US6077383A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for separating wafers and process for using said device
Assignee: Commissariat à l'Énergie Atomique et Aux Énergies Alternatives
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Filing: 1997-07-23
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Granted: 2000-06-20
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Expires: 2017-07-23
Abstract
Abstract A device for the separation of wafers bonded by forces of attraction. The device includes at least one assembly of at least two flexible elements whose width in a direction perpendicular to the planes of the wafers is less than the largest gap between the ends of the wafers.
Inventors
- 👤 Philippe LaPorte
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 20:56
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0428; Y; Y10; Y10S; Y10S156/00; Y10S156/934; Y10S156/941; Y10T; Y10T156/00; Y10T156/11; Y10T156/1126; Y10T156/1132; Y10T156/19; Y10T29/00; Y10T29/49; Y10T29/49815; Y10T29/49822; Y10T29/53; Y10T29/53683
Claims Analysis
Total Claims: 44
Claim 1
Independent Claim
106 words
An assembly having a device for separating wafers, comprising: at least a first wafer and a second wafer, said first wafer and said second wafer each having an end, said first wafer being bonded to said second wafer, at least one of said ends of said wafers being a beveled end, said ends of said wafers being spaced from each other by a gap; and a device having at least a first flexible element and a second flexible element, each of said flexible elements having a thickness in a direction perpendicular to a plane of one of said wafers, said thickness being less than said gap.
Claim 2
Dependent Claim
106 words
An assembly having a device for separating wafers, comprising: at least a first wafer and a second wafer, said first wafer and said second wafer each having an end, said first wafer being bonded to said second wafer, at least one of said ends of said wafers being a beveled end, said ends of said wafers being spaced from each other by a gap; and a device having at least a first flexible element and a second flexible element, each of said flexible elements having a thickness in a direction perpendicular to a plane of one of said wafers, said thickness being less than said gap.
Claim 3
Dependent Claim
18 words
The assembly of claim 1, wherein each of said flexible elements has a thickness of approximately 100 μm.
Claim 4
Dependent Claim
17 words
The assembly of claim 1, wherein said gap is less than or equal to approximately 240 μm.
Claim 5
Dependent Claim
26 words
The assembly of claim 3, wherein said gap is approximately 240 μm, and each of said flexible elements has a thickness less than approximately 230 μm.
Claim 6
Dependent Claim
14 words
The assembly of claim 1, wherein each of said ends is a beveled end.
Claim 7
Dependent Claim
12 words
The assembly of claim 1, wherein said flexible elements include thin plates.
Claim 8
Dependent Claim
11 words
The assembly of claim 1, wherein said flexible elements include cylinders.
Claim 9
Dependent Claim
10 words
The assembly of claim 1, further comprising additional flexible elements.
Claim 10
Dependent Claim
20 words
The assembly of claim 1, further comprising a suction device for applying suction to at least one of said wafers.
Claim 11
Dependent Claim
32 words
The assembly of claim 1, wherein said flexible elements are at least partially located in a fairing, said fairing for preventing lateral deformation of at least a portion of said flexible elements.
Claim 12
Dependent Claim
20 words
The assembly of claim 1, wherein at least one of said first and second flexible elements includes a parallelepipedic profile.
Claim 13
Dependent Claim
20 words
The assembly of claim 1, wherein at least one of said first and second flexible elements includes a rounded profile.
Claim 14
Dependent Claim
20 words
The assembly of claim 1, wherein at least one of said first and second flexible elements includes a tapered profile.
Claim 15
Independent Claim
48 words
A device for separating wafers bonded together by forces of attraction, comprising: at least one assembly of at least two flexible elements, each of said flexible elements having a thickness in a direction perpendicular to planes of the bonded wafers, said thickness being less than approximately 230 μm.
Claim 16
Independent Claim
48 words
A device for separating wafers bonded together by forces of attraction, comprising: at least one assembly of at least two flexible elements, each of said flexible elements having a thickness in a direction perpendicular to planes of the bonded wafers, said thickness being less than approximately 230 μm.
Claim 17
Dependent Claim
18 words
The device of claim 14, wherein each of said flexible elements has a thickness of approximately 100 μm.
Claim 18
Dependent Claim
21 words
The device of claim 14, wherein a sum of said thicknesses of said flexible elements is less than approximately 230 μm.
Claim 19
Dependent Claim
12 words
The device of claim 14, wherein said flexible elements include thin plates.
Claim 20
Dependent Claim
11 words
The device of claim 14, wherein said flexible elements include cylinders.
Claim 21
Dependent Claim
10 words
The device of claim 14, further comprising additional flexible elements.
Claim 22
Dependent Claim
20 words
The device of claim 14, further comprising a suction device for applying suction to at least one of said wafers.
Claim 23
Dependent Claim
32 words
The device of claim 14, wherein said flexible elements are at least partially located in a fairing, said fairing for preventing lateral deformation of at least a portion of said flexible elements.
Claim 24
Dependent Claim
17 words
The device of claim 14, wherein at least one of said flexible elements includes a parallelepipedic profile.
Claim 25
Dependent Claim
17 words
The device of claim 14, wherein at least one of said flexible elements includes a rounded profile.
Claim 26
Dependent Claim
17 words
The device of claim 14, wherein at least one of said flexible elements includes a tapered profile.
Claim 27
Independent Claim
42 words
A method of separating bonded wafers, comprising: at least partially separating at least two bonded wafers by inserting between the ends of the at least two bonded wafers at least one flexible element of a device having a plurality of flexible elements.
Claim 28
Independent Claim
42 words
A method of separating bonded wafers, comprising: at least partially separating at least two bonded wafers by inserting between the ends of the at least two bonded wafers at least one flexible element of a device having a plurality of flexible elements.
Claim 29
Dependent Claim
23 words
The method of claim 25, further comprising: maintaining the separation by inserting at least one mechanical element between the at least two wafers.
Claim 30
Dependent Claim
20 words
The method of claim 25, further comprising: maintaining the separation by blowing a gas between the at least two wafers.
Claim 31
Dependent Claim
25 words
The method of claim 25, further comprising: preventing the at least two wafers from rebounding by blowing a gas between the at least two wafers.
Claim 32
Dependent Claim
24 words
The method of claim 25, further comprising: maintaining the separation by moving at least one of the wafers away from another of the wafers.
Claim 33
Dependent Claim
70 words
The method of claim 25, wherein the separating of the at least two bonded wafers occurs at a first location at the ends of the wafers, further comprising: at least partially separating the at least two bonded wafers at a second location at the ends of the wafers by inserting another at least one flexible element between the ends of the at least two bonded wafers at the second location.
Claim 34
Dependent Claim
56 words
The method of claim 25, wherein at least one of the ends of the wafers is a beveled end, the ends of the wafers being spaced from each other by a gap, each of the flexible elements having a thickness in a direction perpendicular to planes of the wafers, the thickness being less than the gap.
Claim 35
Dependent Claim
18 words
The method of claim 31, wherein each of the flexible elements has a thickness of approximately 100 μm.
Claim 36
Dependent Claim
17 words
The method of claim 31, wherein the gap is less than or equal to approximately 240 μm.
Claim 37
Dependent Claim
26 words
The method of claim 31, wherein the gap is approximately 240 μm, and each of the flexible elements has a thickness less than approximately 230 μm.
Claim 38
Dependent Claim
12 words
The method of claim 25, wherein the flexible elements include thin plates.
Claim 39
Dependent Claim
11 words
The method of claim 25, wherein the flexible elements include cylinders.
Claim 40
Independent Claim
32 words
The method of claims 25, wherein the flexible elements are at least partially located in a fairing, the fairing for preventing lateral deformation of at least a portion of the flexible elements.
Claim 41
Dependent Claim
17 words
The method of claim 25, wherein at least one of the flexible elements includes a parallelepipedic profile.
Claim 42
Dependent Claim
17 words
The method of claim 25, wherein at least one of the flexible elements includes a rounded profile.
Claim 43
Dependent Claim
17 words
The method of claim 25, wherein at least one of the flexible elements includes a tapered profile.
Claim 44
Dependent Claim
28 words
The method of claim 25, wherein at least two of the flexible elements of the device are inserted between the ends of the at least two bonded wafers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-20 | 2003-12-20 | 2004-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-20 | 2007-12-20 | 2008-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-20 | 2011-12-20 | 2012-06-20 | $7700.00 | Window Closed / Lapsed |