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US6048790A
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US
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Metalorganic decomposition deposition of thin conductive films on integrated circuits using reducing ambient
Assignee: GlobalFoundries Inc
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Filing: 1998-07-10
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Granted: 2000-04-11
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Expires: 2018-07-10
Abstract
Abstract A method for depositing conductive material inside openings within an integrated circuit uses chemical solution deposition. The method includes applying the integrated circuit having the openings with a metalorganic decomposition precursor. The metalorganic decomposition precursor on the integrated circuit is pyrolyzed in a reducing ambient to form a layer of conductive material. For example, if the reducing ambient includes one of hydrogen gas, or a hydrogen and nitrogen gas mix, reactive hydrogen, or ultra high vacuum substantially devoid of oxygen, a conductive layer of metal forms from pyrolyzing the metalorganic decomposition precursor in such a reducing ambient. If the reducing ambient includes reactive nitrogen, a conductive layer of metal nitride forms from pyrolyzing the metalorganic decomposition precursor in such a reducing ambient. The present invention which uses metalorganic decomposition precursors which are chemical solutions with high wetability may be used to particular advantage for depositing a barrier layer and copper within small geometry openings for metal interconnects.
Inventors
- 👤 John A. Iacoponi
- 👤 Eric N. Paton
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 02:40
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/02; C23C18/06; H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/071; H10W20/081; H10W20/084
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
101 words
A method for depositing a layer of conductive material on an integrated circuit, the method including the steps of: A. coating the integrated circuit with a liquid metalorganic decomposition precursor, wherein said metalorganic decomposition precursor is comprised as a liquid solution that is coated on the integrated circuit; and B. pyrolyzing the liquid metalorganic decomposition precursor coated on the integrated circuit in a reducing ambient having at least one reducing chemical agent to form the layer of conductive material from chemical reduction of said liquid metalorganic decomposition precursor coated on the integrated circuit with said at least one reducing chemical agent.
Claim 2
Independent Claim
101 words
A method for depositing a layer of conductive material on an integrated circuit, the method including the steps of: A. coating the integrated circuit with a liquid metalorganic decomposition precursor, wherein said metalorganic decomposition precursor is comprised as a liquid solution that is coated on the integrated circuit; and B. pyrolyzing the liquid metalorganic decomposition precursor coated on the integrated circuit in a reducing ambient having at least one reducing chemical agent to form the layer of conductive material from chemical reduction of said liquid metalorganic decomposition precursor coated on the integrated circuit with said at least one reducing chemical agent.
Claim 3
Dependent Claim
79 words
The method of claim 1, wherein the liquid metalorganic decomposition precursor is a titanium metalorganic decomposition precursor, and wherein step B further includes a step of pyrolyzing the titanium metalorganic decomposition precursor in the reducing ambient having selected at least one of hydrogen gas, a hydrogen and nitrogen gas mix, reactive hydrogen, as said reducing chemical agent, and an ultra high vacuum substantially devoid of oxygen, to form a layer of titanium metal as the layer of conductive material.
Claim 4
Dependent Claim
57 words
The method of claim 1, wherein the liquid metalorganic decomposition precursor is a titanium metalorganic decomposition precursor, and wherein step B further includes a step of pyrolyzing the titanium metalorganic decomposition precursor in the reducing ambient having reactive nitrogen, as said reducing chemical agent, to form a layer of titanium nitride as the layer of conductive material.
Claim 5
Dependent Claim
79 words
The method of claim 1, wherein the liquid metalorganic decomposition precursor is a tantalum metalorganic decomposition precursor, and wherein step B further includes a step of pyrolyzing the tantalum metalorganic decomposition precursor in the reducing ambient having selected at least one of hydrogen gas, a hydrogen and nitrogen gas mix, reactive hydrogen, as said reducing chemical agent, and an ultra high vacuum substantially devoid of oxygen, to form a layer of tantalum metal as the layer of conductive material.
Claim 6
Dependent Claim
57 words
The method of claim 1, wherein the liquid metalorganic decomposition precursor is a tantalum metalorganic decomposition precursor, and wherein step B further includes a step of pyrolyzing the tantalum metalorganic decomposition precursor in the reducing ambient having reactive nitrogen, as said reducing chemical agent, to form a layer of tantalum nitride as the layer of conductive material.
Claim 7
Dependent Claim
38 words
The method of claim 1, wherein step A includes the step of: applying the liquid metalorganic precursor onto the integrated circuit while the integrated circuit is spinning for improved uniformity in the application of the liquid metalorganic precursor.
Claim 8
Dependent Claim
25 words
The method of claim 6, wherein the liquid metalorganic decomposition precursor is applied by one of a liquid dispense process or an atomized spray process.
Claim 9
Dependent Claim
33 words
The method of claim 6, wherein step A further includes the steps of: heating up the temperature of the integrated circuit; and blanketing the integrated circuit with an inert ambient to prevent oxidation.
Claim 10
Dependent Claim
51 words
The method of claim 1, wherein the layer of conductive material is a barrier layer deposited in an opening formed for a conductive interconnect, and wherein the method further includes the steps of: filling the opening with a conductive fill material after the barrier layer has been deposited inside the opening.
Claim 11
Dependent Claim
25 words
The method of claim 9, wherein the conductive fill material is copper that is deposited from a liquid metalorganic decomposition deposition using a copper precursor.
References Cited (Backward Citations)
US5866205A
Cited
US5924012A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-11 | 2003-10-11 | 2004-04-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-11 | 2007-10-11 | 2008-04-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-11 | 2011-10-11 | 2012-04-11 | $7700.00 | Window Closed / Lapsed |