Patent US6071813A successfully refreshed from Google Patents.
US6071813A
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Method and system for electrical coupling to copper interconnects
Assignee: Advanced Micro Devices Inc
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Filing: 1997-10-20
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Granted: 2000-06-06
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Expires: 2017-10-20
Abstract
Abstract A system and method for providing electrical connection to a copper interconnect through a via hole is disclosed. The copper interconnect includes a surface having impurities. The method and system include chemically reducing the copper oxide and removing the carbon atoms at the surface. The chemical etching is performed using a reactive species. The reactive species reacts with the impurities on the surface of the copper interconnect to remove the impurities.
Inventors
- 👤 Takeshi Nogami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:50
CPC Classifications
H; H10; H10P; H10P50/00; H10P50/20; H10P50/28; H10P50/282; H10P50/283; H10W; H10W20/00; H10W20/01; H10W20/031; H10P70/00; H10P70/20; H10P70/27; H10P70/273; Y; Y10; Y10S; Y10S438/00; Y10S438/906
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
77 words
A method for providing electrical connection to a copper interconnect through a via hole, the copper interconnect including a surface having impurities, the method comprising the steps of: causing a reaction between a reactive species in a plasma and the impurities on a portion of the surface of the copper interconnect exposed by the via hole to remove the impurities on the portion of the surface of the copper interconnect; and depositing copper in the via hole.
Claim 2
Independent Claim
77 words
A method for providing electrical connection to a copper interconnect through a via hole, the copper interconnect including a surface having impurities, the method comprising the steps of: causing a reaction between a reactive species in a plasma and the impurities on a portion of the surface of the copper interconnect exposed by the via hole to remove the impurities on the portion of the surface of the copper interconnect; and depositing copper in the via hole.
Claim 3
Dependent Claim
30 words
The method of claim 1 wherein the reaction causing step further comprises the step of: reducing copper oxide and reacting with carbon atoms on the surface of the copper interconnect.
Claim 4
Dependent Claim
13 words
The method of claim 2 wherein the reactive species further comprises hydrogen gas.
Claim 5
Dependent Claim
30 words
The method of claim 1 wherein the reaction causing step further comprises the step of: chemically reducing the copper oxide and removing carbon atoms at the surface of the copper.
References Cited (Backward Citations)
US5395650A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |