US6041270A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Automatic recipe adjust and download based on process control window
Assignee: GlobalFoundries Inc
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Filing: 1997-12-05
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Granted: 2000-03-21
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Expires: 2017-12-05
Abstract
Abstract A method of manufacturing semiconductor wafers using a simulation tool to determine a set of predicted wafer electrical test measurements that are compared to a set of target wafer electrical test measurements to obtain a set of optimized process parameters for the equipment for the next process. The optimized process parameters are compared to the equipment characteristics for the equipment of the next process and the process parameters for the next process are automatically adjusted.
Inventors
- 👤 Paul J. Steffan
- 👤 Ming Chun Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 09:16
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70483; G03F7/70605; G03F7/70616; G03F7/70625; H; H10; H10P; H10P74/00; H10P74/23
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
128 words
A method of manufacturing semiconductor wafers, the method comprising: starting a wafer lot in a first process of a manufacturing process; setting process parameters for the first process and running the first process; measuring in-line critical dimensions after completion of the first process and determining a set of predicted wafer electrical test measurement; comparing the set of predicted wafer electrical test measurements with a set of target wafer electrical test measurements and determining a set of optimized process parameters for equipment for a next process; comparing the set of optimized process parameters for the next process with a set of equipment characteristics and adjusting a set of process parameters for the next process; and downloading the adjusted set of process parameters into the equipment for the next process.
Claim 2
Independent Claim
128 words
A method of manufacturing semiconductor wafers, the method comprising: starting a wafer lot in a first process of a manufacturing process; setting process parameters for the first process and running the first process; measuring in-line critical dimensions after completion of the first process and determining a set of predicted wafer electrical test measurement; comparing the set of predicted wafer electrical test measurements with a set of target wafer electrical test measurements and determining a set of optimized process parameters for equipment for a next process; comparing the set of optimized process parameters for the next process with a set of equipment characteristics and adjusting a set of process parameters for the next process; and downloading the adjusted set of process parameters into the equipment for the next process.
Claim 3
Dependent Claim
28 words
The method of claim 1 wherein the set of equipment characteristics for each process are updated to reflect current performance characteristics of the process equipment for each process.
Claim 4
Dependent Claim
76 words
The method of claim 2 wherein the step of determining predicted wafer electrical test measurements comprises combining: in-line critical dimensions from previous processes run on the wafer lot; data from previous lots for processes to be run subsequent to the process being run on the wafer lot; and calibration simulation data obtained from a comparison of the predicted wafer electrical test measurements and collected actual wafer electrical test measurements taken from previous wafer electrical test measurements.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-21 | 2003-09-20 | 2004-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-21 | 2007-09-20 | 2008-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-21 | 2011-09-20 | 2012-03-21 | $7700.00 | Window Closed / Lapsed |