US6049129A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip size integrated circuit package
Assignee: Texas Instruments Inc
•
Filing: 1997-12-19
•
Granted: 2000-04-11
•
Expires: 2017-12-19
Abstract
Abstract An integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending to opening (86), a plurality of pads (100) disposed on the first surface (92) and electrically connected with at least one of the routing strips (82), a chip (50) having bonding pads (120) is adhered to the second surface (84) of the substrate (70) and is of substantially the same outline as substrate (70), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and potting material (90) filling the opening (86) is disclosed.
Inventors
- 👤 Chee Kiang Yew
- 👤 Yong Khim Swee
- 👤 Min Yu Chan
- 👤 Pang Hup Ong
- 👤 Anthony Coyle
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:15
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/129; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W72/951; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
123 words
An integrated circuit package comprising: a substrate having an opening, first and second surfaces and an outline; a plurality of routing strips being integral with said substrate; a plurality of pads disposed on said first surface, at least one of said pads being electrically connected with at least one of said routing strips; a chip adhered to said second surface of said substrate, said chip having an outline that is substantially the same as said outline of said substrate, said chip having at least one bonding pad; wire bonding electrically connecting said at least one bonding pad to at least one of said routing strips; and potting material filling said opening to cover said wire bonding and said at least one bonding pad.
Claim 2
Dependent Claim
123 words
An integrated circuit package comprising: a substrate having an opening, first and second surfaces and an outline; a plurality of routing strips being integral with said substrate; a plurality of pads disposed on said first surface, at least one of said pads being electrically connected with at least one of said routing strips; a chip adhered to said second surface of said substrate, said chip having an outline that is substantially the same as said outline of said substrate, said chip having at least one bonding pad; wire bonding electrically connecting said at least one bonding pad to at least one of said routing strips; and potting material filling said opening to cover said wire bonding and said at least one bonding pad.
Claim 3
Dependent Claim
53 words
The integrated circuit package as recited in claim 1 wherein said substrate includes at least one bus bar being integral with said substrate, said at least one bus bar electrically connected to at least one of said bonding pads and at least one said pads disposed on said first surface of said substrate.
Claim 4
Dependent Claim
25 words
The integrated circuit package as recited in claim 2 wherein said at least one bus bar and said routing strips are disposed in said opening.
Claim 5
Dependent Claim
32 words
The integrated circuit package as recited in claim 1 further comprising at least one solder ball disposed on at least one of said pads disposed on said first surface of said substrate.
Claim 6
Dependent Claim
25 words
The integrated circuit package as recited in claim 4 wherein said at least one solder ball is between about 8 and 20 mils in diameter.
Claim 7
Dependent Claim
22 words
The integrated circuit package as recited in claim 4 wherein said at least one solder ball is about 10 mils in diameter.
Claim 8
Dependent Claim
22 words
The integrated circuit package as recited in claim 4 wherein said at least one solder ball is about 15 mils in diameter.
Claim 9
Dependent Claim
21 words
The integrated circuit package as recited in claim 1 wherein said chip has a thickness between about 10 and 20 mils.
Claim 10
Dependent Claim
19 words
The integrated circuit package as recited in claim 1 wherein said chip has a thickness of about 14 mils.
Claim 11
Dependent Claim
28 words
The integrated circuit package as recited in claim 1 wherein said potting material encapsulates said chip and wherein said potting material has a thickness of about 6 mils.
Claim 12
Dependent Claim
22 words
The integrated circuit package as recited in claim 1 wherein said substrate has a thickness of between about 8 and 28 mils.
Claim 13
Dependent Claim
19 words
The integrated circuit package as recited in claim 11 wherein said substrate has a thickness of about 12 mils.
Claim 14
Dependent Claim
40 words
The integrated circuit package as recited in claim 11 wherein said substrate has first and second layers and wherein said first layer has a thickness of about 12 mils and said second layer has a thickness of about 8 mils.
Claim 15
Dependent Claim
51 words
The integrated circuit package as recited in claim 11 wherein said substrate has first, second and third layers and wherein said first layer has a thickness of about 12 mils, said second layer has a thickness of about 8 mils and said third layer has a thickness of about 8 mils.
Claim 16
Dependent Claim
24 words
The integrated circuit package as recited in claim 1 wherein the overall profile of said package is between about 40 mils and 50 mils.
Claim 17
Dependent Claim
19 words
The integrated circuit package as recited in claim 1 wherein the profile of said package is about 41 mils.
Claim 18
Dependent Claim
19 words
The integrated circuit package as recited in claim 1 wherein the profile of said package is about 44 mils.
Claim 19
Dependent Claim
19 words
The integrated circuit package as recited in claim 1 wherein the profile of said package is about 47 mils.
Claim 20
Dependent Claim
19 words
The integrated circuit package as recited in claim 1 wherein the profile of said package is about 50 mils.
Claim 21
Dependent Claim
184 words
An integrated circuit package comprising: a substrate having an opening, first and second surfaces and an outline; a plurality of routing strips being integral with said substrate; a plurality of pads disposed on said first surface, at least one of said pads being electrically connected with at least one of said routing strips; a chip adhered to said second surface of said substrate, said chip having an outline that is substantially the same as said outline of said substrate, said chip having at least one bonding pad; wire bonding electrically connecting said at least one bonding pad to at least one of said routing strips; at least one bus bar being integral with said substrate, said at least one bus bar electrically connected to at least one of said bonding pads and at least one said pads disposed on said first surface of said substrate; potting material filling said opening to cover said wire bonding and said at least one bonding pad; and at least one solder ball disposed on at least one of said pads disposed on said first surface of said substrate.
Claim 22
Dependent Claim
184 words
An integrated circuit package comprising: a substrate having an opening, first and second surfaces and an outline; a plurality of routing strips being integral with said substrate; a plurality of pads disposed on said first surface, at least one of said pads being electrically connected with at least one of said routing strips; a chip adhered to said second surface of said substrate, said chip having an outline that is substantially the same as said outline of said substrate, said chip having at least one bonding pad; wire bonding electrically connecting said at least one bonding pad to at least one of said routing strips; at least one bus bar being integral with said substrate, said at least one bus bar electrically connected to at least one of said bonding pads and at least one said pads disposed on said first surface of said substrate; potting material filling said opening to cover said wire bonding and said at least one bonding pad; and at least one solder ball disposed on at least one of said pads disposed on said first surface of said substrate.
Claim 23
Dependent Claim
25 words
The integrated circuit package as recited in claim 20 wherein said at least one bus bar and said routing strips are disposed in said opening.
Claim 24
Dependent Claim
25 words
The integrated circuit package as recited in claim 20 wherein said at least one solder ball is between about 8 and 20 mils in diameter.
Claim 25
Dependent Claim
22 words
The integrated circuit package as recited in claim 22 wherein said at least one solder ball is about 10 mils in diameter.
Claim 26
Dependent Claim
22 words
The integrated circuit package as recited in claim 22 wherein said at least one solder ball is about 15 mils in diameter.
Claim 27
Dependent Claim
21 words
The integrated circuit package as recited in claim 20 wherein said chip has a thickness between about 10 and 20 mils.
Claim 28
Dependent Claim
19 words
The integrated circuit package as recited in claim 20 wherein said chip has a thickness of about 14 mils.
Claim 29
Dependent Claim
28 words
The integrated circuit package as recited in claim 20 wherein said potting material encapsulates said chip and wherein said potting material has a thickness of about 6 mils.
Claim 30
Dependent Claim
22 words
The integrated circuit package as recited in claim 20 wherein said substrate has a thickness of between about 8 and 28 mils.
Claim 31
Dependent Claim
19 words
The integrated circuit package as recited in claim 28 wherein said substrate has a thickness of about 12 mils.
Claim 32
Dependent Claim
40 words
The integrated circuit package as recited in claim 28 wherein said substrate has first and second layers and wherein said first layer has a thickness of about 12 mils and said second layer has a thickness of about 8 mils.
Claim 33
Dependent Claim
51 words
The integrated circuit package as recited in claim 28 wherein said substrate has first, second and third layers and wherein said first layer has a thickness of about 12 mils, said second layer has a thickness of about 8 mils and said third layer has a thickness of about 8 mils.
Claim 34
Dependent Claim
24 words
The integrated circuit package as recited in claim 20 wherein the overall profile of said package is between about 40 mils and 50 mils.
Claim 35
Dependent Claim
19 words
The integrated circuit package as recited in claim 20 wherein the profile of said package is about 41 mils.
Claim 36
Dependent Claim
19 words
The integrated circuit package as recited in claim 20 wherein the profile of said package is about 44 mils.
Claim 37
Dependent Claim
19 words
The integrated circuit package as recited in claim 20 wherein the profile of said package is about 47 mils.
Claim 38
Dependent Claim
19 words
The integrated circuit package as recited in claim 20 wherein the profile of said package is about 50 mils.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-11 | 2003-10-11 | 2004-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-11 | 2007-10-11 | 2008-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-11 | 2011-10-11 | 2012-04-11 | $7700.00 | Window Closed / Lapsed |