US5240546A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for peeling semiconductor substrate
Assignee: Sumitomo Electric Industries Ltd
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Filing: 1992-02-24
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Granted: 1993-08-31
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Expires: 2012-02-24
Abstract
Abstract There is disclosed an apparatus for peeling a semiconductor substrate includes an unit for fixing a reinforcing plate bonded to the semiconductor substrate, a mechanism for pushing the semiconductor substrate bonded to the reinforcing plate in a direction parallel to a bonding surface, a unit for monitoring a stress generated by the semiconductor substrate, and a controller for controlling a driving unit of the pushing mechanism of the semiconductor substrate in accordance with the monitored stress.
Inventors
- 👤 Nobuo Shiga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 05:21
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0442; Y; Y10; Y10S; Y10S156/00; Y10S156/934; Y10S156/941; Y10S156/943; Y10S438/00; Y10S438/977; Y10T; Y10T156/00; Y10T156/19; Y10T156/1978; Y10T156/1983
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
80 words
An apparatus for peeling a semiconductor substrate from a reinforcing plate bonded to the semiconductor substrate with an adhesion, comprising: fixing means adapted for fixing the reinforcing plate; pushing means for pushing the semiconductor substrate in a direction substantially parallel to a bonding surface thereby to peel the semiconductor substrate from the reinforcing plate; and monitor means for monitoring a stress generated in the semiconductor substrate in accordance with electrical characteristics of a monitor circuit provided in the semiconductor substrate.
Claim 2
Independent Claim
80 words
An apparatus for peeling a semiconductor substrate from a reinforcing plate bonded to the semiconductor substrate with an adhesion, comprising: fixing means adapted for fixing the reinforcing plate; pushing means for pushing the semiconductor substrate in a direction substantially parallel to a bonding surface thereby to peel the semiconductor substrate from the reinforcing plate; and monitor means for monitoring a stress generated in the semiconductor substrate in accordance with electrical characteristics of a monitor circuit provided in the semiconductor substrate.
Claim 3
Dependent Claim
19 words
An apparatus according to claim 1, wherein said fixing means comprise a heating unit adapted for melting the adhesive.
Claim 4
Dependent Claim
47 words
An apparatus according to claim 1, wherein said fixing means includes a stage adapted for supporting the reinforcing plate and a recessed portion of which depth is not more than a thickness of the reinforcing plate and the adhesion, and adapted for receiving the reinforcing plate therein.
Claim 5
Dependent Claim
35 words
An apparatus according to claim 1, wherein said fixing means includes a stage for supporting the reinforcing plate and a projecting portion of which height is not more than a thickness of the reinforcing plate.
Claim 6
Dependent Claim
35 words
An apparatus according to claim 1, wherein said pushing means comprises a pushing member adapted to be brought into contact with an edge of the semiconductor substrate, and moving means for moving said pushing member.
Claim 7
Dependent Claim
29 words
An apparatus according to claim 5, wherein said pushing member has a flat portion adapted to be brought into contact with an orientation flat portion of said semiconductor substrate.
Claim 8
Dependent Claim
68 words
An apparatus according to claim 1, wherein a monitor semiconductor circuit whose electrical characteristics are changed in accordance with a magnitude of a stress is formed in the semiconductor substrate in advance, and said monitor means comprises a probe adapted to be contacted with terminals of the monitor circuit provided in the semiconductor substrate and a unit for measuring a change in electrical signal output from said probe.
Claim 9
Dependent Claim
23 words
An apparatus according to claim 7, wherein said monitor circuit is a circuit of a test element group formed in the semiconductor substrate.
Claim 10
Dependent Claim
18 words
An apparatus according to claim 7, wherein said monitor circuit comprises an FET formed on the semiconductor substrate.
Claim 11
Dependent Claim
21 words
An apparatus according to claim 5, further comprising a sensor for detecting contact between said pushing member and the semiconductor substrate.
Claim 12
Dependent Claim
66 words
An apparatus according to claim 10, wherein said sensor comprises a light-emitting or light-detecting unit located above a contact position where said pushing member is brought into contact with said semiconductor substrate for the first time, a light-detecting or light-emitting element located below the contact position, and light emitted from said light-emitting unit is non-transparent to said semiconductor substrate but are transparent to said reinforcing plate.
Claim 13
Dependent Claim
96 words
An apparatus according to claim 10, wherein the monitor circuit whose electrical characteristics are changed in accordance with a magnitude of a stress is formed in said semiconductor substrate in advance, and said monitor means comprises a probe adapted to be contacted to the monitor circuit and a unit for measuring a change in electrical signal output from said probe; and further comprising probe descending means for moving said probe downward to contact said probe to the terminals of said monitor circuit when said sensor detects the contact between said pushing member and the semiconductor substrate.
Claim 14
Dependent Claim
34 words
An apparatus according to claim 12, wherein, when the sensor detects the contact between said pushing member and the semiconductor substrate, said pushing member is temporarily stopped and said probe descending means is energized.
Claim 15
Dependent Claim
16 words
An apparatus according to claim 12, wherein said probe is moved together with said pushing member.
Claim 16
Independent Claim
94 words
An apparatus for peeling a semiconductor substrate from a reinforcing plate bonded on the semiconductor substrate with an adhesion, comprising: fixing means adapted for fixing the reinforcing plate; a pushing member adapted to be brought into contact with an edge of the semiconductor substrate, and for moving the semiconductor substrate in a direction substantially parallel to a bonding surface; driving means for driving said pushing member; monitor means for monitoring a stress generated in the semiconductor substrate; and control means for controlling driving of said driving means on the basis of the monitored stress.
Claim 17
Independent Claim
94 words
An apparatus for peeling a semiconductor substrate from a reinforcing plate bonded on the semiconductor substrate with an adhesion, comprising: fixing means adapted for fixing the reinforcing plate; a pushing member adapted to be brought into contact with an edge of the semiconductor substrate, and for moving the semiconductor substrate in a direction substantially parallel to a bonding surface; driving means for driving said pushing member; monitor means for monitoring a stress generated in the semiconductor substrate; and control means for controlling driving of said driving means on the basis of the monitored stress.
Claim 18
Dependent Claim
29 words
An apparatus according to claim 15, wherein said control means controls said driving means so that the stress monitored by said monitoring means does not exceed a predetermined value.
Claim 19
Dependent Claim
46 words
An apparatus according to claim 16, wherein said control means decreases a moving speed of said pushing member when the stress is not less than the predetermined value, and increases the moving speed of said pushing member when the stress is less than the predetermined value.
Claim 20
Independent Claim
94 words
An apparatus for peeling a semiconductor substrate from a reinforcing plate bonded on the semiconductor substrate with an adhesion, comprising: fixing means adapted for fixing the reinforcing plate; a pushing member adapted to be brought into contact with an end face of said semiconductor substrate, for moving said semiconductor substrate in a direction substantially parallel to a bonding surface; driving means for driving said pushing member; monitor means for monitoring a load applied to the semiconductor substrate; and control means for controlling driving of said driving means on the basis of the monitored load.
Claim 21
Independent Claim
94 words
An apparatus for peeling a semiconductor substrate from a reinforcing plate bonded on the semiconductor substrate with an adhesion, comprising: fixing means adapted for fixing the reinforcing plate; a pushing member adapted to be brought into contact with an end face of said semiconductor substrate, for moving said semiconductor substrate in a direction substantially parallel to a bonding surface; driving means for driving said pushing member; monitor means for monitoring a load applied to the semiconductor substrate; and control means for controlling driving of said driving means on the basis of the monitored load.
Claim 22
Dependent Claim
24 words
An apparatus for peeling a semiconductor substrate according to claim 18, wherein said monitor means comprises a load cell attached to a pushing member.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-30 | 1997-03-01 | 1997-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-30 | 2001-03-01 | 2001-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-30 | 2005-03-01 | 2005-08-31 | $7700.00 | Window Closed / Lapsed |