US6086386A — Flexible connectors for microelectronic elements

Claim 1

Independent Claim 181 words

A connecting assembly for connecting a microelectronic element having an array of bump leads, comprising: (a) a substrate having electrically conductive leads; (b) a resilient, sheetlike body having first and second major surfaces, said second major surface facing said substrate; (c) a support structure extending between said second major surface of said sheetlike body and said substrate, said support structure spacing said sheetlike body away from said substrate, said support structure having gaps and solid portions therein; and (d) an array of generally laminar contacts secured to said first major surface of said body in registration with the array of bump leads on the microelectronic element to be mounted, and in alignment with said gaps, each said contact surrounded by an associated portion of said sheetlike body supported at its periphery by said solid portions of said support structure, at least a portion of said sheetlike body surrounding each said contact in alignment with said gaps being at least partially uninterrupted, whereby said contacts are deflectable toward said substrate upon urging the bump leads on the microelectronic element against said contacts.

Claim 2

Dependent Claim 181 words

A connecting assembly for connecting a microelectronic element having an array of bump leads, comprising: (a) a substrate having electrically conductive leads; (b) a resilient, sheetlike body having first and second major surfaces, said second major surface facing said substrate; (c) a support structure extending between said second major surface of said sheetlike body and said substrate, said support structure spacing said sheetlike body away from said substrate, said support structure having gaps and solid portions therein; and (d) an array of generally laminar contacts secured to said first major surface of said body in registration with the array of bump leads on the microelectronic element to be mounted, and in alignment with said gaps, each said contact surrounded by an associated portion of said sheetlike body supported at its periphery by said solid portions of said support structure, at least a portion of said sheetlike body surrounding each said contact in alignment with said gaps being at least partially uninterrupted, whereby said contacts are deflectable toward said substrate upon urging the bump leads on the microelectronic element against said contacts.

Claim 3

Dependent Claim 43 words

A connecting assembly as claimed in claim 1, wherein said support structure is a support layer and said gaps are holes, and wherein an edge of said hole defines said periphery of said portion of said sheetlike body associated with a corresponding contact.

Claim 4

Dependent Claim 42 words

A connecting assembly as claimed in claim 1, wherein said sheetlike body has a plurality of holes disposed in an array corresponding to said array of contacts, and each said contact extends inwardly over one said hole from said first major surface.

Claim 5

Dependent Claim 21 words

A connecting assembly as claimed in claim 1, wherein said contacts have asperities protruding upwardly therefrom for contacting the microelectronic element.

Claim 6

Dependent Claim 30 words

A connecting assembly as claimed in claim 1, wherein said sheetlike body further has relief apertures in said portions associated with said contacts, whereby said sheetlike body has increased flexibility.

Claim 7

Dependent Claim 15 words

A connecting assembly as claimed in claim 1, wherein said contacts are coated with solder.

Claim 8

Dependent Claim 25 words

A connecting assembly as claimed in claim 1, further comprising conductive traces on said second major surface of said sheetlike body for interconnecting said contacts.

Claim 9

Dependent Claim 17 words

A connecting assembly as claimed in claim 1, wherein an anti-wetting agent is deposited on said contacts.

Claim 10

Dependent Claim 35 words

A connecting assembly as claimed in claim 1, further comprising: (a) a frame for aligning the microelectronic element to the sheetlike body; (b) a biasing structure for urging the microelectronic element against the sheetlike body.

Claim 11

Dependent Claim 27 words

A connecting assembly as claimed in claim 1, further comprising a conductive layer on said second major surface of said sheetlike body for controlling impedance said assembly.

Claim 12

Dependent Claim 25 words

A connecting assembly as claimed in claim 10, further comprising conductive traces on said second major surface of said sheetlike body for interconnecting said contacts.

Claim 13

Dependent Claim 17 words

A connecting assembly as claimed in claim 1, wherein said support structure is an array of posts.

Claim 14

Dependent Claim 34 words

A connecting assembly as claimed in claim 12, wherein said array of posts is electrically connected to the leads of the substrate, and said contacts of said array are electrically connected to said posts.

Claim 15

Dependent Claim 22 words

A connecting assembly as claimed in claim 12, wherein each said associated portion of said sheetlike body is supported by four posts.

Claim 16

Dependent Claim 45 words

A connecting assembly as claimed in claim 12, wherein said array of contacts and said array of posts are rectilinear arrays having row and column directions, and wherein said posts are offset from said contacts in diagonal directions, oblique to said row and column directions.

Claim 17

Dependent Claim 16 words

A connecting assembly as claimed in claim 12, wherein the posts are solid core solder balls.

Claim 18

Dependent Claim 13 words

A connecting assembly as claimed in claim 12, wherein the posts are vias.

Claim 19

Dependent Claim 21 words

A connecting assembly as claimed in claim 12, wherein a group of three or more of said posts surrounds each contact.

Claim 20

Dependent Claim 29 words

A connecting assembly as claimed in claim 18, wherein at least one post of said group of posts electrically connects a respective contact to a lead on said substrate.

Claim 21

Dependent Claim 30 words

A connecting assembly as claimed in claim 18, wherein said portions of said sheetlike body associated with respective contacts deflect in response to downward forces exerted by respective bump leads.

Claim 22

Dependent Claim 177 words

A connector for mounting a microelectric element to a substrate comprising: (a) a resilient, sheetlike body having first and second major surfaces; (b) a plurality of generally laminar contacts secured to said first major surface of said body, disposed in an array corresponding to an array of bump leads on the microelectronic element to be mounted, each said contact being adapted to engage a corresponding bump lead; and (c) an array of posts on said second major surface of said sheetlike element, offset from and electrically connected to said contacts, whereby said posts can be bonded to a substrate to electrically connect said contacts to said substrate and to support said body with a standoff space between said body and said substrate, and whereby a microelectronic element cam be connected to said substrate by urging said microelectronic element against said body so that bump leads on the element are engaged by said contacts on the body, and portions of said body surrounding said contacts are at least partially uninterrupted and are resiliently deflected into said standoff space.

Claim 23

Dependent Claim 177 words

A connector for mounting a microelectric element to a substrate comprising: (a) a resilient, sheetlike body having first and second major surfaces; (b) a plurality of generally laminar contacts secured to said first major surface of said body, disposed in an array corresponding to an array of bump leads on the microelectronic element to be mounted, each said contact being adapted to engage a corresponding bump lead; and (c) an array of posts on said second major surface of said sheetlike element, offset from and electrically connected to said contacts, whereby said posts can be bonded to a substrate to electrically connect said contacts to said substrate and to support said body with a standoff space between said body and said substrate, and whereby a microelectronic element cam be connected to said substrate by urging said microelectronic element against said body so that bump leads on the element are engaged by said contacts on the body, and portions of said body surrounding said contacts are at least partially uninterrupted and are resiliently deflected into said standoff space.

Claim 24

Dependent Claim 16 words

A connector as claimed in claim 21, further comprising a protective layer formed over said leads.

Claim 25

Dependent Claim 17 words

A connector as claimed in claim 21, wherein each said post comprises a solid core solder ball.

Claim 26

Dependent Claim 46 words

A connector as claimed in claim 21, wherein said array of contacts and said array of terminal posts are rectilinear arrays having row and column directions, and wherein said terminal posts are offset from said contacts in diagonal directions, oblique to said row and column directions.

Claim 27

Dependent Claim 26 words

A connector as claimed in claim 21, further comprising support posts for further supporting said body, said support posts not being electrically connected to any contact.

Claim 28

Dependent Claim 36 words

A connector as claimed in claim 21, wherein said sheetlike body has an array of holes corresponding to said array of posts, and wherein said terminal posts are electrically connected to said contacts through said holes.

Claim 29

Dependent Claim 30 words

A connector as claimed in claim 26, further comprising a plurality of laminar contact tabs on said first surface of said sheetlike body electrically connecting said contacts and said posts.

Claim 30

Dependent Claim 41 words

A connector as claimed in claim 21, wherein said sheetlike body has a plurality of holes disposed in an array corresponding to said array of contacts, and each said contact extends inwardly over one said hole from said first major surface.

Claim 31

Dependent Claim 24 words

A connector as claimed in claim 28, wherein each said contact includes at least one projection extending over the hole associated with that contact.

Claim 32

Dependent Claim 25 words

A connector as claimed in claim 29, wherein each said contact includes a plurality of projections extending inwardly from circumferentially spaced locations around the hole.

Claim 33

Dependent Claim 155 words

A socket for engaging a bump lead on a microelectronic element, comprising: a resilient, dielectric sheet having first and second major surfaces; an electrically conductive contact secured to said first major surface of said sheet, said contact having an active contact portion, at least a portion of said sheet surrounding said active portion of said contact being at least partially uninterrupted; a supporting substrate having a first surface, said substrate first surface juxtaposed with said sheet second major surface, said substrate having a conductive terminal thereon; and a plurality of posts spaced around said active contact portion, said posts mechanically supporting a portion of said sheet surrounding said contact with respect to said substrate such that there is a gap between said sheet and said substrate, one of said posts electrically connecting said terminal and said contact, whereby said sheet deflects as the bump lead is engaged with the active contact portion of the contact.

Claim 34

Dependent Claim 155 words

A socket for engaging a bump lead on a microelectronic element, comprising: a resilient, dielectric sheet having first and second major surfaces; an electrically conductive contact secured to said first major surface of said sheet, said contact having an active contact portion, at least a portion of said sheet surrounding said active portion of said contact being at least partially uninterrupted; a supporting substrate having a first surface, said substrate first surface juxtaposed with said sheet second major surface, said substrate having a conductive terminal thereon; and a plurality of posts spaced around said active contact portion, said posts mechanically supporting a portion of said sheet surrounding said contact with respect to said substrate such that there is a gap between said sheet and said substrate, one of said posts electrically connecting said terminal and said contact, whereby said sheet deflects as the bump lead is engaged with the active contact portion of the contact.

Claim 35

Dependent Claim 38 words

A socket as claimed in claim 31 wherein an aperture extends between said major surfaces of said sheet, and wherein said active contact portion of said contact is aligned with said aperture and extends partially over said aperture.

Claim 36

Dependent Claim 15 words

A socket as claimed in claim 31, wherein the posts are solid core solder balls.

Claim 37

Dependent Claim 12 words

A socket as claimed in claim 31, wherein the posts are vias.

Claim 38

Dependent Claim 15 words

A socket as claimed in claim 31, wherein said contact comprises a generally laminar contact.

Claim 39

Dependent Claim 46 words

A socket as claimed in claim 31, further comprising a spacer positioned between each of the posts and the first surface of the substrate, said spacer electrically connecting said posts to said terminals, whereby the spacer provides greater vertical height for said deflection of the sheet.

Claim 40

Dependent Claim 26 words

A socket as claimed in claim 36, wherein the spacer includes a laminar substrate having an aperture aligned with the active contact portion of the contact.

Claim 41

Dependent Claim 55 words

A socket as claimed in claim 31, further comprising a second contact and a second plurality of posts mechanically supporting a second portion of said sheet surrounding a second active contact portion of said second contact, wherein said first plurality of posts and said second plurality of posts have at least one post in common.

Claim 42

Dependent Claim 33 words

A socket as claimed in claim 38, wherein the sheet further includes conductive traces secured to said second major surface, said conductive traces electrically interconnecting said first and second contacts on the sheet.

Claim 43

Dependent Claim 119 words

A connector for engaging bump leads on a microelectronic element, comprising: a resilient, dielectric sheet having first and second major surfaces, electrically conductive contacts secured to said first major surface of said sheet, said contacts each having an active contact portion, at least a portion of said sheet surrounding said active portion of said contact being at least partially uninterrupted; a generally rigid substrate having terminals thereon; and a plurality of posts supporting said sheet with respect to said substrate such that a gap is formed therebetween; each said contact being located on an associated portion of said sheet supported by an associated group of posts; wherein groups of posts associated with adjacent contacts share at least one post.

Claim 44

Dependent Claim 119 words

A connector for engaging bump leads on a microelectronic element, comprising: a resilient, dielectric sheet having first and second major surfaces, electrically conductive contacts secured to said first major surface of said sheet, said contacts each having an active contact portion, at least a portion of said sheet surrounding said active portion of said contact being at least partially uninterrupted; a generally rigid substrate having terminals thereon; and a plurality of posts supporting said sheet with respect to said substrate such that a gap is formed therebetween; each said contact being located on an associated portion of said sheet supported by an associated group of posts; wherein groups of posts associated with adjacent contacts share at least one post.

Claim 45

Dependent Claim 14 words

A connector as claimed in claim 40, wherein said contacts comprise generally laminar contacts.

Claim 46

Dependent Claim 15 words

A connector as claimed in claim 41, wherein said bump leads engage said laminar contacts.

Claim 47

Independent Claim 185 words

A method of making connections to a microelectronic element having an array of bump leads thereon, comprising the steps of: (a) providing a connector having a sheetlike body, a substrate, an array of contacts on a first major surface of the sheetlike body, and an array of posts connecting a second major surface of the sheetlike body to a top surface of the substrate, and spacing the sheetlike body away from the substrate, each of the contacts being disposed on a portion of the sheetlike body having at its perimeter two or more of said posts, at least a portion of said sheetlike body surrounding each said contact remote from said posts being at least partially uninterrupted; (b) aligning the microelectronic element with the connector so that the array of contacts is substantially in registration with the array of bump leads; and (c) urging the microelectronic element toward the sheetlike body so that the array of bump leads contacts the array of contacts and each said portion of the sheetlike body is resiliently deflected between two or more of said posts and a bump lead.

Claim 48

Independent Claim 185 words

A method of making connections to a microelectronic element having an array of bump leads thereon, comprising the steps of: (a) providing a connector having a sheetlike body, a substrate, an array of contacts on a first major surface of the sheetlike body, and an array of posts connecting a second major surface of the sheetlike body to a top surface of the substrate, and spacing the sheetlike body away from the substrate, each of the contacts being disposed on a portion of the sheetlike body having at its perimeter two or more of said posts, at least a portion of said sheetlike body surrounding each said contact remote from said posts being at least partially uninterrupted; (b) aligning the microelectronic element with the connector so that the array of contacts is substantially in registration with the array of bump leads; and (c) urging the microelectronic element toward the sheetlike body so that the array of bump leads contacts the array of contacts and each said portion of the sheetlike body is resiliently deflected between two or more of said posts and a bump lead.

Claim 49

Dependent Claim 14 words

A method as claimed in claim 43, wherein said contacts comprise generally laminar contacts.

Claim 50

Dependent Claim 48 words

A method as claimed in claim 43, wherein each said contact is electrically connected to one of said posts, and wherein said posts are electrically connected to leads in said substrate, whereby said urging step makes electrical connections between the bump leads and the leads in the substrate.

Claim 51

Dependent Claim 46 words

A method as claimed in claim 45, further comprising the steps of: (d) electrically testing said microelectronic element through said electrical connections to determine whether said microelectronic element is acceptable; and (e) if said microelectronic element is acceptable, permanently bonding said contacts to said bump leads.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2003-07-11	2004-01-10	2004-07-11	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2007-07-11	2008-01-10	2008-07-11	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2011-07-11	2012-01-10	2012-07-11	$7700.00	Window Closed / Lapsed

Flexible connectors for microelectronic elements

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