Semiconductor package

Claim 2

A semiconductor package comprising: (a) two semiconductor chips, each semiconductor chip having a front surface on which a plurality of bonding pads are formed, and a rear surface opposite the front surface; (b) an insulating circuit film comprising (i) an insulating base film with a plurality of through holes, (ii) a plurality of metal lines formed on upper and lower faces of said base film, said metal lines respectively formed on said upper and lower faces being connected with each other via the through holes, wherein said upper and lower faces face said front surface of each corresponding semiconductor chip, and (iii) means for electrically connecting each of said metal lines with said bonding pads of the corresponding semiconductor chips; (c) a plurality of leads electrically connected with said metal lines and extended to connect to an external device wherein said plurality of leads are part of a lead frame, each lead including an inner lead for connecting outer pads to said external device; and (d) a package body surrounding a predetermined area containing said semiconductor chips, said insulating circuit film and said inner lead of said lead frame, wherein said means for electrically connecting comprises a plurality of protruded, conductive inner pads which are respectively formed on said metal lines, and an anisotropic conductor comprising a resin and conductive particles contained therein, for electrically connecting said inner pads with said bonding pads through said conductor, wherein said metal lines further comprises a plurality of protruded, conductive outer pads which are respectively formed on said metal lines apart by a selected interval from the plurality of inner pads and connected to said plurality of leads, and wherein said plurality of leads include an outer lead exposed at the lower surface of said package body.

Claim 3

The semiconductor package as claimed in claim 1, wherein said metal lines are comprised of Cu, Ni, Au; Cu, Ni, Cr, Au; or Cu, Ni, Co, Au and are each formed with a maximum width of 1 mil.

Claim 4

The semiconductor package as claimed in claim 1, wherein said through holes have a diameter of 10-200 μm.

Claim 5

The semiconductor package as claimed in claim 1, wherein said insulating circuit film, said bonding pads of said semiconductor chips, and said inner leads of said lead frame are electrically connected to one another by means of the anisotropic conductor.

Claim 6

The semiconductor package as claimed in claim 4, wherein said insulating circuit film is preferably 10-100 μm in thickness; and said inner and outer pads have a height of 1-20 μm, and a size of 5 μm×5 μm-200 μm×200 μm.

Claim 7

The semiconductor package as claimed in claim 4, wherein said resin is in liquid or solid states, and is selected from a group comprising: epoxy or transformed epoxy resin; polyester or transformed polymer; acrylic ester or transformed ester; silicon resins; phenoxy resins; polyurethane; polysulfide; cyanoacrylates; polyalexins; and a polymer which is hardened by thermal radiation, ultraviolet radiation, or room temperature.

Claim 8

The semiconductor package as claimed in claim 4, wherein said conductive particles are rectangular, square, triangular, hexahedral, square horn or triangular horn in shape.

Claim 9

The semiconductor package as claimed in claim 4, wherein said conductive particles of said anisotropic conductor have a size of 3-15 μm.

Claim 10

The semiconductor package as claimed in claim 8, wherein said conductive particles are comprised of Ag, Ni, In, Sn, indium tin oxide, or an alloy thereof.

Claim 11

The semiconductor package as claimed in claim 8, wherein said conductive particles are comprised of a metal having an electrical conductivity of 10 -8 Ω/cm.

Claim 12

A semiconductor package comprising: (a) two semiconductor chips, each semiconductor chip having a front surface on which a plurality of bonding pads are formed, and a rear surface opposite the front surface; (b) an insulating circuit film comprising (i) an insulating base film with a plurality of through holes, (ii) a plurality of metal lines formed on upper and lower faces of said base film, said metal lines respectively formed on said upper and lower faces being connected with each other via the through holes, wherein said upper and lower faces face said front surface of each corresponding semiconductor chip, and (iii) means for electrically connecting each of said metal lines with said bonding pads of the corresponding semiconductor chips; (c) a plurality of leads electrically connected with said metal lines and extended to connect to an external device wherein said plurality of leads are part of a lead frame, each lead including an inner lead for connecting outer pads to said external device; and (d) a package body surrounding a predetermined area containing said semiconductor chips, said insulating circuit film and said inner lead of said lead frame, wherein said means for electrically connecting comprises a plurality of protruded, conductive inner pads which are respectively formed an said metal lines, and an anisotropic conductor comprising a resin and conductive particles contained therein, for electrically connecting said inner pads with said bonding pads through said conductor, wherein said metal lines further comprises a plurality of protruded, conductive outer pads which are respectively formed on said metal lines apart by a selected interval from the plurality of inner pads and connected to said plurality of leads, and wherein said plurality of leads include an outer lead exposed at the lower surface of said package body, wherein said insulating circuit film, said bonding pads of said semiconductor chips, and said inner leads of said lead frame are electrically connected to one another by means of the anisotropic conductor, wherein said insulating circuit film is preferably 10-100 μm in thickness, and said inner and outer pads have a height of 1-20 μm, and a size of 5 μm×5 μm-200 μm×200 μm, wherein said inner lead comprises a metal selected from a group comprising Ag, Sn or In, wherein said resin is in liquid or solid states, and is selected from a group comprising: epoxy or transformed epoxy resin; polyester or transformed polymer; acrylic ester or transformed ester; silicon resins; phenoxy resins, polyurethane; polysulfide; cyanoacrylates; polyalexins; and a polymer which is hardened by thermal radiation, ultraviolet radiation, or room temperature, wherein said particles contained in said anisotropic conductor have a size of 3-15 μm, wherein said particles are comprised of Ag, Ni, In, Sn, indium tin oxide, or an alloy thereof, wherein said particles are rectangular, square, triangular, hexahedral, square horn or triangular horn in shape, wherein said metal lines are comprised of Cu, Ni, Au; Cu, Ni, Cr, Au; or Cu, Ni, Co, Au and are formed with a maximum width of 1 mil, and wherein said through holes have a diameter of 10-200 μm.

Claim 13

A semiconductor package comprising: (a) two semiconductor chips, each semiconductor chip having a front surface on which a plurality of bonding pads are formed, and a rear surface opposite the front surface; (b) an insulating circuit film comprising (i) an insulating base film with a plurality of through holes, (ii) a plurality of metal lines formed on upper and lower faces of said base film, said metal lines respectively formed on said upper and lower faces being connected with each other via the through holes, wherein said upper and lower faces face said front surface of each corresponding semiconductor chip, and (iii) means for electrically connecting each of said metal lines with said bonding pads of the corresponding semiconductor chips; (c) a plurality of leads electrically connected with said metal lines and extended to connect to an external device wherein said plurality of leads are part of a lead frame, each lead including an inner lead for connecting outer pads to said external device; and (d) a package body surrounding a predetermined area containing said semiconductor chips, said insulating circuit film and said inner lead of said lead frame, wherein said means for electrically connecting comprises a plurality of protruded, conductive inner pads which are respectively formed an said metal lines, and an anisotropic conductor comprising a resin and conductive particles contained therein, for electrically connecting said inner pads with said bonding pads through said conductor, wherein said metal lines further comprises a plurality of protruded, conductive outer pads which are respectively formed on said metal lines apart by a selected interval from the plurality of inner pads and connected to said plurality of leads, and wherein said plurality of leads include an outer lead exposed at the lower surface of said package body, wherein said insulating circuit film, said bonding pads of said semiconductor chips, and said inner leads of said lead frame are electrically connected to one another by means of the anisotropic conductor, wherein said insulating circuit film is preferably 10-100 μm in thickness, and said inner and outer pads have a height of 1-20 μm, and a size of 5 μm×5 μm-200 μm×200 μm, wherein said inner lead comprises a metal selected from a group comprising Ag, Sn or In, wherein said resin is in liquid or solid states, and is selected from a group comprising: epoxy or transformed epoxy resin; polyester or transformed polymer; acrylic ester or transformed ester; silicon resins; phenoxy resins, polyurethane; polysulfide; cyanoacrylates; polyalexins; and a polymer which is hardened by thermal radiation, ultraviolet radiation, or room temperature, wherein said particles contained in said anisotropic conductor have a size of 3-15 μm, wherein said particles are comprised of Ag, Ni, In, Sn, indium tin oxide, or an alloy thereof, wherein said particles are rectangular, square, triangular, hexahedral, square horn or triangular horn in shape, wherein said metal lines are comprised of Cu, Ni, Au; Cu, Ni, Cr, Au; or Cu, Ni, Co, Au and are formed with a maximum width of 1 mil, and wherein said through holes have a diameter of 10-200 μm.