Patent US6028358A successfully refreshed from Google Patents.
US6028358A
Expired / Lapsed
US
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Package for a semiconductor device and a semiconductor device
Assignee: NEC Electronics Corp
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Filing: 1997-05-30
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Granted: 2000-02-22
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Expires: 2017-05-30
Abstract
Abstract A semiconductor package and semiconductor device are provided which enable manufacturing of same with ease of inspection, good reliability, and good thermal characteristics. An insulator made of an organic material and a wiring pattern formed by a metallic foil are formed on top of a metallic base substrate, thereby forming a laminated structure. The metallic base substrate has a plurality of electrically insulated continuity checking terminals. The metallic base substrate, the continuity checking terminals, and the wiring pattern are connected by via holes which pass through the insulator at prescribed locations. The insulator and wiring pattern is removed at a prescribed location at which a semiconductor chip is to be mounted. The exposed metallic base substrate is formed as a cavity of a prescribed depth.
Inventors
- 👤 Katsunobu Suzuki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:28
CPC Classifications
H; H10; H10P; H10P74/00; H10P74/27; H10P74/273; H10W; H10W74/00; H10W74/01; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W72/00; H10W72/071; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W90/701; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H10W72/072; H10W72/07251; H10W72/075; H10W72/07551; H10W72/07554; H10W72/20; H10W72/50; H10W72/541; H10W72/547; H10W72/851; H10W72/874; H10W72/884; H10W90/721; H10W90/722; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
141 words
A semiconductor device package comprises a multilayer laminated substrate comprising a metallic base substrate around a semiconductor chip, an insulation layer and a metallic film layer having a configuration formed in a predeterminedly designed wiring pattern, and wherein at least one continuity checking terminal is provided at a portion of said metallic base substrate in said multi-layer laminated substrate and opposite to a part of said wiring pattern, said continuity checking terminal being separated from said metallic base substrate and also being electrically insulated from said metallic base substrate, further wherein at least one solder ball is provided on a surface of said wiring pattern which is a reverse side of a surface thereof being opposite to said metallic base substrate, and at a point on said wiring pattern opposite to a point at which said continuity checking terminal is provided.
Claim 2
Dependent Claim
141 words
A semiconductor device package comprises a multilayer laminated substrate comprising a metallic base substrate around a semiconductor chip, an insulation layer and a metallic film layer having a configuration formed in a predeterminedly designed wiring pattern, and wherein at least one continuity checking terminal is provided at a portion of said metallic base substrate in said multi-layer laminated substrate and opposite to a part of said wiring pattern, said continuity checking terminal being separated from said metallic base substrate and also being electrically insulated from said metallic base substrate, further wherein at least one solder ball is provided on a surface of said wiring pattern which is a reverse side of a surface thereof being opposite to said metallic base substrate, and at a point on said wiring pattern opposite to a point at which said continuity checking terminal is provided.
Claim 3
Dependent Claim
29 words
A semiconductor device package according to claim 1, wherein said continuity checking terminal is formed with said wiring pattern so as to be flexible to said metallic base substrate.
Claim 4
Dependent Claim
35 words
A semiconductor device package according to claim 1, wherein said continuity checking terminal and a predetermined part of said wiring pattern are connected to each other through a via hole provided in said insulation layer.
Claim 5
Dependent Claim
47 words
A semiconductor device package according to claim 1, wherein at least a part of said wiring pattern is connected to at least one of connecting pad formed on said semiconductor chip which is mounted on a surface of said metallic base substrate through a suitable connecting means.
Claim 6
Dependent Claim
29 words
A semiconductor device package according to claim 4, wherein said semiconductor chip, said connecting means and a part of said wiring pattern are sealed with a suitable sealing material.
Claim 7
Dependent Claim
27 words
A semiconductor package according to claim 1, wherein a part for mounting said semiconductor chip is flat and on the same plane as said metallic base substrate.
Claim 8
Dependent Claim
28 words
A semiconductor package according to claim 1, wherein a part for mounting said semiconductor chip has a depression formed therein, said semiconductor chip being mounted within said depression.
Claim 9
Dependent Claim
48 words
A semiconductor package according to claim 1, wherein a connection between a mounted semiconductor chip and said package is made by a method selected from a wire bonding method, a solder ball method in which a solder ball is formed on said semiconductor chip, and a flip-chip method.
Claim 10
Dependent Claim
34 words
A semiconductor package according to claim 1, wherein said semiconductor chip mounting part and said semiconductor chip are connected and mounted by using either a low-melting-point metal or a resin containing an organic metal.
Claim 11
Dependent Claim
15 words
A semiconductor package according to claim 1, wherein said sealing material is an organic resin.
Claim 12
Dependent Claim
23 words
A semiconductor package according to claim 1, wherein said metallic base substrate and metallic foil layer are made of either copper or aluminum.
Claim 13
Dependent Claim
31 words
A semiconductor device package according to claim 1, wherein on said chip mounting portion to which a semiconductor chip is mounted, no insulation layer and no metallic film layer is provided.
Claim 14
Dependent Claim
19 words
A semiconductor device package according to claim 1, wherein a mounting material is provided on said chip mounting portion.
Claim 15
Dependent Claim
61 words
A semiconductor device which comprises a plurality of said semiconductor device packages as defined by the claim 1, and each of which being stacked to each other one on other so that a continuity checking terminal of one semiconductor device package is mutually connected to a solder ball formed on another semiconductor device package which is stacked over the former one.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-02-21 | 2003-08-23 | 2004-02-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-02-21 | 2007-08-23 | 2008-02-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-02-21 | 2011-08-23 | 2012-02-22 | $7700.00 | Window Closed / Lapsed |