US6071819A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Flexible skin incorporating mems technology
Assignee: California Institute of Technology
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Filing: 1998-01-23
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Granted: 2000-06-06
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Expires: 2018-01-23
Abstract
Abstract A flexible skin formed of silicon islands encapsulated in a polyimide film. The silicon islands preferably include a MEMS device and are connected together by a polyimide film (preferably about 1-100 μm thick). To create the silicon islands, silicon wafers are etched to a desirable thickness (preferably about 10-500 μm) by Si wet etching and then patterned from the back side by reactive ion etching (RIE).
Inventors
- 👤 Yu-Chong Tai
- 👤 Fukang Jiang
- 👤 Chihming Ho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:06
CPC Classifications
B; B81; B81B; B81B7/00; B81B7/0032; B81B7/0077; B81C; B81C1/00; B81C1/00015; B81C1/00222; B81C1/00246; H; H10; H10W; H10W90/00; H10W90/10
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
191 words
A method of manufacturing a flexible microelectronic device comprising: first etching a lower side of a wafer using a first caustic agent; depositing a first layer of aluminum on an upper side of the wafer; patterning the first layer of aluminum; depositing a first layer of polyimide on the upper side of the wafer, covering the first layer of aluminum; depositing a second layer of aluminum on the upper side of the wafer, covering the first layer of polyimide; depositing a second layer of polyimide on the upper side of the wafer, covering the second layer of aluminum; depositing a third layer of aluminum on the lower side of the wafer; patterning the third layer of aluminum; second etching the lower side of the wafer using the third layer of aluminum as a mask and the first layer of aluminum as an etch stop and using a less caustic agent than said first caustic agent, such that the wafer is divided into islands with gaps surrounding each island; and depositing a third layer of polyimide on the lower side of the wafer, such that the gaps are at least partially filled.
Claim 2
Independent Claim
191 words
A method of manufacturing a flexible microelectronic device comprising: first etching a lower side of a wafer using a first caustic agent; depositing a first layer of aluminum on an upper side of the wafer; patterning the first layer of aluminum; depositing a first layer of polyimide on the upper side of the wafer, covering the first layer of aluminum; depositing a second layer of aluminum on the upper side of the wafer, covering the first layer of polyimide; depositing a second layer of polyimide on the upper side of the wafer, covering the second layer of aluminum; depositing a third layer of aluminum on the lower side of the wafer; patterning the third layer of aluminum; second etching the lower side of the wafer using the third layer of aluminum as a mask and the first layer of aluminum as an etch stop and using a less caustic agent than said first caustic agent, such that the wafer is divided into islands with gaps surrounding each island; and depositing a third layer of polyimide on the lower side of the wafer, such that the gaps are at least partially filled.
Claim 3
Dependent Claim
12 words
The method of claim 1 where the first etching is TMAH etching.
Claim 4
Dependent Claim
12 words
The method of claim 1 where the first etching is KOH etching.
Claim 5
Dependent Claim
14 words
The method of claim 1 where the second etching is vertical reactive ion etching.
Claim 6
Dependent Claim
25 words
The method of claim 1 which further comprises forming at least one MEMS device on the upper side of at least one of the islands.
Claim 7
Dependent Claim
18 words
The method of claim 5 where at least one of the MEMS devices is a shear stress sensor.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |