Patent US6046496A successfully refreshed from Google Patents.
US6046496A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Chip package
Assignee: Micron Technology Inc
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Filing: 1997-11-04
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Granted: 2000-04-04
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Expires: 2017-11-04
Abstract
Abstract The present invention relates to a heat management structure within a chip package that allows for heat rejection away from a chip but that avoids the prior art problems of thermal stresses caused by dissimilar thermal conductivities of a heat management structure and of creating a thermally unbalanced package due to disparate distribution of packaging plastic. In an embodiment of the present invention a package includes a chip, leads on the chip, a die attach, a downset, a packaging plastic, and an outer structure among others. The outer structure, downset, and die attach are together a substantially unitary article. Achieving a balanced package that substantially resists warpage and bowing during ordinary manufacture and ordinary use in the life of the package is accomplished by balancing packaging material width and the ability of the downset to resist warpage and bowing stresses. A substantial portion of the outer structure is exposed to the external part of the package in the surface which includes the packaging lower edge. Alternatively, the downset can include a part of the external boundary of the package such that exposure of the downset to the external portion of the package allows for additional heat rejection away from the chip in addition to the use of the outer structure.
Inventors
- 👤 David Corisis
- 👤 Walter Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:07
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/461; H10W40/00; H10W40/70; H10W40/77; H10W40/778
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
77 words
A chip package comprising: a single piece of material that includes: a die attach structure; an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure; and at least one downset connecting said die attach structure and said outer structure a die disposed upon said die attach structure; a packaging material encapsulating said die, said die attach structure, and said at least one downset.
Claim 2
Dependent Claim
77 words
A chip package comprising: a single piece of material that includes: a die attach structure; an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure; and at least one downset connecting said die attach structure and said outer structure a die disposed upon said die attach structure; a packaging material encapsulating said die, said die attach structure, and said at least one downset.
Claim 3
Dependent Claim
18 words
A chip package according to claim 1, wherein said packaging material covers one side of said outer structure.
Claim 4
Dependent Claim
20 words
A chip package according to claim 1, wherein said packaging material is selected from the group consisting of thermoset plastics.
Claim 5
Dependent Claim
30 words
A chip package according to claim 3, wherein said packaging material encapsulates said die, said die attach structure, said at least one downset, and one side of said outer structure.
Claim 6
Dependent Claim
17 words
A chip package according to claim 1, wherein said packaging material fills said at least one opening.
Claim 7
Dependent Claim
33 words
A chip package according to claim 5, wherein said packaging material encapsulates said die, said die attach structure, one side of said at least one downset, and one side of said outer structure.
Claim 8
Dependent Claim
27 words
A chip package according to claim 1, wherein said packaging material has a first thickness above said die and a second thickness beneath said die attach structure.
Claim 9
Dependent Claim
17 words
A chip package according to claim 7, wherein said first thickness is greater than said second thickness.
Claim 10
Dependent Claim
18 words
A chip package according to claim 7, wherein said first thickness is the same as said second thickness.
Claim 11
Dependent Claim
17 words
A chip package according to claim 7, wherein said first thickness is less than said second thickness.
Claim 12
Dependent Claim
16 words
A chip package according to claim 1, wherein said die attach structure has a rectangular shape.
Claim 13
Dependent Claim
41 words
A chip package according to claim 11, wherein said rectangular shape includes a first side opposite to a third side and that are the same length and a second side opposite to a fourth side and that are the same length.
Claim 14
Dependent Claim
23 words
A chip package according to claim 11, wherein said first side has a length that is greater than that of said second side.
Claim 15
Dependent Claim
53 words
A chip package according to claim 1, wherein said packaging material encapsulating said die, said die attach structure, said downset, and covering one side of said outer structure forms at least one package wall, and wherein said at least one opening is situated between said die and said at least one package wall.
Claim 16
Dependent Claim
124 words
A chip package comprising: a single piece of material that includes: a die attach structure; an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure; and at least one downset connecting said die attach structure and said outer structure a die disposed upon said die attach structure; and a packaging material composed of thermoplastics, filling said at least one opening, and forming at least one package wall, wherein said at least one opening is situated between said die and said at least one package wall, said packaging material covering one side of said of the outer structure and encapsulating said die, said die attach structure, said at least one downset.
Claim 17
Dependent Claim
124 words
A chip package comprising: a single piece of material that includes: a die attach structure; an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure; and at least one downset connecting said die attach structure and said outer structure a die disposed upon said die attach structure; and a packaging material composed of thermoplastics, filling said at least one opening, and forming at least one package wall, wherein said at least one opening is situated between said die and said at least one package wall, said packaging material covering one side of said of the outer structure and encapsulating said die, said die attach structure, said at least one downset.
Claim 18
Dependent Claim
19 words
A chip package according to claim 15, wherein said die attach structure has a rectangular shape in cross section.
Claim 19
Dependent Claim
41 words
A chip package according to claim 16, wherein said rectangular shape includes a first side opposite to a third side and that are the same length and a second side opposite to a fourth side and that are the same length.
Claim 20
Dependent Claim
23 words
A chip package according to claim 17, wherein said first side has a length that is greater than that of said second side.
Claim 21
Dependent Claim
27 words
A chip package according to claim 15, wherein said packaging material has a first thickness above said die and a second thickness beneath said die attach structure.
Claim 22
Dependent Claim
17 words
A chip package according to claim 19, wherein said first thickness is greater than said second thickness.
Claim 23
Dependent Claim
18 words
A chip package according to claim 19, wherein said first thickness is the same as said second thickness.
Claim 24
Dependent Claim
171 words
A chip package comprising: a single piece of material that includes: a die attach structure having a rectangular shape in cross section that includes a first side opposite to a third side that are the same length and a second side opposite to a fourth side and that are the same length, wherein the first length is greater than the second length; an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure; and at least one downset connecting said die attach structure and said outer structure a die disposed upon said die attach structure; and a packaging material composed of thermoplastics, filling said at least one opening, and forming at least one package wall, wherein said at least one opening is situated between said die and said at least one package wall, said packaging material covering one side of said of the outer structure and encapsulating said die, said die attach structure, said at least one downset.
Claim 25
Dependent Claim
171 words
A chip package comprising: a single piece of material that includes: a die attach structure having a rectangular shape in cross section that includes a first side opposite to a third side that are the same length and a second side opposite to a fourth side and that are the same length, wherein the first length is greater than the second length; an outer structure surrounding said die attach structure, wherein there is at least one opening between said die attach structure and said outer structure; and at least one downset connecting said die attach structure and said outer structure a die disposed upon said die attach structure; and a packaging material composed of thermoplastics, filling said at least one opening, and forming at least one package wall, wherein said at least one opening is situated between said die and said at least one package wall, said packaging material covering one side of said of the outer structure and encapsulating said die, said die attach structure, said at least one downset.
Claim 26
Dependent Claim
27 words
A chip package according to claim 21, wherein said packaging material has a first thickness above said die and a second thickness beneath said die attach structure.
Claim 27
Dependent Claim
17 words
A chip package according to claim 22, wherein said first thickness is greater than said second thickness.
Claim 28
Dependent Claim
18 words
A chip package according to claim 22, wherein said first thickness is the same as said second thickness.
Claim 29
Dependent Claim
17 words
A chip package according to claim 22, wherein said first thickness is less than said second thickness.
Claim 30
Dependent Claim
19 words
The chip package as defined in claim 1, wherein the single piece of a material has a homogeneous composition.
Claim 31
Dependent Claim
17 words
The chip package as defined in claim 1, further comprising: a lead frame disposed around said die.
Claim 32
Dependent Claim
39 words
The chip package as defined in claim 1, further comprising a number of leads in electrical communication with said die, wherein said at least one downset includes a number of downsets not less than the number of said leads.
Claim 33
Dependent Claim
19 words
The chip package as defined in claim 15, wherein the single piece of a material has a homogeneous composition.
Claim 34
Dependent Claim
17 words
The chip package as defined in claim 15, further comprising: a lead frame disposed around said die.
Claim 35
Dependent Claim
39 words
The chip package as defined in claim 15, further comprising a number of leads in electrical communication with said die, wherein said at least one downset includes a number of downsets not less than the number of said leads.
Claim 36
Dependent Claim
19 words
The chip package as defined in claim 22, wherein the single piece of a material has a homogeneous composition.
Claim 37
Dependent Claim
17 words
The chip package as defined in claim 15, further comprising: a lead frame disposed around said die.
Claim 38
Dependent Claim
39 words
The chip package as defined in claim 15, further comprising a number of leads in electrical communication with said die, wherein said at least one downset includes a number of downsets not less than the number of said leads.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-04 | 2003-10-04 | 2004-04-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-04 | 2007-10-04 | 2008-04-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-04 | 2011-10-04 | 2012-04-04 | $7700.00 | Window Closed / Lapsed |