US6051448A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing an electronic component
Assignee: Panasonic Holdings Corp
•
Filing: 1997-06-06
•
Granted: 2000-04-18
•
Expires: 2017-06-06
Abstract
Abstract In a method of manufacturing an electronic component for forming a conductor pattern on an insulating substrate by transfer method employing intaglio printing technique, this manufacturing method comprises a step of fabricating an intaglio 20 made of flexible resin forming an insulating layer 23 on a groove 21, a step of filling the groove 21 with Ag paste 24 and drying, a step of overlaying the intaglio 20 on an insulating substrate 2 having a water-soluble resin 28 formed on the surface by pressing a pressing portion 26, freezing, peeling off the intaglio 20 and insulating substrate 2, and transferring the pattern of the Ag paste 24, and a step of firing it and forming a conductor pattern.
Inventors
- 👤 Masaaki Hayama
- 👤 Noboru Mouri
- 👤 Tetsu Murakawa
- 👤 Hayami Matsunaga
- 👤 Masayuki Mizuno
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 08:23
CPC Classifications
H; H01; H01F; H01F41/00; H01F41/02; H01F41/04; H01F41/041; H01F41/043; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/207; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/098; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K1/16; H05K1/165; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K3/46; H05K3/4644; H05K3/4664; H05K3/4667; Y; Y10; Y10S; Y10S438/00; Y10S438/977
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
190 words
A method of manufacturing an electronic component including a conductor pattern on a substrate, comprising the steps of: fabricating an intaglio by forming a groove pattern corresponding to a conductor pattern on a surface of a flexible resin; forming a peeling layer on the surface of the intaglio for the ease of peeling of the substrate and intaglio; filling a groove of the groove pattern with conductive paste; drying the applied conductive paste; repeating a step of refilling with additional conductive paste for compensating for the volume decrease of the conductive paste decreased by the drying step, and a step of re-drying the conductive paste after refilling, by a specific number of times; adhering together the intaglio and substrate, by overlaying the intaglio and the substrate through either one of water and water-soluble resin, and freezing either one of water and water-soluble resin by applying temperature in a predetermined range and pressure in a predetermined range; transferring a pattern of the conductive paste on the substrate by peeling the intaglio from the substrate in frozen state; and forming a conductor pattern by firing the transferred pattern of the conductive paste.
Claim 2
Independent Claim
190 words
A method of manufacturing an electronic component including a conductor pattern on a substrate, comprising the steps of: fabricating an intaglio by forming a groove pattern corresponding to a conductor pattern on a surface of a flexible resin; forming a peeling layer on the surface of the intaglio for the ease of peeling of the substrate and intaglio; filling a groove of the groove pattern with conductive paste; drying the applied conductive paste; repeating a step of refilling with additional conductive paste for compensating for the volume decrease of the conductive paste decreased by the drying step, and a step of re-drying the conductive paste after refilling, by a specific number of times; adhering together the intaglio and substrate, by overlaying the intaglio and the substrate through either one of water and water-soluble resin, and freezing either one of water and water-soluble resin by applying temperature in a predetermined range and pressure in a predetermined range; transferring a pattern of the conductive paste on the substrate by peeling the intaglio from the substrate in frozen state; and forming a conductor pattern by firing the transferred pattern of the conductive paste.
Claim 3
Dependent Claim
32 words
A method of manufacturing an electronic component of claim 1, wherein part of the groove is formed deeper than other parts so as to vary the height of the conductor pattern partly.
Claim 4
Dependent Claim
24 words
A method of manufacturing an electronic component of claim 1, wherein the groove has a sectional shape with a taper angle at the side.
Claim 5
Dependent Claim
25 words
A method of manufacturing an electronic component of claim 1, wherein laser having an oscillation frequency in ultraviolet region is used when forming the groove.
Claim 6
Dependent Claim
16 words
A method of manufacturing an electronic component of claim 4, wherein the laser is excimer laser.
Claim 7
Dependent Claim
23 words
A method of manufacturing an electronic component of claim 1, wherein the peeling layer is composed of a monomolecular film of fluorocarbon compound.
Claim 8
Dependent Claim
17 words
A method of manufacturing an electronic component of claim 1, wherein the conductive paste contains a plasticizer.
Claim 9
Dependent Claim
40 words
A method of manufacturing an electronic component of claim 1, wherein the water-soluble resin is composed of one selected from the group consisting of PVA, polyvinyl acetal, cellulose ether, methyl vinyl ether and maleic acid anhydride copolymer, gelatin, and galactose.
Claim 10
Dependent Claim
29 words
A method of manufacturing an electronic component of claim 1, wherein the substrate is an insulating substrate composed of any one of dielectric material, magnetic material, and insulating material.
Claim 11
Dependent Claim
19 words
A method of manufacturing an electronic component of claim 1, wherein the substrate is formed of a green sheet.
Claim 12
Independent Claim
244 words
A method of manufacturing an electronic component including a conductor pattern on a substrate, comprising the steps of: fabricating an intaglio by forming a groove pattern corresponding to a conductor pattern on a surface of a flexible resin; forming a peeling layer on the surface of the intaglio for the ease of peeling of the substrate and intaglio; filling a groove of the groove pattern with conductive paste; drying the applied conductive paste; repeating a step of refilling with additional conductive paste for compensating for the volume decrease of the conductive paste decreased by the drying step, and a step of re-drying the conductive paste after refilling, by a specific number of times; adhering together the intaglio and substrate, by overlaying the intaglio and the substrate through either one of water and water-soluble resin, and freezing either one of water and water-soluble resin by applying temperature in a predetermined range and pressure in a predetermined range; transferring a pattern of the conductive paste on the substrate by peeling the intaglio from the substrate in frozen state; forming a first conductor pattern by firing the transferred pattern of the conductive paste; forming an insulating layer for covering at least part of the first conductor pattern; forming a second conductor pattern on a surface of the insulating layer; and forming an electrode in an exposed portion of the first conductor pattern from the insulating layer, for electrically connecting the first conductor pattern and second conductor pattern.
Claim 13
Independent Claim
244 words
A method of manufacturing an electronic component including a conductor pattern on a substrate, comprising the steps of: fabricating an intaglio by forming a groove pattern corresponding to a conductor pattern on a surface of a flexible resin; forming a peeling layer on the surface of the intaglio for the ease of peeling of the substrate and intaglio; filling a groove of the groove pattern with conductive paste; drying the applied conductive paste; repeating a step of refilling with additional conductive paste for compensating for the volume decrease of the conductive paste decreased by the drying step, and a step of re-drying the conductive paste after refilling, by a specific number of times; adhering together the intaglio and substrate, by overlaying the intaglio and the substrate through either one of water and water-soluble resin, and freezing either one of water and water-soluble resin by applying temperature in a predetermined range and pressure in a predetermined range; transferring a pattern of the conductive paste on the substrate by peeling the intaglio from the substrate in frozen state; forming a first conductor pattern by firing the transferred pattern of the conductive paste; forming an insulating layer for covering at least part of the first conductor pattern; forming a second conductor pattern on a surface of the insulating layer; and forming an electrode in an exposed portion of the first conductor pattern from the insulating layer, for electrically connecting the first conductor pattern and second conductor pattern.
Claim 14
Dependent Claim
28 words
A method of manufacturing an electronic component of claim 11, wherein a portion formed in a greater height of the first conductor pattern is used as the electrode.
Claim 15
Dependent Claim
40 words
A method of manufacturing an electronic component of claim 12, wherein a portion of the first conductor pattern corresponding to a portion for forming a flat part on the surface of the insulating layer is formed in a lower height.
Claim 16
Dependent Claim
33 words
A method of manufacturing an electronic component of claim 13, further comprising a step of mounting an IC chip with face down in the flat part of the surface of the insulating layer.
Claim 17
Dependent Claim
24 words
A method of manufacturing an electronic component of claim 11, wherein the insulating layer is composed of one of magnetic material and dielectric material.
Claim 18
Dependent Claim
33 words
A method of manufacturing an electronic component of claim 11, wherein part of the groove is formed deeper than other parts so as to vary the height of the first conductor pattern partly.
Claim 19
Dependent Claim
24 words
A method of manufacturing an electronic component of claim 11, wherein the groove has a sectional shape with a taper angle at the side.
Claim 20
Dependent Claim
25 words
A method of manufacturing an electronic component of claim 11, wherein laser having an oscillation frequency in ultraviolet region is used when forming the groove.
Claim 21
Dependent Claim
16 words
A method of manufacturing an electronic component of claim 18, wherein the laser is excimer laser.
Claim 22
Dependent Claim
23 words
A method of manufacturing an electronic component of claim 11, wherein the peeling layer is composed of a monomolecular film of fluorocarbon compound.
Claim 23
Dependent Claim
17 words
A method of manufacturing an electronic component of claim 11, wherein the conductive paste contains a plasticizer.
Claim 24
Dependent Claim
40 words
A method of manufacturing an electronic component of claim 11, wherein the water-soluble resin is composed of one selected from the group consisting of PVA, polyvinyl acetal, cellulose ether, methyl vinyl ether and maleic acid anhydride copolymer, gelatin, and galactose.
Claim 25
Dependent Claim
29 words
A method of manufacturing an electronic component of claim 11, wherein the substrate is an insulating substrate composed of any one of dielectric material, magnetic material, and insulating material.
Claim 26
Dependent Claim
19 words
A method of manufacturing an electronic component of claim 11, wherein the substrate is formed of a green sheet.
References Cited (Backward Citations)
US3621564A
Cited
US3719981A
Cited
US4857482A
Cited
JPH0230140A
Cited
US5106461A
Cited
JPH04221674A
Cited
JPH04240792A
Cited
JPH065608A
Cited
US5546375A
Cited
JPH06124953A
Cited
JPH06267963A
Cited
US5643831A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-18 | 2003-10-18 | 2004-04-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-18 | 2007-10-18 | 2008-04-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-18 | 2011-10-18 | 2012-04-18 | $7700.00 | Window Closed / Lapsed |