate the biasing of said intermediate conductive element against said corresponding exposed bond pad.
Claim 21
Dependent Claim
27 words
The socket of claim 18, wherein said insertion end is configured to facilitate the movement of said intermediate conductive element away from said corresponding exposed bond pad.
Claim 22
Dependent Claim
21 words
The socket of claim 1, wherein said intermediate conductive element comprises a bond pad contact end and a terminal contact end.
Claim 23
Dependent Claim
15 words
The socket of claim 21, wherein said intermediate conductive element further comprises a camming section.
Claim 24
Dependent Claim
15 words
The socket of claim 22, further comprising a bias component extending transversely above said member.
Claim 25
Dependent Claim
13 words
The socket of claim 23, wherein said bias component abuts said camming section.
Claim 26
Dependent Claim
109 words
A vertically mountable semiconductor device assembly, comprising: one of a bare semiconductor die and a minimally packaged semiconductor die including an active surface, a bottom edge and at least one exposed bond pad disposed proximate said bottom edge; and a socket comprising: a body having a receptacle formed therein and configured to receive said one of a bare semiconductor die and a minimally packaged semiconductor die; an intermediate conductive element disposed within said receptacle; and a member disposed within said receptacle and configured to bias said intermediate conductive element against a corresponding exposed bond pad of said one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 27
Dependent Claim
109 words
A vertically mountable semiconductor device assembly, comprising: one of a bare semiconductor die and a minimally packaged semiconductor die including an active surface, a bottom edge and at least one exposed bond pad disposed proximate said bottom edge; and a socket comprising: a body having a receptacle formed therein and configured to receive said one of a bare semiconductor die and a minimally packaged semiconductor die; an intermediate conductive element disposed within said receptacle; and a member disposed within said receptacle and configured to bias said intermediate conductive element against a corresponding exposed bond pad of said one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 28
Dependent Claim
19 words
The vertically mountable semiconductor device assembly of claim 25, wherein said member is moveable transversely relative to said body.
Claim 29
Dependent Claim
19 words
The vertically mountable semiconductor device assembly of claim 25, wherein said member is moveable vertically relative to said body.
Claim 30
Dependent Claim
22 words
The vertically mountable semiconductor device assembly of claim 25, wherein said member comprises a cam which is rotatable about an axis thereof.
Claim 31
Dependent Claim
20 words
The vertically mountable semiconductor device assembly of claim 28, wherein said axis extends non-centrally along a length of said cam.
Claim 32
Dependent Claim
31 words
The vertically mountable semiconductor device assembly of claim 25, further comprising an actuator element operatively connected to said member and configured to control movement of said member relative to said body.
Claim 33
Dependent Claim
18 words
The vertically mountable semiconductor device assembly of claim 25, wherein said intermediate conductive element comprises a leaf spring.
Claim 34
Dependent Claim
27 words
The vertically mountable semiconductor device assembly of claim 25, wherein said member is configured to bias said intermediate conductive element away from said corresponding exposed bond pad.
Claim 35
Dependent Claim
35 words
The vertically mountable semiconductor device assembly of claim 25, wherein said member is adapted to at least partially eject the one of a bare semiconductor die and a minimally packaged semiconductor die from said receptacle.
Claim 36
Dependent Claim
20 words
The vertically mountable semiconductor device assembly of claim 25, wherein said intermediate conductive element is fixedly engaged by said member.
Claim 37
Dependent Claim
25 words
The vertically mountable semiconductor device assembly of claim 25, wherein said intermediate conductive element comprises a bond pad contact end and a terminal contact end.
Claim 38
Dependent Claim
19 words
The vertically mountable semiconductor device assembly of claim 35, wherein said intermediate conductive element further comprises a camming section.
Claim 39
Dependent Claim
19 words
The vertically mountable semiconductor device assembly of claim 36, further comprising a bias component extending transversely above said member.
Claim 40
Dependent Claim
17 words
The vertically mountable semiconductor device assembly of claim 37, wherein said bias component abuts said camming section.
Claim 41
Dependent Claim
80 words
A computer comprising: a carrier substrate; a socket secured to said carrier substrate and including a body having a downwardly extending receptacle formed through a top thereof, an intermediate conductive element disposed within said receptacle, and a member disposed within said receptacle; and one of a bare semiconductor die and a minimally packaged semiconductor die including a bond pad disposed proximate an edge thereof, said edge disposed within said receptacle and said intermediate conductive element biasing against said bond pad.
Claim 42
Dependent Claim
80 words
A computer comprising: a carrier substrate; a socket secured to said carrier substrate and including a body having a downwardly extending receptacle formed through a top thereof, an intermediate conductive element disposed within said receptacle, and a member disposed within said receptacle; and one of a bare semiconductor die and a minimally packaged semiconductor die including a bond pad disposed proximate an edge thereof, said edge disposed within said receptacle and said intermediate conductive element biasing against said bond pad.
Claim 43
Dependent Claim
15 words
The computer of claim 39, wherein said member is moveable transversely relative to said body.
Claim 44
Dependent Claim
15 words
The computer of claim 39, wherein said member is moveable vertically relative to said body.
Claim 45
Dependent Claim
18 words
The computer of claim 39, wherein said member comprises a cam that is rotatable about an axis thereof.
Claim 46
Dependent Claim
16 words
The computer of claim 42, wherein said axis extends non-centrally along a length of said cam.
Claim 47
Dependent Claim
14 words
The computer of claim 39, wherein said intermediate conductive element comprises a leaf spring.
Claim 48
Dependent Claim
20 words
The computer of claim 39, wherein said member is configured to bias said intermediate conductive element against said bond pad.
Claim 49
Dependent Claim
21 words
The computer of claim 39, wherein said member is configured to bias said intermediate conductive element away from said bond pad.
Claim 50
Dependent Claim
31 words
The computer of claim 39, wherein said member is adapted to at least partially eject said one of a bare semiconductor die and a minimally packaged semiconductor die from said receptacle.
Claim 51
Independent Claim
91 words
A method of securing one of a bare semiconductor die and a minimally packaged semiconductor die to a carrier substrate substantially perpendicular thereto, comprising: placing a member of a socket into an insertion position; inserting the one of a bare semiconductor die and a minimally packaged semiconductor die into a receptacle of said socket; and placing said member in a biased position such that said member facilitates biasing of an intermediate conductive element against a bond pad of the one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 52
Independent Claim
91 words
A method of securing one of a bare semiconductor die and a minimally packaged semiconductor die to a carrier substrate substantially perpendicular thereto, comprising: placing a member of a socket into an insertion position; inserting the one of a bare semiconductor die and a minimally packaged semiconductor die into a receptacle of said socket; and placing said member in a biased position such that said member facilitates biasing of an intermediate conductive element against a bond pad of the one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 53
Dependent Claim
28 words
The method of claim 48, wherein placing said member into an insertion position includes moving said member in a transverse direction relative to a body of said socket.
Claim 54
Dependent Claim
28 words
The method of claim 48, wherein placing said member into an insertion position includes moving said member in a vertical direction relative to a body of said socket.
Claim 55
Dependent Claim
21 words
The method of claim 48, wherein placing said member into an insertion position includes rotating said member about an axis thereof.
Claim 56
Dependent Claim
28 words
The method of claim 48, wherein placing said member into a biased position includes moving said member in a transverse direction relative to a body of said socket.
Claim 57
Dependent Claim
28 words
The method of claim 48, wherein placing said member into a biased position includes moving said member in a vertical direction relative to a body of said socket.
Claim 58
Dependent Claim
21 words
The method of claim 48, wherein placing said member into a biased position includes rotating said member along an axis thereof.
Claim 59
Dependent Claim
29 words
The method of claim 50, further comprising removing the one of a bare semiconductor die and a minimally packaged semiconductor die by replacing said member into an insertion position.
Claim 60
Dependent Claim
45 words
The method of claim 57, wherein said removing the one of a bare semiconductor die and a minimally packaged semiconductor die further includes ejecting at least a portion of the one of a bare semiconductor die and a minimally packaged semiconductor die from said socket.
Claim 61
Dependent Claim
25 words
The method of claim 48, wherein placing said member into an insertion position facilitates the movement of said intermediate conductive element into an insertion position.
Claim 62
Dependent Claim
25 words
The method of claim 48, wherein placing said member into a biased position facilitates the movement of said intermediate conductive element into a biased position.
Claim 63
Dependent Claim
82 words
A minimal insertion force socket for orienting a semiconductor device perpendicularly relative to a carrier substrate, comprising: a body including a receptacle formed therein and adapted to receive the semiconductor device; an intermediate conductive element disposed within said receptacle; and a member disposed within said receptacle, configured to bias said intermediate conductive element against a corresponding bond pad of the semiconductor device, and at least partially defining an elongated slot within which an end of the semiconductor device is to be disposed.
Claim 64
Dependent Claim
82 words
A minimal insertion force socket for orienting a semiconductor device perpendicularly relative to a carrier substrate, comprising: a body including a receptacle formed therein and adapted to receive the semiconductor device; an intermediate conductive element disposed within said receptacle; and a member disposed within said receptacle, configured to bias said intermediate conductive element against a corresponding bond pad of the semiconductor device, and at least partially defining an elongated slot within which an end of the semiconductor device is to be disposed.
Claim 65
Dependent Claim
103 words
A vertically mountable semiconductor device assembly, comprising: one of a bare semiconductor die and a minimally packaged semiconductor die including a bond pad disposed proximate a bottom edge; and a minimal insertion force socket comprising: a body having a downwardly extending receptacle formed therein and adapted to receive said one of a bare semiconductor die and a minimally packaged semiconductor die; an intermediate conductive element disposed within said body; and a member disposed within said receptacle and configured to bias said intermediate conductive element against a corresponding bond pad of said one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 66
Dependent Claim
103 words
A vertically mountable semiconductor device assembly, comprising: one of a bare semiconductor die and a minimally packaged semiconductor die including a bond pad disposed proximate a bottom edge; and a minimal insertion force socket comprising: a body having a downwardly extending receptacle formed therein and adapted to receive said one of a bare semiconductor die and a minimally packaged semiconductor die; an intermediate conductive element disposed within said body; and a member disposed within said receptacle and configured to bias said intermediate conductive element against a corresponding bond pad of said one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 67
Dependent Claim
78 words
A computer comprising: a carrier substrate; a minimal insertion force socket secured to said carrier substrate and including a body having a receptacle formed therein, an intermediate conductive element disposed within said receptacle, and a member disposed within said receptacle; and one of a bare semiconductor die and a minimally packaged semiconductor die including a bond pad disposed proximate an edge thereof, said edge disposed within said receptacle and said intermediate conductive element biasing against said bond pad.
Claim 68
Dependent Claim
78 words
A computer comprising: a carrier substrate; a minimal insertion force socket secured to said carrier substrate and including a body having a receptacle formed therein, an intermediate conductive element disposed within said receptacle, and a member disposed within said receptacle; and one of a bare semiconductor die and a minimally packaged semiconductor die including a bond pad disposed proximate an edge thereof, said edge disposed within said receptacle and said intermediate conductive element biasing against said bond pad.
Claim 69
Independent Claim
97 words
A method of securing one of a bare semiconductor die and a minimally packaged semiconductor die to a carrier substrate substantially perpendicular thereto, comprising: placing a member of a minimal insertion force socket into an insertion position; inserting the one of a bare semiconductor die and a minimally packaged semiconductor die into a receptacle of said minimal insertion force socket; and placing said member in a biased position such that said member facilitates biasing of an intermediate conductive element against a bond pad of the one of a bare semiconductor die and a minimally packaged semiconductor die.
Claim 70
Independent Claim
97 words
A method of securing one of a bare semiconductor die and a minimally packaged semiconductor die to a carrier substrate substantially perpendicular thereto, comprising: placing a member of a minimal insertion force socket into an insertion position; inserting the one of a bare semiconductor die and a minimally packaged semiconductor die into a receptacle of said minimal insertion force socket; and placing said member in a biased position such that said member facilitates biasing of an intermediate conductive element against a bond pad of the one of a bare semiconductor die and a minimally packaged semiconductor die.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-11 | 2004-01-10 | 2004-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-11 | 2008-01-10 | 2008-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-11 | 2012-01-10 | 2012-07-11 | $7700.00 | Window Closed / Lapsed |